Patents by Inventor Satoshi Morikami
Satoshi Morikami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9624596Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: GrantFiled: June 13, 2016Date of Patent: April 18, 2017Assignee: EBARA CORPORATIONInventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
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Patent number: 9593430Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: GrantFiled: June 13, 2016Date of Patent: March 14, 2017Assignee: EBARA CORPORATIONInventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
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Patent number: 9506162Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: GrantFiled: June 13, 2016Date of Patent: November 29, 2016Assignee: Ebara CorporationInventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
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Publication number: 20160319454Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: ApplicationFiled: June 13, 2016Publication date: November 3, 2016Inventors: Junichiro YOSHIOKA, Kuniaki HORIE, Yugang GUO, Satoshi MORIKAMI
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Publication number: 20160319455Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: ApplicationFiled: June 13, 2016Publication date: November 3, 2016Inventors: Junichiro YOSHIOKA, Kuniaki HORIE, Yugang GUO, Satoshi MORIKAMI
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Publication number: 20160319456Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: ApplicationFiled: June 13, 2016Publication date: November 3, 2016Inventors: Junichiro YOSHIOKA, Kuniaki HORIE, Yugang GUO, Satoshi MORIKAMI
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Patent number: 9388505Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: GrantFiled: December 10, 2014Date of Patent: July 12, 2016Assignee: Ebara CorporationInventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
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Publication number: 20150136610Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: ApplicationFiled: December 10, 2014Publication date: May 21, 2015Inventors: Junichiro YOSHIOKA, Kuniaki HORIE, Yugang GUO, Satoshi MORIKAMI
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Patent number: 8936705Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: GrantFiled: November 26, 2012Date of Patent: January 20, 2015Assignee: Ebara CorporationInventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
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Patent number: 8337680Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: GrantFiled: January 31, 2011Date of Patent: December 25, 2012Assignee: Ebara CorporationInventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
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Publication number: 20110127159Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: ApplicationFiled: January 31, 2011Publication date: June 2, 2011Inventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
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Patent number: 7901551Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: GrantFiled: September 4, 2009Date of Patent: March 8, 2011Assignee: Ebara CorporationInventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
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Publication number: 20100000858Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: ApplicationFiled: September 4, 2009Publication date: January 7, 2010Inventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
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Patent number: 7601248Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.Type: GrantFiled: June 20, 2003Date of Patent: October 13, 2009Assignee: Ebara CorporationInventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
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Publication number: 20050014368Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of it easily and securely, and also a plating apparatus provided with the substrate holder. A substrate holder (18), includes: a fixed holding member (54) and a movable holding member (58) for holding a substrate (W) therebetween; a sealing member (68) mounted to the fixed holding member (54) or the movable holding member (58); and a suction pad (94) for attracting a back surface of the substrate (W) held between the fixed holding member (54) and the movable holding member (58).Type: ApplicationFiled: June 20, 2003Publication date: January 20, 2005Inventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
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Publication number: 20040258848Abstract: A method for processing a substrate having a metal layer formed on a surface of the substrate is set forth. The method first preprocesses a surface of the metal layer, deposits a protective film selectively on a surface of the metal layer by an electroless plating process, cleans the substrate after depositing the protective film, and dries the substrate after cleaning. These processes are repeated a plurality of times to process a plurality of substrate. The deposition rate in the deposition process is 10˜600 Å/min, and a variance of deposition rate for the plurality of substrate is controlled within ±10%.Type: ApplicationFiled: May 21, 2004Publication date: December 23, 2004Inventors: Akira Fukunaga, Daisuke Takagi, Satoshi Morikami