Patents by Inventor Satoshi NISHINOHARA

Satoshi NISHINOHARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed wiring board, printed wiring board manufacturing method, and electronic device
    Patent number: 9549473
    Abstract: An object of the invention is to provide a printed wiring board which is less likely to cause foaming even after a reflow step and in which a metal reinforcing plate is less likely to be peeled off, a manufacturing method thereof, and an electronic device. A printed wiring board (1) according to the present invention includes a wiring circuit board (6), a conductive adhesive layer (3), and a metal reinforcing plate (2). The conductive adhesive layer (3) is bonded to each of the wiring circuit board (6) and the metal reinforcing plate (2). The metal reinforcing plate (2) includes a nickel layer (2b) formed on a surface of a metal plate (2a). A ratio of a surface area of nickel hydroxide to nickel present in a surface of the nickel layer (2b) is more than 3 and equal to or less than 20.
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: January 17, 2017
    Assignees: TOYO INK SC HOLDINGS CO., LTD., TOYOCHEM CO., LTD.
    Inventors: Satoshi Nishinohara, Hidenobu Kobayashi, Kazunori Matsudo, Tsutomu Hayasaka
  • PRINTED WIRING BOARD, PRINTED WIRING BOARD MANUFACTURING METHOD, AND ELECTRONIC DEVICE
    Publication number: 20160270243
    Abstract: An object of the invention is to provide a printed wiring board which is less likely to cause foaming even after a reflow step and in which a metal reinforcing plate is less likely to be peeled off, a manufacturing method thereof, and an electronic device. A printed wiring board (1) according to the present invention includes a wiring circuit board (6), a conductive adhesive layer (3), and a metal reinforcing plate (2). The conductive adhesive layer (3) is bonded to each of the wiring circuit board (6) and the metal reinforcing plate (2). The metal reinforcing plate (2) includes a nickel layer (2b) formed on a surface of a metal plate (2a). A ratio of a surface area of nickel hydroxide to nickel present in a surface of the nickel layer (2b) is more than 3 and equal to or less than 20.
    Type: Application
    Filed: August 27, 2015
    Publication date: September 15, 2016
    Inventors: Satoshi NISHINOHARA, Hidenobu KOBAYASHI, Kazunori MATSUDO, Tsutomu HAYASAKA