Abstract: A unit includes a wiring board having a first face having a mounting portion on which an electronic device is mounted, a second face opposite to the first face, and end faces continuous with the first face and the second face, a resin member provided to cover the end faces and to have protrusions protruding upward from the end faces to face each other across a space above the mounting portion, and an insulating film covering the second face, wherein at least a part of an edge of the insulating film is provided away from an end of the second face on the end face side.

Abstract: A unit includes a wiring board having a first face having a mounting portion on which an electronic device is mounted, a second face opposite to the first face, and end faces continuous with the first face and the second face, a resin member provided to cover the end faces and to have protrusions protruding upward from the end faces to face each other across a space above the mounting portion, and an insulating film covering the second face, wherein at least a part of an edge of the insulating film is provided away from an end of the second face on the end face side.

Abstract: A unit includes a wiring board having a first face having a mounting portion on which an electronic device is mounted, a second face opposite to the first face, and end faces continuous with the first face and the second face, a resin member provided to cover the end faces and to have protrusions protruding upward from the end faces to face each other across a space above the mounting portion, and an insulating film covering the second face, wherein at least a part of an edge of the insulating film is provided away from an end of the second face on the end face side.

Abstract: A method includes preparing a circuit board that includes a first metal pattern over a first face side of the substrate, a first electrode in a periphery of the first metal pattern, a second electrode over a second face side of the substrate, and a second metal pattern thermally connected to the first metal pattern and in which an electronic device is fixed on the first metal pattern and an electronic component is electrically connected to the second electrode, and connecting the first electrode and a third electrode of the electronic device by a bonding wire with the electronic device being heated. By a board support stage, the electronic device is heated by transferring heat to the electronic device via the second and then first metal pattern with the circuit board being supported to form a space including the electronic component between the second face and the board support stage.

Abstract: A unit includes a wiring board having a first face having a mounting portion on which an electronic device is mounted, a second face opposite to the first face, and end faces continuous with the first face and the second face, a resin member provided to cover the end faces and to have protrusions protruding upward from the end faces to face each other across a space above the mounting portion, and an insulating film covering the second face, wherein at least a part of an edge of the insulating film is provided away from an end of the second face on the end face side.

Abstract: A method includes preparing a circuit board that includes a first metal pattern over a first face side of the substrate, a first electrode in a periphery of the first metal pattern, a second electrode over a second face side of the substrate, and a second metal pattern thermally connected to the first metal pattern and in which an electronic device is fixed on the first metal pattern and an electronic component is electrically connected to the second electrode, and connecting the first electrode and a third electrode of the electronic device by a bonding wire with the electronic device being heated. By a board support stage, the electronic device is heated by transferring heat to the electronic device via the second and then first metal pattern with the circuit board being supported to form a space including the electronic component between the second face and the board support stage.

Abstract: There is disclosed a manufacturing method in which depths of individual liquid chambers can be set to be small. The manufacturing method is a manufacturing method of a liquid discharge head having a liquid chamber which communicates with a discharge port for discharging a liquid, and includes: etching a first Si layer of an SOI substrate by use of an insulating layer as an etching stop layer to form the liquid chamber at the first Si layer, the SOI substrate being constituted by the first Si layer, the insulating layer and a second Si layer in this order; and removing a part or all of the second Si layer.

Abstract: A liquid discharge head includes a plurality of liquid chambers for pressurizing a liquid, the plurality of liquid chambers communicating with discharge ports respectively; and a plurality of piezoelectric elements provided in correspondence with the plurality of liquid chambers, respectively, the plurality of piezoelectric elements each including a lower electrode, a piezoelectric body film, and an upper electrode which are sequentially laminated in the stated order from the plurality of liquid chambers side. The lower electrode is provided up to a region corresponding to a portion between the plurality of liquid chambers. The piezoelectric body film is reduced in thickness at the region corresponding to the portion between the plurality of liquid chambers relative to the thickness of a region corresponding to the plurality of liquid chambers and completely covers at least the lower electrode provided to the region corresponding to the portion between the plurality of liquid chambers.

Abstract: There is disclosed a manufacturing method in which depths of individual liquid chambers can be set to be small. The manufacturing method is a manufacturing method of a liquid discharge head having a liquid chamber which communicates with a discharge port for discharging a liquid, and includes: etching a first Si layer of an SOI substrate by use of an insulating layer as an etching stop layer to form the liquid chamber at the first Si layer, the SOI substrate being constituted by the first Si layer, the insulating layer and a second Si layer in this order; and removing a part or all of the second Si layer.

Abstract: A liquid discharge head, comprising: a plurality of liquid chambers for pressurizing a liquid, the plurality of liquid chambers communicating with discharge ports respectively; and a plurality of piezoelectric elements provided in correspondence with the plurality of liquid chambers respectively, the plurality of piezoelectric elements each including a lower electrode, a piezoelectric body film, and an upper electrode which are sequentially laminated in the stated order from the plurality of liquid chambers side, the lower electrode being provided up to a region corresponding to a portion between the plurality of liquid chambers, wherein the piezoelectric body film is reduced in thickness at the region corresponding to the portion between the plurality of liquid chambers than at a region corresponding to the plurality of liquid chambers and completely covers at least the lower electrode provided to the region corresponding to the portion between the plurality of liquid chambers.

Abstract: A device is formed by transferring a film onto a substrate when the film requires but the substrate is not adapted to a high temperature heat treatment process. The film having layers and formed on a first substrate having layers is transferred onto a second substrate having layers. The method of transferring the film comprises a first step of forming a lift-off layer and the film to be transferred on the first substrate, a second step of bonding the film to be transferred to the second substrate and a third step of separating the film to be transferred from the first substrate by etching the lift-off layer and transferring it onto the second substrate.

Abstract: A device is formed by transferring a film onto a substrate when the film requires but the substrate is not adapted to a high temperature heat treatment process. The film having layers and formed on a first substrate having layers is transferred onto a second substrate having layers. The method of transferring the film comprises a first step of forming a lift-off layer and the film to be transferred on the first substrate, a second step of bonding the film to be transferred to the second substrate and a third step of separating the film to be transferred from the first substrate by etching the lift-off layer and transferring it onto the second substrate.