Abstract: A speaker unit incorporated in a housing of an earphone includes: a frame having a cylindrical shape; a diaphragm emitting sound; and a board to which a wiring line of a coil provided to the diaphragm is connected. The frame has a space inside, and the diaphragm and the board are placed inside the frame with the space interposed between the diaphragm and the board.

Abstract: In an optical pickup device 3, a supporting base 18 that has a main-shaft bearing 6a with two concentric round holes to pass a main shaft 7 through is formed out of a synthetic resin. On the other hand, an optical base 19, which has a sub-shaft bearing 6b to pass a sub-shaft 8 through and which supports a light emitter 11, a beam splitter 12, a collimator lens 13 and a photodetector 17, is formed by metal die casting process. And a pickup frame 6 is formed by bonding the supporting base 18 and the optical base 19 together with an adhesive.

Abstract: In an optical pickup device 3, a supporting base 18 that has a main-shaft bearing 6a with two concentric round holes to pass a main shaft 7 through is formed out of a synthetic resin. On the other hand, an optical base 19, which has a sub-shaft bearing 6b to pass a sub-shaft 8 through and which supports a light emitter 11, a beam splitter 12, a collimator lens 13 and a photodetector 17, is formed by metal die casting process. And a pickup frame 6 is formed by bonding the supporting base 18 and the optical base 19 together with an adhesive.

Abstract: A lens holder 2 holds an objective lens 1. Wires 5a.about.5d movably support the lens holder 2 relative to a stationary member 6 in a tracking direction and in a focus direction. The wires 5a.about.5d are integrally formed with the lens holder 2 and the stationary member 6 and one end and the other end of each of the wires are buried in the lens holder 2 and the stationary member 6. At a time of the integral molding, parts of the buried portions of the wires 5a.about.5d are exposed in notches 2a.about.2d and 6a.about.6d to be in contact with a mold for molding, thereby injection pressure of a molding material is received by the mold. This makes it possible to prevent deformation of the wires 5a.about.5d due to the injection pressure of the molding material, resulting in reducing inclination during actuation and degradation of frequency response characteristic.