Abstract: An image acquisition system for wire group processing is a system for recognizing the wire group constituting the wire harness. This image acquisition system includes a first vision system (e.g. a two-dimensional vision system) that acquires first image data for recognizing the wire group constituting the wire harness in a first imaging range, and a second vision system (e.g. a three-dimensional vision system) that acquires second image data for recognizing the wire group constituting the wire harness in a second imaging range which is within a region that overlaps with the first imaging range and is smaller than the first imaging range, the second image data having a greater amount of information per unit of area than that of the first image data.

Abstract: A technique suitable for measuring the shape of a linear object. In the process of manufacturing a wire harness, a processing position identification process, in which a processing position is identified by measuring the three-dimensional shape of a wire assembly, is executed. This processing position identification process includes the following: a point group data acquisition step of acquiring point group data from image data acquired by capturing an image of the wire assembly using an image capturing unit; a representative line acquisition step of acquiring a representative line indicating a linear part of the wire assembly on the basis of the point group data; and a processing position identification step of identifying the processing position on the wire assembly to be processed, on the basis of a length along the representative line.

Abstract: A mounting substrate including an interconnection provided on a front surface of a substrate, a lead pad provided separately from the interconnection, on the front surface of the substrate and, a lead connected to the lead pad by solder, and a connecting portion that connects the interconnection and the lead pad after the lead is connected.