Abstract: A novel organic compound is to be provided. In other words, a novel organic compound effective in improving element characteristics is to be provided. The organic compound is represented by General Formula (G1) shown below. In General Formula (G1) above, at least one or two of A1 to A4 represent nitrogen, and the others represent carbon. At least one or two of A5 to A8 represent nitrogen, and the others represent carbon. In addition, B1 and B2 each independently represent hydrogen, an alkyl group having 1 to 6 carbon atoms, or a cyano group. In addition, Htuni1 and Htuni2 each independently represent a hole-transport skeleton.

Abstract: A reliable light-emitting element with low driving voltage is provided. The light-emitting element includes an electron-injection layer between a cathode and a light-emitting layer. The electron-injection layer is a mixed film of a transition metal and an organic compound having an unshared electron pair. An atom of the transition metal and the organic compound form SOMO.

Abstract: A novel organic compound is provided. A novel organic compound having a carrier-transport property is provided. A novel organic compound having a hole-transport property is provided. An organic compound having a low refractive index is provided. An organic compound having a low refractive index and a carrier-transport property is provided. An organic compound having a low refractive index and a hole-transport property is provided. An organic compound represented by the following general formula (G1) is provided.

Abstract: A novel light-emitting device that is highly convenient, useful, or reliable is provided. The light-emitting device includes a first electrode, a second electrode, and a first layer. The first layer is positioned between the first electrode and the second electrode. The first layer includes a light-emitting material, a first organic compound, and a first material. The light-emitting material has a function of emitting fluorescent light. The absorption spectrum of the light-emitting material has the longest-wavelength edge at a first wavelength. The first organic compound has a function of converting triplet excitation energy into light emission. The spectrum of the emitted light has the shortest-wavelength edge at a second wavelength. The second wavelength is positioned at a wavelength shorter than the first wavelength. The first organic compound includes a first substituent R1. The first substituent R1 is any of an alkyl group, a substituted or unsubstituted cycloalkyl group, and a trialkylsilyl group.

Abstract: A light-emitting element having high emission efficiency is provided. The light-emitting element includes a first organic compound, a second organic compound, and a third organic compound. The first organic compound has a function of converting triplet excitation energy into light emission. The second organic compound is preferably a TADF material. The third organic compound is a fluorescent compound. Light emitted from the light-emitting element is obtained from the third organic compound. Triplet excitation energy in a light-emitting layer is transferred to the third organic compound by reverse intersystem crossing caused by the second organic compound or through the first organic compound.

Abstract: A light-emitting element with high emission efficiency and high reliability is provided. The light-emitting element includes a host material and a guest material in a light-emitting layer. The host material has a function of converting triplet excitation energy into light emission and the guest material emits fluorescence. The molecular structure of the guest material is a structure including a luminophore and protecting groups, and five or more protecting groups are included in one molecule of the guest material. The introduction of the protecting groups into the molecule inhibits energy transfer of triplet excitation energy by the Dexter mechanism from the host material to the guest material. As the protecting group, an alkyl group or a branched-chain alkyl group is used.

Abstract: A novel light-emitting device with a microcavity structure which can improve the emission efficiency compared to the conventional one is provided. In a light-emitting device with a microcavity structure that emits light in a near-infrared range, reflectance of one or both of a first electrode (reflective electrode) and a second electrode (semi-transmissive and semi-reflective electrode) with respect to light in a near-infrared range (e.g., light with a wavelength of 850 nm) is higher than the reflectance thereof with respect to light in a visible light range (greater than or equal to 400 nm and less than 750 nm).

Abstract: A novel light-emitting device that is highly convenient, useful, or reliable is provided. The light-emitting device includes an anode over a cathode with an EL layer sandwiched therebetween. The EL layer includes at least a light-emitting layer and an oxidation-resistant layer over the light-emitting layer. The EL layer has a side surface. The light-emitting device includes a block layer in contact with a top surface and the side surface of the EL layer. The cathode is in contact with the side surface of the EL layer with the block layer therebetween. The block layer includes a heterocyclic compound. In the light-emitting device with the above structure, the oxidation-resistant layer may include any one or a plurality of oxides of metals belonging to Group 4 to Group 8 of the periodic table and an organic compound having an electron-withdrawing group.

Abstract: A light-emitting device with high emission efficiency and reliability is provided. The light-emitting device includes a fluorescent light-emitting layer and a phosphorescent light-emitting layer. A host material used in the fluorescent light-emitting layer has a function of converting triplet excitation energy into light emission and a guest material used in the fluorescent light-emitting layer emits fluorescence. The guest material has a molecular structure including a luminophore and a protecting group, and one molecule of the guest material includes five or more protecting groups. The introduction of the protecting groups into the molecule inhibits transfer of triplet excitation energy from the host material to the guest material by the Dexter mechanism. An alkyl group or a branched-chain alkyl group is used as the protecting group.

Abstract: A novel compound is provided. The novel compound is represented by General Formula (G1). In General Formula (G1), A represents a substituted or unsubstituted condensed aromatic ring having 10 to 30 carbon atoms or a substituted or unsubstituted condensed heteroaromatic ring having 10 to 30 carbon atoms, and R1 represents a substituted or unsubstituted aryl group having 6 to 25 carbon atoms. Each of Y1 and Y2 independently represents a cycloalkyl group having a bridge structure and having 7 to 10 carbon atoms.

Abstract: A contact includes a first metal member that includes a first tube section including a first cavity portion therein, and a plurality of first eaves portions extending from a side wall of the first tube section toward a center axis side of the first tube section, one of the plurality of first eaves portions being longer than the other first eaves portions and forming a first contact portion adapted to make contact with a first external part, a second metal member that includes a second tube section including a second cavity portion therein and being in electrical continuity with a second contact portion adapted to make contact with a second external part, and a spring extending from the first cavity portion to the second cavity portion and being accommodated in the cavity portions.

Abstract: A cable connection board includes a signal layer disposed inside a board, a first layer and a second layer disposed inside the board with the signal layer being interposed therebetween, a cable coupled to the board so as to extend to a first surface of the board, a first solder joint portion that joins an outer conductor included in the cable and the first layer to each other, and a second solder joint portion that joins a front end of an inner conductor included in the cable and the signal layer to each other in the board.

Abstract: A board includes: a signal layer; a first layer and a second layer disposed so as to interpose the signal layer; a connector shell portion embedded on a first surface side of the board; a first solder joint portion that brings the connector shell portion and the first layer to be electrically conductive with each other; a contact portion disposed in a state where a center axis line of the contact portion coincides with a center axis line of the connector shell portion and the contact portion is electrically conductive with the signal layer; and an insulating portion disposed around the contact portion.

Abstract: A semiconductor device includes: a processor having a heat sink mounted thereon; and an optical module having a heat transfer interposer, wherein the heat sink and the optical module are coupled to each other via the heat transfer interposer. And a semiconductor device includes: a semiconductor chip mounted on a substrate; a lead that covers the semiconductor chip; a heat sink installed on the lead; and an optical module coupled to the heat sink via a heat transfer interposer.

Abstract: A cable connection board includes a signal layer disposed inside a board, a first layer and a second layer disposed inside the board with the signal layer being interposed therebetween, a cable coupled to the board so as to extend to a first surface of the board, a first solder joint portion that joins an outer conductor included in the cable and the first layer to each other, and a second solder joint portion that joins a front end of an inner conductor included in the cable and the signal layer to each other in the board.

Abstract: A board includes: a signal layer; a first layer and a second layer disposed so as to interpose the signal layer; a connector shell portion embedded on a first surface side of the board; a first solder joint portion that brings the connector shell portion and the first layer to be electrically conductive with each other; a contact portion disposed in a state where a center axis line of the contact portion coincides with a center axis line of the connector shell portion and the contact portion is electrically conductive with the signal layer; and an insulating portion disposed around the contact portion.

Abstract: A contact unit includes signal and power-supply contact terminals, a first blade in which the contact terminals are nipped and held, and a second blade. In each contact terminal formed of a conductive metal material by using the MEMS technique, for example, a tapered portion of a short-circuit piece and a tapered portion of another short-circuit piece come into contact with each other when a pressure at a predetermined value or higher is applied to a first contact and a second contact in a direction to come close to each other.

Abstract: A semiconductor device includes: a processor having a heat sink mounted thereon; and an optical module having a heat transfer interposer, wherein the heat sink and the optical module are coupled to each other via the heat transfer interposer. And a semiconductor device includes: a semiconductor chip mounted on a substrate; a lead that covers the semiconductor chip; a heat sink installed on the lead; and an optical module coupled to the heat sink via a heat transfer interposer.

Abstract: An optical module connector includes a connector configured to be coupled to a package substrate, which is coupled to first solder coupled to a printed board, and to second solder coupled to the printed board, the connector being coupled to the second solder; and an optical-module substrate configured to be detachably coupled to the connector, wherein the connector configured to include a first surface to which the optical-module substrate is coupled, a second surface coupled to the package substrate, and a third surface coupled to the second solder, and wherein the first surface to which the optical-module substrate is coupled includes a fourth surface opposite the second surface and a fifth surface opposite the third surface coupled to the second solder, and wherein a first height from the second surface to the first surface is less than a second height from the third surface to the first surface.

Abstract: An interposer includes a first contact terminal pressed against a first fixed terminal for signal transmission; a pair of second contact terminals pressed against second fixed terminals for any one of power supply and grounding, the pair of second contact terminals being disposed with a gap in a pressing direction in which the pair of second contact terminals are pressed against the second fixed terminals, each of the pair of second contact terminals having a larger sectional area than the first contact terminal in a crossing direction that crosses the pressing direction; and a plurality of spring members arranged between the pair of second contact terminals, the plurality of spring members being electro-conductive, having a lower elasticity than the first contact terminal, and pressing the pair of second contact terminals against the second fixed terminals.