Patents by Inventor Satoshi Ohya

Satoshi Ohya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9410798
    Abstract: A strain measurement apparatus includes: a stereo camera device that produces a first stereo image and a second stereo image of a measurement object; an actual strain calculation portion configured to find a three-dimensional configuration of the measurement object from the first stereo image and the second stereo image to find actual strain of the measurement object; a temperature distribution detector that detects a temperature distribution of the measurement object; a free thermal strain calculation portion configured to find free thermal strain of the measurement object from the temperature distribution detected by the temperature distribution detector; and a constraint strain calculation portion configured to find as constraint strain of the measurement object a difference obtained by subtracting the free thermal strain found by the free thermal strain calculation portion from the actual strain found by the actual strain calculation portion.
    Type: Grant
    Filed: October 23, 2012
    Date of Patent: August 9, 2016
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Osamu Maeda, Satoshi Ohya
  • Patent number: 8632719
    Abstract: A method for producing an injection-molded product includes steps of placing, in an injection mold, a heat-shrinkable resin sheet having region A and region B which have different surface temperatures when irradiated with infrared rays; integrating the resin sheet with an injection molding resin by injecting the injection molding resin into the mold; and, before the resin sheet is placed in the injection mold or before the integration step after the placing of the resin sheet in the injection mold, irradiating the resin sheet with infrared rays so that the surface temperatures of region A and region B are different from each other and the surface temperature of at least region A is equal to or higher than an orientation release stress inflection point temperature T of the resin sheet, thereby forming a difference in thickness between regions A and B.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: January 21, 2014
    Assignee: DIC Corporation
    Inventors: Satoshi Ohya, Toshiro Ariga
  • Publication number: 20130107004
    Abstract: A strain measurement apparatus includes: a stereo camera device that produces a first stereo image and a second stereo image of a measurement object; an actual strain calculation portion configured to find a three-dimensional configuration of the measurement object from the first stereo image and the second stereo image to find actual strain of the measurement object; a temperature distribution detector that detects a temperature distribution of the measurement object; a free thermal strain calculation portion configured to find free thermal strain of the measurement object from the temperature distribution detected by the temperature distribution detector; and a constraint strain calculation portion configured to find as constraint strain of the measurement object a difference obtained by subtracting the free thermal strain found by the free thermal strain calculation portion from the actual strain found by the actual strain calculation portion.
    Type: Application
    Filed: October 23, 2012
    Publication date: May 2, 2013
    Inventors: Osamu Maeda, Satoshi Ohya
  • Patent number: 8425713
    Abstract: A bonding unit (20) bonding a wafer (12) and a support plate (14) with a mediation of an adhesive agent (16) to form a bonded substance (18), and a plasma treatment unit (22) treating the bonded substance (18) with a plasma treatment are provided.
    Type: Grant
    Filed: April 11, 2008
    Date of Patent: April 23, 2013
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Satoshi Ohya, Atsushi Miyanari
  • Publication number: 20130075959
    Abstract: A method for producing an injection-molded product includes steps of placing, in an injection mold, a heat-shrinkable resin sheet having region A and region B which have different surface temperatures when irradiated with infrared rays; integrating the resin sheet with an injection molding resin by injecting the injection molding resin into the mold; and, before the resin sheet is placed in the injection mold or before the integration step after the placing of the resin sheet in the injection mold, irradiating the resin sheet with infrared rays so that the surface temperatures of region A and region B are different from each other and the surface temperature of at least region A is equal to or higher than an orientation release stress inflection point temperature T of the resin sheet, thereby forming a difference in thickness between regions A and B.
    Type: Application
    Filed: February 28, 2011
    Publication date: March 28, 2013
    Applicant: DIC CORPORATION
    Inventors: Satoshi Ohya, Toshiro Ariga
  • Publication number: 20130052422
    Abstract: Provided is a patterning sheet that is inserted into an injection mold during injection molding and detached after the injection molding to produce recesses and protrusions on an injection molded product, the patterning sheet having a thickness difference in some part and being made by irradiating an infrared ray on a heat-shrinkable resin sheet having a portion A and a portion B in a surface, the portion A and the portion B having infrared absorbing properties different from each other.
    Type: Application
    Filed: February 28, 2011
    Publication date: February 28, 2013
    Applicant: DIC CORPORATION.
    Inventors: Satoshi Ohya, Toshiro Ariga
  • Publication number: 20120006480
    Abstract: There is provided a method for manufacturing a decorated molding having projections and depressions in a decorated surface, the method including, while a heat-shrinkable resin sheet is supported, a step (1) of creating a difference in thickness between an area A and an area B adjacent to each other in the same plane of the resin sheet through irradiation with infrared rays so that the area A and the area B have surface temperatures different from each other and the surface temperature of at least the area A is a surface temperature that is higher than or equal to a temperature T of an inflection point of orientation returning strength of the resin sheet and a step (2) of attaching the resin sheet to an adherend by vacuum forming to achieve integration. In a method for simultaneously performing vacuum forming and decoration, a decorated molding having projections and depressions in a decorated surface can be obtained with high reproducibility without requiring a physical method such as embossing.
    Type: Application
    Filed: March 9, 2010
    Publication date: January 12, 2012
    Applicant: DIC Corporation
    Inventors: Satoshi Ohya, Yoshinari Santo, Toshiro Ariga
  • Publication number: 20100096080
    Abstract: A bonding unit (20) bonding a wafer (12) and a support plate (14) with a mediation of an adhesive agent (16) to form a bonded substance (18), and a plasma treatment unit (22) treating the bonded substance (18) with a plasma treatment are provided.
    Type: Application
    Filed: April 11, 2008
    Publication date: April 22, 2010
    Applicant: TOKYO OHKA KOGYO CO., LTD
    Inventors: Satoshi Ohya, Atsushi Miyanari
  • Publication number: 20090104441
    Abstract: The object of the present invention is to provide a laminated sheet for thermoforming, including a thermoplastic resin film layer; a decoration layer; and a support base resin layer, wherein the thermoplastic resin film layer, the decoration layer, and the support base resin layer are sequentially laminated, and the support base resin layer contains one or more linear low density polyethylene layers. Also, the object of the resent invention is to provide a formed product obtained by thermoforming the laminated sheet, and a method of producing the same. Furthermore, the object of the present invention is to provide an injection-molded product obtained by loading an injection resin onto the backside of the molded product, and a method of producing the same.
    Type: Application
    Filed: February 23, 2006
    Publication date: April 23, 2009
    Applicant: DAINIPPON INK AND CHEMICALS, INC.
    Inventors: Hidetsugu Sawada, Satoshi Ohya, Toshio Yuge, Kousuke Arai
  • Publication number: 20090039556
    Abstract: The thermoforming method of the present invention is a method that includes thermoplasticizing a portion, including a part 2 which is molded with molds, of a thermoforming sheet 1 in which at least one or more thermoplastic resin layers (A) and a decorative layer (B) were laminated, at a temperature range of (Tg (A)?30)° C. to (Tg (A)+10)° C.
    Type: Application
    Filed: May 10, 2006
    Publication date: February 12, 2009
    Applicant: DAINIPPON INK AND CHEMICALS, INC.
    Inventors: Hidetsugu Sawada, Satoshi Ohya, Kousuke Arai, Kouichi Kudo, Keisuke Kudo
  • Patent number: 7157442
    Abstract: The present invention relates to a compound of formula (I) (wherein R1 and R2 represent an aryl group, a heterocyclic group, an alkyl group, an alkenyl group and the like which are optionally substituted, R3 represents a hydrogen atom or a hydroxyl group, and X1 and X2 represent an oxygen atom or a sulfur atom, or a nitrogen atom which may be substituted), a pharmaceutically acceptable derivative thereof or a salt thereof. The present invention also relates to a pharmaceutical composition comprising a compound described above as an active ingredient for the prevention or treatment of bacterial infections. The present invention includes the use of a compound described above in order to prepare a medicament effective in the prevention or treatment of bacterial infections.
    Type: Grant
    Filed: February 19, 2002
    Date of Patent: January 2, 2007
    Assignee: Sankyo Company, Limited
    Inventors: Hitoshi Hotoda, Masakatsu Kaneko, Masatoshi Inukai, Yasunori Muramatsu, Yukio Utsui, Satoshi Ohya
  • Publication number: 20030171330
    Abstract: A compound of formula (I) 1
    Type: Application
    Filed: February 19, 2002
    Publication date: September 11, 2003
    Applicant: SANKYO COMPANY, LIMITED
    Inventors: Hitoshi Hotoda, Masakatsu Kaneko, Masatoshi Inukai, Yasunori Muramatsu, Yukio Utsui, Satoshi Ohya
  • Patent number: 6391903
    Abstract: Compounds of the following formula (I) and pharmaceutically acceptable esters and salts thereof: Ar is a phenyl group which may optionally be substituted by from 1 to 3 substituents selected from the group consisting of halogen atoms and trifluoromethyl groups. Said compounds (and pharmaceutically acceptable esters and salts thereof) have excellent antifungal activity.
    Type: Grant
    Filed: September 6, 2000
    Date of Patent: May 21, 2002
    Assignee: Sankyo Company, Limited
    Inventors: Toshiyuki Konosu, Sadao Oida, Makoto Mori, Takuya Uchida, Satoshi Ohya, Akihiko Nakagawa
  • Patent number: 6337403
    Abstract: Compounds of the following formula (I) and pharmaceutically acceptable esters and salts thereof: Ar is a phenyl group which may optionally be substituted by from 1 to 3 substituents selected from the group consisting of halogen atoms and trifluoromethyl groups. The compounds (and pharmaceutically acceptable esters and salts thereof) have excellent antifungal activity.
    Type: Grant
    Filed: June 1, 2001
    Date of Patent: January 8, 2002
    Assignee: Sankyo Company, Limited
    Inventors: Toshiyuki Konosu, Sadao Oida, Makoto Mori, Takuya Uchida, Satoshi Ohya, Akihiko Nakagawa
  • Patent number: 6180621
    Abstract: A method for the prophylaxis or treatment of infectious diseases caused by helicobacter pyloir, by administering a pharmacologically effective amount of a 1-methoylcarbapenem coumpund of formula (I) or a pharmacologically acceptable salt or ester thereof: R1 represents a group of the following formula: R2 is a hydrogen atom or a C1-C6 alkyl group, and R3 is a hydrogen atom or a C1-C6 alkyl group.
    Type: Grant
    Filed: November 6, 1998
    Date of Patent: January 30, 2001
    Assignee: Sankyo Company, Limited
    Inventors: Isao Kawamoto, Satoshi Ohya, Yukio Utsui
  • Patent number: 6090802
    Abstract: A 1-methylcarbapenem compound represented by the following formula (I): ##STR1## wherein R.sup.1 represents hydrogen or C.sub.1 -C.sub.4 alkyl; R.sup.2 represents hydrogen or an ester residue; and A represents a group of the formula (A1) ##STR2## wherein n is 0, 1 or 2, P is 0, 1 or 2, R.sup.3 is hydrogen or C.sub.1 -C.sub.4 alkyl and R.sup.4 is a group (Q2) ##STR3## wherein B is phenylene, phenylene(C.sub.1 -C.sub.3)alkyl, cyclohexylene, cyclohexylene(C.sub.1 -C.sub.3)alkyl or C.sub.1 -C.sub.5 alkylene, R.sup.7 is hydrogen or C.sub.1 -C.sub.4 alkyl, and R.sup.14 is a group --C(.dbd.NH)R.sup.8, wherein R.sup.8 is hydrogen or C.sub.1 -C.sub.4 alkyl or a group --NR.sup.9 R.sup.10, wherein R.sup.9 and R.sup.10 are the same or different and are hydrogen or C.sub.1 -C.sub.4 alkyl; or a pharmacologically acceptable salt thereof.
    Type: Grant
    Filed: June 12, 1998
    Date of Patent: July 18, 2000
    Assignee: Sankyo Company, Limited
    Inventors: Isao Kawamoto, Yasuo Shimoji, Katsuya Ishikawa, Katsuhiko Kojima, Hiroshi Yasuda, Satoshi Ohya, Yukio Utsui
  • Patent number: 5977097
    Abstract: A 1-methylcarbapenem compound represented by the following formula: ##STR1## [wherein R.sup.1 represents a hydrogen atom or a lower alkyl group, R.sup.2 represents a hydrogen atom or a lower alkyl group, R.sup.3 represents a hydrogen atom, a lower alkyl group, a lower alkyl group which has a substituent, a cycloalkyl group or a group of formula --C(.dbd.NH)R.sup.4 (in which R.sup.4 represents a hydrogen atom, a lower alkyl group or an amino group)]; or a pharmacologically acceptable salt or derivative thereof. The 1-methylcarbapenem compounds of the present invention exhibit excellent antibacterial activity and are therefore effective as a preventive or remedy of infections.
    Type: Grant
    Filed: October 22, 1998
    Date of Patent: November 2, 1999
    Assignee: Sankyo Company Limited
    Inventors: Isao Kawamoto, Katsuya Ishikawa, Katsuhiko Kojima, Yasuo Shimoji, Satoshi Ohya, Munetsugu Morimoto
  • Patent number: 5866564
    Abstract: Compound of formula (I): ##STR1## wherein R.sup.1 is hydrogen, C.sub.1 -C.sub.6 alkyl, C.sub.2 -C.sub.6 alkenyl, C.sub.2 -C.sub.6 alkynyl or --C(.dbd.NH)R.sup.0 where R.sup.0 is hydrogen or C.sub.1 -C.sub.6 alkyl;A is ##STR2## R.sup.2 is hydrogen, C.sub.1 -C.sub.6 alkyl, C.sub.2 -C.sub.6 alkenyl, C.sub.2 -C.sub.6 alkynyl or --C(.dbd.NH)R.sup.6 where R.sup.6 is hydrogen, C.sub.1 -C.sub.6 alkyl or C.sub.3 -C.sub.7 cycloalkyl; R.sup.3 and R.sup.4 are independently hydrogen, C.sub.1 -C.sub.6 alkyl, halogen, hydroxy, carboxy, cyano, --CO.NR.sup.a R.sup.b, --OCO.NR.sup.a R.sup.b or --NR.sup.a R.sup.b, where R.sup.a and R.sup.b are independently hydrogen or C.sub.1 -C.sub.6 alkyl; R.sup.20", R.sup.21', and R.sup.22" are independently hydrogen or C.sub.1 -C.sub.6 alkyl or R.sup.20" and R.sup.21" or R.sup.20" and R.sup.22" together form a heterocyclic group; R.sup.23" and R.sup.24" are independently hydrogen, halogen or C.sub.1 -C.sub.6 alkyl; n is 1, 2 or 3; and n.sup.3" is 1, 2 or 3.
    Type: Grant
    Filed: July 8, 1997
    Date of Patent: February 2, 1999
    Assignee: Sankyo Company, Limited
    Inventors: Isao Kawamoto, Rokuro Endo, Masao Miyauchi, Katsuya Ishikawa, Eiji Nakayama, Hiroshi Yasuda, Satoshi Ohya, Yukio Utsui, Katsuhiko Watanabe
  • Patent number: 5712267
    Abstract: Compounds of formula (I): ##STR1## wherein R.sup.1x is hydrogen or methyl, R.sup.2x is hydrogen optionally substituted aliphatic hydrocarbon or acylimidoyl, R.sup.3x is hydrogen or an ester group, and Q.sup.x is cyclic or acyclic nitrogen-containing group. The compounds are potent antibiotics which are resistant to dehydropeptidase I, and are thus useful for the treatment of many microbial infections.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: January 27, 1998
    Assignee: Sankyo Company,. Limited
    Inventors: Isao Kawamoto, Rokuro Endo, Masao Miyauchi, Katsuya Ishikawa, Eiji Nakayama, Hiroshi Yasuda, Satoshi Ohya, Yukio Utsui, Katsuhiko Watanabe
  • Patent number: 5420119
    Abstract: Carbapenem compounds of formula (I): ##STR1## [in which: A is a fully saturated heterocyclic group, of which at least one ring atom is nitrogen; R.sup.1 is hydrogen or methyl; R.sup.2 is hydrogen or alkyl; R.sup.3 is hydrogen or a negative ion; Q is: (i) --B--N.sup.+ R.sup.8 R.sup.9 R.sup.10, where R.sup.8, R.sup.9 and R.sup.10 are alkenyl, alkynyl or optionally substituted alkyl, and B is alkylene or alkylidene; (ii) a heterocyclic group of which one ring atom is a >N.sup.+ R.sup.11 R.sup.12, where R.sup.11 and R.sup.12 are alkenyl, alkynyl or optionally substituted alkyl; (iii) alkyl substituted by a heterocyclic group as defined in (ii) above; or (iv) alkyl substituted by an aromatic heterocyclic group, of which one ring atom is ##STR2## or R.sup.2 and Q, and the nitrogen to which they are attached, form a group of formula (II): ##STR3## where m and n are 1, 2 or 3; R.sup.6 is optionally substituted alkyl; and R.sup.
    Type: Grant
    Filed: October 27, 1993
    Date of Patent: May 30, 1995
    Assignee: Sankyo Company, Limited
    Inventors: Isao Kawamoto, Masao Miyauchi, Eiji Nakayama, Rokuro Endo, Satoshi Ohya, Yukio Utsui