Patents by Inventor Satoshi Osawa

Satoshi Osawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11957708
    Abstract: The present invention provides a composition that controls pharmacokinetics. Specifically, the present invention provides: a composition for controlling pharmacokinetics, the composition containing a polyvalent cation as an active ingredient; and a method for controlling pharmacokinetics using the polyvalent cation.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: April 16, 2024
    Assignee: KAWASAKI INSTITUTE OF INDUSTRIAL PROMOTION
    Inventors: Kazunori Kataoka, Shigehito Osawa, Satoshi Uchida, Kotaro Hayashi, Anjaneyulu Dirisala, Kazuko Toh
  • Patent number: 11917595
    Abstract: A communication device includes a receiving unit that receives at least one of configuration information of a same center frequency used for downlink reception and sidelink reception in one slot or configuration information of a same center frequency used for uplink transmission and sidelink transmission in the one slot; and a control unit that configures, based on the received configuration information, at least one of the same center frequency for the downlink reception and the sidelink reception in the one slot or the same center frequency for the uplink transmission and the sidelink transmission in the one slot.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: February 27, 2024
    Assignee: NTT DOCOMO, INC.
    Inventors: Ryosuke Osawa, Kazuaki Takeda, Satoshi Nagata
  • Publication number: 20220389629
    Abstract: To provide a flexible conductive base member and a multilayer conductive base member including the same, having no problem of failing to function as a contact and causing a variation in height between contacts. There are a covered region 10 covered with a noble metal and a non-covered region 20 not circumferentially covered with a noble metal on a surface of a reticulated fibrous body 50. The covered region 10 is located at an intersection 7 of fibers 5 of the reticulated fibrous body 50, and the intersections 7 are connected to each other. The non-covered region 20 is located between the intersections 7 of the fibers 5 of the reticulated fibrous body 50.
    Type: Application
    Filed: November 27, 2020
    Publication date: December 8, 2022
    Applicant: UNITED PRECISION TECHNOLOGIES CO., LTD.
    Inventors: SATOSHI OSAWA, HIDEKI SATO, SHUJI KUNIOKA, HIROKI YOSHIOKA
  • Publication number: 20140350981
    Abstract: In the present invention, the allocation process of a service provider to a target case, which is performed for each case unit, is performed by calculating the grace period for extending the allocation process, and controlling the allocation to cases, including the target case, according to the state relating to allocation of the other cases while reflecting the service request level including the compatibility between the other service providers and the user in the grace period.
    Type: Application
    Filed: May 27, 2014
    Publication date: November 27, 2014
    Applicant: HITACHI, LTD.
    Inventors: Tadaoki UESUGI, Satoshi OSAWA, Yukinori TERAHAMA
  • Patent number: 8870592
    Abstract: A socket for providing an electric connection between a package and an electronic circuit board, the socket includes a package mounting area in which the package is mounted and an isotropic elastic body provided on the package mounting area and having a continuous shape along four side walls of the package so as to press the four side walls of the package.
    Type: Grant
    Filed: September 12, 2011
    Date of Patent: October 28, 2014
    Assignee: Fujitsu Limited
    Inventors: Yasushi Masuda, Akira Tamura, Satoshi Osawa
  • Patent number: 8230901
    Abstract: An electronic device cooling apparatus includes a cooling unit that is thermally connected to an electronic device and is configured to induce heat generated from the electronic device to be conducted to a cooling medium that is channeled into the cooling unit; and a heat dissipating unit including a cooling chamber configured to cool the cooling medium that is heated by the heat conducted from the electronic device. The cooling unit and the heat dissipating unit are integrated.
    Type: Grant
    Filed: March 7, 2006
    Date of Patent: July 31, 2012
    Assignee: Fujitsu Limited
    Inventor: Satoshi Osawa
  • Publication number: 20120129361
    Abstract: A socket for providing an electric connection between a package and an electronic circuit board, the socket includes a package mounting area in which the package is mounted and an isotropic elastic body provided on the package mounting area and having a continuous shape along four side walls of the package so as to press the four side walls of the package.
    Type: Application
    Filed: September 12, 2011
    Publication date: May 24, 2012
    Applicant: FUJITSU LIMITED
    Inventors: Yasushi MASUDA, Akira TAMURA, Satoshi OSAWA
  • Patent number: 8113887
    Abstract: There is provided a card connector for electrically coupling a card with a motherboard. The card connector includes a housing to and from which a contact pad of the card is inserted and ejected, where the housing is mountable on the motherboard; a pair of contacts is configured to hold the card between the pair of the contacts and to be electrically coupled with the contact pads of the card inserted into the housing, and extend in a first direction, and a pair of urging members is configured in the housing to force the pair of the contacts toward the card and extend in a second direction opposite to the first direction.
    Type: Grant
    Filed: September 21, 2010
    Date of Patent: February 14, 2012
    Assignee: Fujitsu Limited
    Inventors: Satoshi Osawa, Akira Tamura
  • Publication number: 20110070749
    Abstract: There is provided a card connector for electrically coupling a card with a motherboard. The card connector includes a housing to and from which a contact pad of the card is inserted and ejected, where the housing is mountable on the motherboard; a pair of contacts is configured to hold the card between the pair of the contacts and to be electrically coupled with the contact pads of the card inserted into the housing, and extend in a first direction, and a pair of urging members is configured in the housing to force the pair of the contacts toward the card and extend in a second direction opposite to the first direction.
    Type: Application
    Filed: September 21, 2010
    Publication date: March 24, 2011
    Applicant: FUJITSU LIMITED
    Inventors: Satoshi OSAWA, Akira TAMURA
  • Publication number: 20070119571
    Abstract: An electronic device cooling apparatus is disclosed that includes a cooling unit that is thermally connected to an electronic device and is configured to induce heat generated from the electronic device to be conducted to a cooling medium that is channeled into the cooling unit; and a heat dissipating unit including a cooling chamber configured to cool the cooling medium that is heated by the heat conducted from the electronic device, wherein the cooling unit and the heat dissipating unit are integrated.
    Type: Application
    Filed: March 7, 2006
    Publication date: May 31, 2007
    Applicant: FUJITSU LIMITED
    Inventor: Satoshi Osawa
  • Patent number: 6410983
    Abstract: A plurality of multi-chip modules are incorporated in a semiconductor device. Each of the multi-chip modules has a plurality of functional parts mounted on a circuit board. A flexible wiring board connects the multi-chip modules to each other. An interface part is mounted on the flexible wiring board so as to control input and output signals of the multi-chip modules.
    Type: Grant
    Filed: February 24, 2000
    Date of Patent: June 25, 2002
    Assignee: Fujitsu Limited
    Inventors: Kiyokazu Moriizumi, Satoshi Osawa
  • Patent number: 6300678
    Abstract: There is provided an I/O pin by which an MCM is positively prevented from being damaged by solder flowing from the fore end to the base of the I/O pin when the I/O pin is soldered in the case of mounting the MCM. An I/O pin used for an electrical connection is provided, one end of which is perpendicularly fixed to an MCM and the other end of which is soldered to a predetermined position on the mother board in the case of mounting the MCM on the mother board. In an intermediate portion of the I/O pin, there is formed a solder dam composed of a plated layer of Ni of low solder wettability, a layer of highly heat-resistant resin or a layer of high-temperature solder.
    Type: Grant
    Filed: November 2, 1998
    Date of Patent: October 9, 2001
    Assignee: Fujitsu Limited
    Inventors: Mitsuo Suehiro, Satoshi Osawa, Shunichi Kikuchi
  • Patent number: 5259818
    Abstract: An intermediate shaft comprising a shaft body including an axle portion and a portion having an approximately elliptic shape of cross section, both major and minor axes of the elliptical cross-section portion being longer than a diameter of the axle portion, and a ring-shaped member with a cross-sectional shape analogous to the elliptic cross-section portion. A method for assembling this shaft provides for a vibration damping member intervened between the housing member and elliptic cross-section portion for damping vibrations transmitted from the steering gear box. This method also ensures that the housing and the vibration damping members and the elliptic cross-section portion are fitted into an outer tubular envelope, and the ring-shaped member normally has a gap against the outer tubular envelope and transmits rotational torque from the outer tubular envelope to the elliptic cross-section portion when the ring-shaped member is contacted with the outer tubular envelope.
    Type: Grant
    Filed: April 11, 1990
    Date of Patent: November 9, 1993
    Assignees: Fuji Kiko Company, Limited, Nissan Motor Company, Limited
    Inventors: Shogo Kachi, Shigeru Saitoh, Naoki Yuzuriha, Hideya Yamashita, Satoshi Osawa
  • Patent number: 5174409
    Abstract: A safety system for protecting a driver of a vehicle has a single continuous safety cable designed to retract a steering column and at the same time pull a driver's seat belt when an engine is shoved rearward in a head-on collision of the vehicle. A cable portion for pulling the steering column is connected in series with a cable portion for pulling the seat belt so that the steering column is retracted only when the driver's seat belt is fastened. When the driver's seat belt is fastened, the safety cable system protects the driver by increasing the seat belt tension and retracting the steering column. When the driver's seat belt is not fastened, the safety cable system leaves the steering column at its normal position to absorb impact energy of a secondary collision of the driver against the steering wheel.
    Type: Grant
    Filed: September 13, 1991
    Date of Patent: December 29, 1992
    Assignee: Nissan Motor Co. Ltd.
    Inventor: Satoshi Osawa
  • Patent number: 4809960
    Abstract: A bushing assembly for use in a suspension of an automotive vehicle. The bushing assembly is comprised of inner and outer cylinder members which are coaxial and spaced from each other. An elastic member and a rigid sleeve member are disposed between the inner and outer cylinder members. A sliding member is disposed between the inner cylinder member and the rigid sleeve member in order to reduce torsion spring effect of the elastic member. The sliding member is prevented from its axial displacement upon contacting with a radially outwardly extending retainer section formed in the inner cylinder member. Additionally, a generally cap-shaped seal rubber is provided to accomplish seal between the end section of the rigid sleeve member and the end section of the inner cylinder member.
    Type: Grant
    Filed: March 25, 1988
    Date of Patent: March 7, 1989
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Toshihiko Kakimoto, Satoshi Osawa