Patents by Inventor Satoshi Ozeki

Satoshi Ozeki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10388841
    Abstract: A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: August 20, 2019
    Assignee: LG Innotek Co., Ltd.
    Inventors: Byung Mok Kim, Hiroshi Kodaira, Su Jung Jung, Bo Hee Kang, Young Jin No, Yuichiro Tanda, Satoshi Ozeki
  • Publication number: 20190135677
    Abstract: The present invention relates to a mold including a master mold having a first region master mold molding surface having a shape corresponding to a first region of a molded body, and a second region master mold molding surface having a shape corresponding to a second region of the molded body, and in which the master mold includes: an inner mold having the first region master mold molding surface; an outer mold having an accommodating concave portion capable of accommodating the inner mold therein and the second region master mold molding surface on at least a part of an outer edge of the accommodating concave portion; and a buffer material provided between the inner mold and a bottom surface of the accommodating concave portion, the buffer material being pressed and deformed with relative movement of the inner mold and the outer mold.
    Type: Application
    Filed: November 8, 2018
    Publication date: May 9, 2019
    Applicant: AGC INC.
    Inventors: Takanori FUKUSHI, Satoshi KANASUGI, Masao OZEKI
  • Publication number: 20180261740
    Abstract: An ultraviolet light emitting device package can include a first conductive member and second conductive members; a light emitting device to emit ultraviolet light and disposed on the first conductive member; an aluminum reflector on the second conductive members, the aluminum reflector having a hollow portion in which the light emitting device is disposed, and configured to reflect ultraviolet light emitted from the light emitting device; a cover glass on the aluminum reflector and the light emitting device; and an insulator between the aluminum reflector and the second conductive members, in which the first conductive member is insulated from the light emitting device and the second conductive members, a middle area of the first conductive member corresponds to a middle area of the hollow portion, the light emitting device is disposed on the middle area of the first conductive member, the second conductive members are disposed on both sides of the first conductive member, symmetrically, and the second condu
    Type: Application
    Filed: May 10, 2018
    Publication date: September 13, 2018
    Applicant: LG Innotek Co., Ltd.
    Inventors: Satoshi OZEKI, Yuichiro TANDA
  • Patent number: 9991429
    Abstract: A light emitting device package may be provided that includes: a lead frame; a light emitting device disposed on the lead frame; a metallic reflector which is disposed on the lead frame, has a hollow portion in which the light emitting device is disposed, reflects light emitted from the light emitting device, and is formed by a mold; and a resin body which surrounds the lead frame and the reflector. The resin body includes an insulation layer disposed between the lead frame and the reflector, and a protrusion disposed on the reflector.
    Type: Grant
    Filed: July 8, 2015
    Date of Patent: June 5, 2018
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Satoshi Ozeki, Yuichiro Tanda
  • Publication number: 20180130934
    Abstract: A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body.
    Type: Application
    Filed: January 5, 2018
    Publication date: May 10, 2018
    Inventors: Byung Mok KIM, Hiroshi KODAIRA, Su Jung JUNG, Bo Hee KANG, Young Jin NO, Yuichiro TANDA, Satoshi OZEKI
  • Patent number: 9893259
    Abstract: A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body.
    Type: Grant
    Filed: June 21, 2013
    Date of Patent: February 13, 2018
    Assignee: LG Innotek Co., Ltd.
    Inventors: Byung Mok Kim, Hiroshi Kodaira, Su Jung Jung, Bo Hee Kang, Young Jin No, Yuichiro Tanda, Satoshi Ozeki
  • Patent number: 9887324
    Abstract: A light emitting device package is disclosed. The light emitting device package includes a package body including at least one ceramic layer, a submount disposed at the package body, a light emitting device disposed on the submount for emitting ultraviolet (UV)-wavelength light, and an anti-reflection (AR) coating layer disposed around the light emitting device, the AR coating layer being formed of an inorganic coating layer.
    Type: Grant
    Filed: September 12, 2014
    Date of Patent: February 6, 2018
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Baek Jun Kim, Hiroshi Kodaira, Byung Mok Kim, Ha Na Kim, Yuichiro Tanda, Satoshi Ozeki
  • Patent number: 9842975
    Abstract: A light emitting device package including a package body including a first cavity and a second cavity, a pad disposed on a bottom surface of the first cavity, a light emitting device disposed on the second cavity electrically connected to the pad, a heat dissipation member inserted into the package body, the heat dissipation member including a body and expanded portions disposed at a partial edge region of the body and electrode patterns disposed at the package body, wherein the package body has an upper portion and a lower portion disposed under the upper portion, wherein the first cavity including side surfaces and a bottom surface, wherein the second cavity provided in the bottom surface of the first cavity.
    Type: Grant
    Filed: March 28, 2016
    Date of Patent: December 12, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Byung Mok Kim, Bo Hee Kang, Ha Na Kim, Hiroshi Kodaira, Yuichiro Tanda, Satoshi Ozeki
  • Patent number: 9831406
    Abstract: A light emitting device package including a package body including a first cavity and a second cavity, a pad disposed on a bottom surface of the first cavity, a light emitting device disposed on the second cavity electrically connected to the pad, a heat dissipation member inserted into the package body, the heat dissipation member including a body and expanded portions disposed at a partial edge region of the body and electrode patterns disposed at the package body, wherein the package body has an upper portion and a lower portion disposed under the upper portion, wherein the first cavity including side surfaces and a bottom surface, wherein the second cavity provided in the bottom surface of the first cavity.
    Type: Grant
    Filed: June 3, 2015
    Date of Patent: November 28, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Byung Mok Kim, Bo Hee Kang, Ha Na Kim, Hiroshi Kodaira, Yuichiro Tanda, Satoshi Ozeki
  • Patent number: 9726334
    Abstract: A lighting unit includes a board on which a light emitting portion having a semiconductor light emitting device is arrayed on an upper side along the longitudinal direction. The lighting unit also includes a reflector which is disposed on the upper side of the board, and has a reflection portion inside the reflector for reflecting a light from the light emitting portion, as well as covering the light emitting portion. The lighting unit further includes a case disposed so as to support the board and the reflector from the top and the bottom.
    Type: Grant
    Filed: October 6, 2014
    Date of Patent: August 8, 2017
    Assignee: Nichia Corporation
    Inventors: Satoshi Ozeki, Hiroshi Miyairi, Masato Ono
  • Patent number: 9673357
    Abstract: An embodiment relates to a light-emitting device package. In an embodiment, the light-emitting device package includes a package body configured to include a top surface, a plate guide unit disposed on the top surface, and a cavity formed in the top surface, a light-emitting device disposed within the cavity, a plate disposed on the top surface of the package body and guided by the plate guide unit, and an adhesive member disposed between the top surface of the package body and the plate. The adhesive member includes a base layer made of a flexible material, a first adhesive tape disposed between the base layer and the top surface of the package body and bonded to the base layer and the top surface of the package body, and a second adhesive tape disposed between the base layer and the plate and bonded to the base layer and the plate.
    Type: Grant
    Filed: November 27, 2015
    Date of Patent: June 6, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Satoshi Ozeki, Yuichiro Tanda
  • Patent number: 9508906
    Abstract: A light emitting device package may be provided that includes: a lead frame which includes a first frame and a second frame disposed on both sides of the first frame respectively; a light emitting device which is disposed on the first frame and is electrically connected to the second frame; and a resin body which includes a first resin body which is disposed between the first frame and the second frame, and a second resin body which covers an outer surface of the lead frame. An end of the first frame and an end of the second frame are disposed on an outer surface of the second resin body.
    Type: Grant
    Filed: July 8, 2015
    Date of Patent: November 29, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Satoshi Ozeki, Yuichiro Tanda
  • Publication number: 20160211429
    Abstract: A light emitting device package including a package body including a first cavity and a second cavity, a pad disposed on a bottom surface of the first cavity, a light emitting device disposed on the second cavity electrically connected to the pad, a heat dissipation member inserted into the package body, the heat dissipation member including a body and expanded portions disposed at a partial edge region of the body and electrode patterns disposed at the package body, wherein the package body has an upper portion and a lower portion disposed under the upper portion, wherein the first cavity including side surfaces and a bottom surface, wherein the second cavity provided in the bottom surface of the first cavity.
    Type: Application
    Filed: March 28, 2016
    Publication date: July 21, 2016
    Applicant: LG Innotek Co., Ltd.
    Inventors: Byung Mok KIM, Bo Hee KANG, Ha Na KIM, Hiroshi KODAIRA, Yuichiro TANDA, Satoshi OZEKI
  • Publication number: 20160155907
    Abstract: An embodiment relates to a light-emitting device package. In an embodiment, the light-emitting device package includes a package body configured to include a top surface, a plate guide unit disposed on the top surface, and a cavity formed in the top surface, a light-emitting device disposed within the cavity, a plate disposed on the top surface of the package body and guided by the plate guide unit, and an adhesive member disposed between the top surface of the package body and the plate. The adhesive member includes a base layer made of a flexible material, a first adhesive tape disposed between the base layer and the top surface of the package body and bonded to the base layer and the top surface of the package body, and a second adhesive tape disposed between the base layer and the plate and bonded to the base layer and the plate.
    Type: Application
    Filed: November 27, 2015
    Publication date: June 2, 2016
    Applicant: LG Innotek Co., Ltd.
    Inventors: Satoshi OZEKI, Yuichiro TANDA
  • Patent number: 9337403
    Abstract: Disclosed is a light emitting device package with improved light extraction efficiency. The light emitting device package includes a substrate, a light emitting device disposed on the substrate, and a light transmission unit disposed above the light emitting device, the light transmission unit being spaced from the light emitting device, wherein a distance between an upper surface of the light emitting device and the light transmission unit is 0.15 mm to 0.35 mm.
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: May 10, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Byung Mok Kim, Hiroshi Kodaira, Ha Na Kim, Yuichiro Tanda, Satoshi Ozeki
  • Publication number: 20160013377
    Abstract: A light emitting device package may be provided that includes: a lead frame which includes a first frame and a second frame disposed on both sides of the first frame respectively; a light emitting device which is disposed on the first frame and is electrically connected to the second frame; and a resin body which includes a first resin body which is disposed between the first frame and the second frame, and a second resin body which covers an outer surface of the lead frame. An end of the first frame and an end of the second frame are disposed on an outer surface of the second resin body.
    Type: Application
    Filed: July 8, 2015
    Publication date: January 14, 2016
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Satoshi OZEKI, Yuichiro TANDA
  • Publication number: 20160013382
    Abstract: A light emitting device package may be provided that includes: a lead frame; a light emitting device disposed on the lead frame; a metallic reflector which is disposed on the lead frame, has a hollow portion in which the light emitting device is disposed, reflects light emitted from the light emitting device, and is formed by a mold; and a resin body which surrounds the lead frame and the reflector. The resin body includes an insulation layer disposed between the lead frame and the reflector, and a protrusion disposed on the reflector.
    Type: Application
    Filed: July 8, 2015
    Publication date: January 14, 2016
    Applicant: LG Innotek Co., Ltd.
    Inventors: Satoshi OZEKI, Yuichiro TANDA
  • Publication number: 20150270463
    Abstract: A light emitting device package including a package body including a first cavity and a second cavity, a pad disposed on a bottom surface of the first cavity, a light emitting device disposed on the second cavity electrically connected to the pad, a heat dissipation member inserted into the package body, the heat dissipation member including a body and expanded portions disposed at a partial edge region of the body and electrode patterns disposed at the package body, wherein the package body has an upper portion and a lower portion disposed under the upper portion, wherein the first cavity including side surfaces and a bottom surface, wherein the second cavity provided in the bottom surface of the first cavity.
    Type: Application
    Filed: June 3, 2015
    Publication date: September 24, 2015
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Byung Mok KIM, Bo Hee KANG, Ha Na KIM, Hiroshi KODAIRA, Yuichiro TANDA, Satoshi OZEKI
  • Patent number: 9076949
    Abstract: A light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, and an anti-fracture layer placed on the heat dissipation member, wherein a width of the heat dissipation member is different at different heights of the package body.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: July 7, 2015
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Byung Mok Kim, Bo Hee Kang, Ha Na Kim, Hiroshi Kodaira, Yuichiro Tanda, Satoshi Ozeki
  • Publication number: 20150102375
    Abstract: A light emitting device package is disclosed. The light emitting device package includes a package body including at least one ceramic layer, a submount disposed at the package body, a light emitting device disposed on the submount for emitting ultraviolet (UV)-wavelength light, and an anti-reflection (AR) coating layer disposed around the light emitting device, the AR coating layer being formed of an inorganic coating layer.
    Type: Application
    Filed: September 12, 2014
    Publication date: April 16, 2015
    Inventors: Baek Jun KIM, Hiroshi Kodaira, Byung Mok Kim, Ha Na Kim, Yuichiro Tanda, Satoshi Ozeki