Patents by Inventor Satoshi RIKIMARU

Satoshi RIKIMARU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing soundproof material
    Patent number: 12115705
    Abstract: A soundproof material includes rubber sponge having a specific gravity of 0.2 or less, which is formed by extrusion molding and a subsequent crosslinking and foaming of a rubber composition using a microwave heating device. The rubber composition includes at least raw material rubber, a crosslinking agent, a foaming agent, and carbon black. The soundproof material has a rectangular cross-sectional outer shape, has at least two hollow parts inside formed by a lateral partition wall extending in a left-right lateral direction and at least two hollow parts formed by a vertical partition wall extending in a vertical direction. The method includes adding carbon nanotubes to the rubber composition.
    Type: Grant
    Filed: November 30, 2022
    Date of Patent: October 15, 2024
    Assignee: NISHIKAWA RUBBER CO., LTD.
    Inventors: Yuzo Hirakawa, Satoshi Rikimaru
  • METHOD OF MANUFACTURING SOUNDPROOF MATERIAL
    Publication number: 20230173721
    Abstract: A soundproof material includes rubber sponge having a specific gravity of 0.2 or less, which is formed by extrusion molding and a subsequent crosslinking and foaming of a rubber composition using a microwave heating device. The rubber composition includes at least raw material rubber, a crosslinking agent, a foaming agent, and carbon black. The soundproof material has a rectangular cross-sectional outer shape, has at least two hollow parts inside formed by a lateral partition wall extending in a left-right lateral direction and at least two hollow parts formed by a vertical partition wall extending in a vertical direction. The method includes adding carbon nanotubes to the rubber composition.
    Type: Application
    Filed: November 30, 2022
    Publication date: June 8, 2023
    Inventors: Yuzo HIRAKAWA, Satoshi RIKIMARU