Abstract: According to one embodiment, a management apparatus includes a processor comprising hardware. The processor calculates, based on information on two or more parameters for production of a part and an evaluation value for a quality of the part produced, a prediction formula representing a relationship between the quality and the parameters. The processor calculates, based on the prediction formula, an optimum value for the parameters. The processor causes a display to display a graph indicative of a relationship between the prediction formula and the optimum value.

Abstract: An injection molding machine according to an embodiment includes an injection mechanism and an injection mold. The injection mechanism injects resin. The injection mold includes a fixed part and a movable part. The fixed part includes a resin injection port through which resin injected by the injection mechanism enters. The movable part serves to mold the entered resin. The resin fills a cavity between the fixed part and the movable part. The injection mold includes a sprue, a back-flow prevention mechanism, and a heater. The sprue is provided in the fixed part. The sprue allows resin to enter the cavity through the sprue. The sprue has a taper shape tapered off toward the resin injection port. The back-flow prevention mechanism serves to block resin flowing back through the sprue from the cavity toward the resin injection port. The heater serves to keep resin in a molten state.

Abstract: An injection molding apparatus according to an embodiment is configured to mold a thermoplastic resin into a thick-walled component by injection molding. The injection molding apparatus includes a mold having a cavity and a core; and a controller configured to control an operation of the mold. The controller is capable of performing a filling and pressure holding process of filling the thermoplastic resin between the cavity and the core in a state in which a distance between the cavity and the core is increased, and a cooling and solidifying process of cooling and solidifying the filled thermoplastic resin while pressurizing the filled thermoplastic resin by decreasing the distance between the cavity and the core. The controller stacks the thermoplastic resin by performing an operation set including the filling and pressure holding process and the cooling and solidifying process a plurality of times.

Abstract: According to one embodiment, a three-dimensional object includes a periodic structure. The periodic structure includes a plurality of unit objects which form a plurality of stepped structures connected to each other. In each of the stepped structures, the unit objects are connected together in a stepwise form along a polygonal spiral trajectory around a unit axis. In each of the stepped structures, the unit axis extends in a first direction. The stepped structures are each provided with a unit channel extending along the connected unit objects of the stepwise form. The periodic structure is provided with a channel in communication with an outside of the periodic structure, the channel including the unit channels.

Abstract: According to one embodiment, an operating state management device includes a first memory, a processor, and a second memory. The first memory is configured to store, in each of a plurality of operating state management target devices, feature patterns of detection states of a plurality of sensors that detect states of individual components in association with operating states. The processor is configured to compare patterns corresponding to actual detection states of the plurality of sensors with the feature patterns stored in the first memory, and determine operating states. The second memory is configured to store the determined operating states in time series.

Abstract: According to one embodiment, a semiconductor device includes a first electrical conductor, a second electrical conductor, first and second semiconductors between the first and second electrical conductors, a first power terminal, a second power terminal, a signal terminal, and an insulator which covers the components. The insulator includes a flat bottom surface in which the first and second electrical conductors are exposed, a ceiling surface, a first end surface, and a second end surface. The power terminals and the signal terminal extend outwardly from the first and second end surfaces, and the ceiling surface, respectively. The first end surface, the ceiling surface, and the second end surface are formed with a parting line.

Abstract: According to one embodiment, a semiconductor device includes: a heat sink; a semiconductor element provided on a mounting surface of the heat sink; and a sealing body wrapping the heat sink and the semiconductor element, a thickness of a portion of the sealing body on a side of a surface on an opposite side to the mounting surface of the heat sink being smaller than a thickness of a portion of the sealing body on the mounting surface side of the heat sink. A first concave-convex is provided on the surface on an opposite side to the mounting surface of the heat sink. A second concave-convex larger than the first concave-convex is provided on a surface crossing the surface on an opposite side to the mounting surface of the heat sink.

Abstract: According to one embodiment, a semiconductor device includes a first electrical conductor, a second electrical conductor, first and second semiconductors between the first and second electrical conductors, a first power terminal, a second power terminal, a signal terminal, and an insulator which covers the components. The insulator includes a flat bottom surface in which the first and second electrical conductors are exposed, a ceiling surface, a first end surface, and a second end surface. The power terminals and the signal terminal extend outwardly from the first and second end surfaces, and the ceiling surface, respectively. The first end surface, the ceiling surface, and the second end surface are formed with a parting line.