Abstract: A printing apparatus prints by discharging ink to a transfer member from a first printhead, discharging a transfer accelerator to the ink from a second printhead, and transferring an image formed on the transfer member to a print medium. When inspecting a discharge state of each of plural nozzles provided in each of the first and second printheads, the apparatus controls the second printhead so as to discharge the transfer accelerator from at least one nozzle of the second printhead to a discharge area of the transfer member to which the ink is discharged by the first printhead for inspection of the discharge states of the plural nozzles of the first printhead, while inspecting a discharge state of a nozzle different from the at least one nozzle of the second printhead by discharging the transfer accelerator from the nozzle.

Abstract: The invention provides a piezoelectric device having a structure which resists impact from the exterior of the device, and stress applied to a piezoelectric resonator element, and which can enhance electrical conductance between an electrode side of a package base and the piezoelectric resonator element, and to provide a manufacturing method therefor. A piezoelectric device having a structure in which a piezoelectric resonator element is bonded to electrodes provided on a package base, includes mounting electrodes, which are provided on the package base, to which a driving voltage is carried, via conduction paths, and on which the piezoelectric resonator element is mounted; and anchor members, which are disposed on the surfaces of the mounting electrodes, and which are formed of a material having superior adhesion to the surfaces thereof, in which the piezoelectric resonator element is bonded to these conductive anchor members with silicone-based conductive adhesives provided therebetween.

Abstract: The invention provides a piezoelectric device having a structure which resists impact from the exterior of the device, and stress applied to a piezoelectric resonator element, and which can enhance electrical conductance between an electrode side of a package base and the piezoelectric resonator element, and to provide a manufacturing method therefor. A piezoelectric device having a structure in which a piezoelectric resonator element is bonded to electrodes provided on a package base, includes mounting electrodes, which are provided on the package base, to which a driving voltage is carried, via conduction paths, and on which the piezoelectric resonator element is mounted; and anchor members, which are disposed on the surfaces of the mounting electrodes, and which are formed of a material having superior adhesion to the surfaces thereof, in which the piezoelectric resonator element is bonded to these conductive anchor members with silicone-based conductive adhesives provided therebetween.

Abstract: The invention provides a piezoelectric device having a structure which resists impact from the exterior and which can enhance electrical conductance between an electrode side of a package base and a piezoelectric resonator element. A piezoelectric device having a structure in which a piezoelectric resonator element is bonded to electrodes provided on a package base, includes underlying exposed electrodes as mounting electrodes which are provided on the package base and on which the piezoelectric resonator element is mounted; and gold-plated electrodes which are provided on the package base and to which a driving voltage is carried via conduction paths; in which the underlying exposed electrodes and the gold-plated electrodes are connected to each other with conductive adhesives provided therebetween, and the piezoelectric resonator element is bonded to the underlying exposed electrodes with silicone-based conductive adhesives provided therebetween.

Abstract: The invention provides a piezoelectric device having a structure which resists impact from the exterior and which can enhance electrical conductance between an electrode side of a package base and a piezoelectric resonator element. A piezoelectric device having a structure in which a piezoelectric resonator element is bonded to electrodes provided on a package base, includes underlying exposed electrodes as mounting electrodes which are provided on the package base and on which the piezoelectric resonator element is mounted; and gold-plated electrodes which are provided on the package base and to which a driving voltage is carried via conduction paths; in which the underlying exposed electrodes and the gold-plated electrodes are connected to each other with conductive adhesives provided therebetween, and the piezoelectric resonator element is bonded to the underlying exposed electrodes with silicone-based conductive adhesives provided therebetween.