Patents by Inventor Satoshi Shibazaki

Satoshi Shibazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Component built-in wiring board and manufacturing method of component built-in wiring board
    Patent number: 7644497
    Abstract: To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating-reliability.
    Type: Grant
    Filed: January 17, 2008
    Date of Patent: January 12, 2010
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Tatsuro Imamura, Yuji Yamaguchi, Kazuhiro Shinozaki, Satoshi Shibazaki, Yoshitaka Fukuoka, Hiroyuki Hirai, Osamu Shimada, Kenji Sasaoka, Kenichi Matsumura
  • Component built-in wiring board and manufacturing method of component built-in wiring board
    Publication number: 20080163486
    Abstract: To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating-reliability.
    Type: Application
    Filed: January 17, 2008
    Publication date: July 10, 2008
    Applicant: Dai Nippon Printing Co., Ltd
    Inventors: Tatsuro Imamura, Yuji Yamaguchi, Kazuhiro Shinozaki, Satoshi Shibazaki, Yoshitaka Fukuoka, Hiroyuki Hirai, Osamu Shimada, Kenji Sasaoka, Kenichi Matsumura
  • Component built-in wiring board and manufacturing method of component built-in wiring board
    Patent number: 7345888
    Abstract: To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability.
    Type: Grant
    Filed: April 19, 2007
    Date of Patent: March 18, 2008
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Tatsuro Imamura, Yuji Yamaguchi, Kazuhiro Shinozaki, Satoshi Shibazaki, Yoshitaka Fukuoka, Hiroyuki Hirai, Osamu Shimada, Kenji Sasaoka, Kenichi Matsumura
  • Component built-in wiring board and manufacturing method of component built-in wiring board
    Publication number: 20070195511
    Abstract: To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability.
    Type: Application
    Filed: April 19, 2007
    Publication date: August 23, 2007
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Tatsuro Imamura, Yuji Yamaguchi, Kazuhiro Shinozaki, Satoshi Shibazaki, Yoshitaka Fukuoka, Hiroyuki Hirai, Osamu Shimada, Kenji Sasaoka, Kenichi Matsumura
  • Wiring board incorporating components and process for producing the same
    Patent number: 7242591
    Abstract: To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability.
    Type: Grant
    Filed: October 6, 2003
    Date of Patent: July 10, 2007
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Tatsuro Imamura, Yuji Yamaguchi, Kazuhiro Shinozaki, Satoshi Shibazaki, Yoshitaka Fukuoka, Hiroyuki Hirai, Osamu Shimada, Kenji Sasaoka, Kenichi Matsumura
  • Wiring board incorporating components and process for producing the same
    Publication number: 20060154496
    Abstract: To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability.
    Type: Application
    Filed: October 6, 2003
    Publication date: July 13, 2006
    Inventors: Tatsuro Imamura, Yuji Yamaguchi, Kazuhiro Shinozaki, Satoshi Shibazaki, Yoshitaka Fukuoka, Hiroyuki Hirai, Osamu Shimada, Kenji Sasaoka, Kenichi Matsumura