Patents by Inventor Satoshi Shiozaki
Satoshi Shiozaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240092690Abstract: A resin coating device for coating a surface of a glass fiber, includes: a point having a point hole; a die disposed directly below the point and including a first alignment portion, a second alignment portion, and a first die hole; and a first resin supply path. The second alignment portion is disposed below the first alignment portion. The first alignment portion includes a first diameter-reduced portion, and a first land portion disposed, connected to the first diameter-reduced portion, and having a constant diameter in the traveling direction. The second alignment portion includes a second diameter-reduced portion, and a second land portion, connected to the second diameter-reduced portion, and having a constant diameter in the traveling direction. The first diameter-reduced portion, the first land portion, the second diameter-reduced portion, and the second land portion are each a part of the first die hole.Type: ApplicationFiled: September 19, 2023Publication date: March 21, 2024Inventors: Kazumasa OISHI, Ken MANABE, Manabu SHIOZAKI, Satoshi YOSHIKAWA
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Publication number: 20230309478Abstract: A culturing device is equipped with an accommodation unit, and a convection generating unit provided in the accommodation unit. In the accommodation unit, microalgae are cultured while the convection generating unit generates convection in the culturing solution in the accommodation unit. During the culturing, a portion of the culturing solution is drawn in through collection pipes by the pump. Thereafter, the culturing solution that was drawn in is discharged from the collection pipes into the culturing solution inside the accommodation unit.Type: ApplicationFiled: March 29, 2023Publication date: October 5, 2023Inventors: Minoru Goto, Nozomi Shiobara, Shohei Kinoshita, Mizuho Doi, Kenji Machida, Satoshi Shiozaki
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Publication number: 20230279445Abstract: A mixed gas generated in a methane fermentation tank is supplied to culture tanks. In the culture tanks, water as a culture solution is held and algae are cultured. Carbon dioxide contained in the mixed gas preferentially dissolves in water. That is, carbon dioxide is removed from the mixed gas. As a result, a concentration of methane, which is one component of the mixed gas, increases. The mixed gas is re-supplied to another culture tank or the same culture tank.Type: ApplicationFiled: February 27, 2023Publication date: September 7, 2023Inventors: Minoru Goto, Nozomi Shiobara, Shohei Kinoshita, Mizuho Doi, Kenji Machida, Satoshi Shiozaki
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Publication number: 20220312705Abstract: In a culturing method, microalgae are cultured in a culturing solution while a gas containing carbon dioxide is supplied to the culturing solution. In an ion concentration acquisition step, an acquired value of a concentration of hydrogen carbonate ions in the culturing solution is obtained. In an ion concentration adjustment step, in the case that the acquired value does not reside within a set concentration range that is set beforehand, at least one of a temperature or a pH of the culturing solution is adjusted, whereby the concentration of hydrogen carbonate ions in the culturing solution is adjusted to reside within the set concentration range.Type: ApplicationFiled: February 28, 2022Publication date: October 6, 2022Inventors: Minoru Goto, Nozomi Shiobara, Shohei Kinoshita, Fumitomo Takano, Mizuho Doi, Satoshi Shiozaki, Kenji Machida
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Patent number: 11161310Abstract: This heat-caulking device is inserted into one or more holes penetrating a main plate having a substantially conical hollow portion, whereby one or more bosses of a blade protruding from an inner peripheral surface of the main plate toward the hollow portion are melted so as to join the main plate and the blade. A heat chip of the heat-caulking device has a substantially conical hollow main body portion, an outer peripheral surface of which conforms to the inner peripheral surface of the main plate. On the outer peripheral surface of the main body portion, a convex portion protruding toward the vicinity of the holes of the inner peripheral surface of the main plate is provided.Type: GrantFiled: March 30, 2018Date of Patent: November 2, 2021Assignee: HONDA MOTOR CO., LTD.Inventors: Hiroshi Ishikawa, Yoshinori Tsurugai, Yuichi Tajiri, Shigeto Akahori, Naohiro Ohtsu, Satoshi Shiozaki, Shinzo Urushidani
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Publication number: 20210107234Abstract: This heat-caulking device is inserted into one or more holes penetrating a main plate having a substantially conical hollow portion, whereby one or more bosses of a blade protruding from an inner peripheral surface of the main plate toward the hollow portion are melted so as to join the main plate and the blade. A heat chip of the heat-caulking device has a substantially conical hollow main body portion, an outer peripheral surface of which conforms to the inner peripheral surface of the main plate. On the outer peripheral surface of the main body portion, a convex portion protruding toward the vicinity of the holes of the inner peripheral surface of the main plate is provided.Type: ApplicationFiled: March 30, 2018Publication date: April 15, 2021Inventors: Hiroshi Ishikawa, Yoshinori Tsurugai, Yuichi Tajiri, Shigeto Akahori, Naohiro Ohtsu, Satoshi Shiozaki, Shinzo Urushidani
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Patent number: 10369749Abstract: The first electrode section (7a) and the second electrode section (7b) are formed such that the outer portion connected to the upper portion of the heating section (6) is thinner than the inner portion connected to the lower portion of the heating section (6). The heating section (6) and the first electrode section (7a) are interconnected by an R-shaped first connecting portion (21). The inner circumferential sloping surface of the heating section (6) and the second electrode section (7b) are interconnected by an R-shaped second connecting portion (22). The first and second connecting portions (21)(22) are formed such that R becomes larger from the upper end to the lower end, where the upper portion is thin and the lower portion is thick. The thickness of an intermediate portion (6b) is smaller than the thicknesses of the first and second connecting portions (21)(22).Type: GrantFiled: July 12, 2018Date of Patent: August 6, 2019Assignee: HONDA MOTOR CO., LTD.Inventors: Yoshinori Tsurugai, Hiroshi Ishikawa, Yuichi Tajiri, Shigeto Akahori, Naohiro Ohtsu, Satoshi Shiozaki
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Publication number: 20190022954Abstract: The first electrode section (7a) and the second electrode section (7b) are formed such that the outer portion connected to the upper portion of the heating section (6) is thinner than the inner portion connected to the lower portion of the heating section (6). The heating section (6) and the first electrode section (7a) are interconnected by an R-shaped first connecting portion (21). The inner circumferential sloping surface of the heating section (6) and the second electrode section (7b) are interconnected by an R-shaped second connecting portion (22). The first and second connecting portions (21)(22) are formed such that R becomes larger from the upper end to the lower end, where the upper portion is thin and the lower portion is thick. The thickness of an intermediate portion (6b) is smaller than the thicknesses of the first and second connecting portions (21)(22).Type: ApplicationFiled: July 12, 2018Publication date: January 24, 2019Inventors: Yoshinori Tsurugai, Hiroshi Ishikawa, Yuichi Tajiri, Shigeto Akahori, Naohiro Ohtsu, Satoshi Shiozaki
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Patent number: 7141449Abstract: A method of fabricating a thin-film compound solar cell having an n-type buffer layer formed therein for providing a heterojunction with a p-type compound semiconductor light absorbing layer formed on a back electrode by spreading a powder of a sulfur compound containing n-type doping element over the light absorbing layer surface or applying a coat of a solution of a sulfur compound containing n-type doping element onto the light absorbing layer surface and then fusing the powder or the coat thereon by heat. This process can produce a high-quality n-type buffer layer tightly adhered to a p-type compound semiconductor light absorbing layer to achieve stable characteristic of heterojunction therewith.Type: GrantFiled: December 3, 2004Date of Patent: November 28, 2006Assignee: Honda Giken Kogyo Kabushiki KaishaInventor: Satoshi Shiozaki
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Publication number: 20050161076Abstract: A method of fabricating a thin-film compound solar cell having an n-type buffer layer formed therein for providing a heterojunction with a p-type compound semiconductor light absorbing layer formed on a back electrode by spreading a powder of a sulfur compound containing n-type doping element over the light absorbing layer surface or applying a coat of a solution of a sulfur compound containing n-type doping element onto the light absorbing layer surface and then fusing the powder or the coat thereon by heat. This process can produce a high-quality n-type buffer layer tightly adhered to a p-type compound semiconductor light absorbing layer to achieve stable characteristic of heterojunction therewith.Type: ApplicationFiled: December 3, 2004Publication date: July 28, 2005Inventor: Satoshi Shiozaki
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Publication number: 20050095809Abstract: A method and apparatus for forming a transparent electrode layer of a thin-film compound semiconductor solar cell by using only a direct-current sputtering system, wherein a preliminary layer is formed in a first process by direct-current sputtering from a target by supplying thereto a specified low electric power preset so as not to damage the substrate by sputters and a complete layer is deposited thereon in a second process by sputtering from the same target by supplying a high electric power. The same layer is also formed by direct-current sputtering from a pair of oppositely disposed targets of the same material. The method and apparatus are capable of easily forming a high quality transparent electrode layer at an increased speed.Type: ApplicationFiled: July 12, 2002Publication date: May 5, 2005Inventors: Yuji Nakayama, Satoshi Shiozaki
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Patent number: 5755620Abstract: There is provided a game system in which a virtual object such as a car is moved in virtual surroundings on a screen of a display. The system comprises an input device for providing from a player operating information concerning an expected motion of the object and an element for simulating the motion of the object in response to the provided information and in consideration of interaction forces between the object and the surroundings. The interaction forces are operated at least two positions of the object. The simulated results of the object Is displayed on the screen of the display.Type: GrantFiled: January 31, 1996Date of Patent: May 26, 1998Assignee: Kabushiki Kaisha Sega EnterprisesInventors: Sohei Yamamoto, Kenichi Yamamoto, Shinobu Hayashi, Satoshi Shiozaki