Patents by Inventor Satoshi SHIRAHAMA
Satoshi SHIRAHAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220140211Abstract: A light emitting device includes a substrate, a reflective resin layer, and a light emitting element. The reflective resin layer is disposed on the substrate and contains a first reflective material and a first resin. The reflective resin layer including first flat part having a first thickness, a second flat part having a second thickness smaller than the first thickness, and a protruded part having a third thickness larger than the first thickness. The light emitting element is disposed on the second flat part of the reflective resin layer, with a portion of a lateral face of the protruded part of the reflective resin layer being in contact with a portion of a lateral face of the light emitting element.Type: ApplicationFiled: October 27, 2021Publication date: May 5, 2022Inventor: Satoshi SHIRAHAMA
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Patent number: 9905740Abstract: A light emitting device includes a light emitting element, a light-reflecting substrate, and an electrically conductive member. The light emitting element includes a first surface and an electrode provided on the first surface. The light-reflecting substrate has a first main surface facing the first surface of the light emitting element and has a second main surface opposite to the first main surface. The light-reflecting substrate defines a hole at a position corresponding to the electrode. The hole penetrates through the light-reflecting substrate from the first main surface to the second main surface. The electrically conductive member includes a substantially spherical core arranged in the hole and bonded with the electrode, and a coating portion provided in a space between the substantially spherical core and a lateral surface of the hole.Type: GrantFiled: December 21, 2015Date of Patent: February 27, 2018Assignee: NICHIA CORPORATIONInventor: Satoshi Shirahama
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Patent number: 9631797Abstract: A light emitting device has a plurality of light emitting elements, a heat spreading member on which the plurality of light emitting elements are mounted, and having a bottom face, an insulating member having a recess that includes side walls and a bottom wall, a top face of the bottom wall being in contact with the bottom face of the heat spreading member, and a circuit board having a circuit that is provided on the heat spreading member and supplies power to the plurality of light emitting elements.Type: GrantFiled: November 18, 2014Date of Patent: April 25, 2017Assignee: NICHIA CORPORATIONInventors: Hiroshi Miyairi, Takayuki Igarashi, Masato Fujitomo, Satoshi Shirahama
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Patent number: 9466770Abstract: A method for manufacturing a light emitting device having a light emitting element and a resin layer containing fluorescent material particles and a filler which reflects light comprises a fluorescent material precipitation process for precipitating the fluorescent material particles in advance of the filler. A light emitting device comprises a base body; a light emitting element mounted on an upper surface of the base body via a mounting portion; and a sealing resin for sealing the light emitting element. The sealing resin comprises: a fluorescent material-containing first layer for covering the light emitting element on and above the mounting portion, a fluorescent material-containing second layer formed on an upper surface of the base body around the mounting portion, and a filler-containing layer formed on the fluorescent material-containing second layer around the mounting portion.Type: GrantFiled: February 11, 2016Date of Patent: October 11, 2016Assignee: NICHIA CORPORATIONInventors: Takashi Sato, Satoshi Shirahama
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Publication number: 20160197249Abstract: A method for manufacturing a light emitting device having a light emitting element and a resin layer containing fluorescent material particles and a filler which reflects light comprises a fluorescent material precipitation process for precipitating the fluorescent material particles in advance of the filler. A light emitting device comprises a base body; a light emitting element mounted on an upper surface of the base body via a mounting portion; and a sealing resin for sealing the light emitting element. The sealing resin comprises: a fluorescent material-containing first layer for covering the light emitting element on and above the mounting portion, a fluorescent material-containing second layer formed on an upper surface of the base body around the mounting portion, and a filler-containing layer formed on the fluorescent material-containing second layer around the mounting portion.Type: ApplicationFiled: February 11, 2016Publication date: July 7, 2016Applicant: Nichia CorporationInventors: Takashi SATO, Satoshi SHIRAHAMA
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Publication number: 20160190395Abstract: A light emitting device includes a light emitting element, a light-reflecting substrate, and an electrically conductive member. The light emitting element includes a first surface and an electrode provided on the first surface. The light-reflecting substrate has a first main surface facing the first surface of the light emitting element and has a second main surface opposite to the first main surface. The light-reflecting substrate defines a hole at a position corresponding to the electrode. The hole penetrates through the light-reflecting substrate from the first main surface to the second main surface. The electrically conductive member includes a substantially spherical core arranged in the hole and bonded with the electrode, and a coating portion provided in a space between the substantially spherical core and a lateral surface of the hole.Type: ApplicationFiled: December 21, 2015Publication date: June 30, 2016Applicant: NICHIA CORPORATIONInventor: Satoshi SHIRAHAMA
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Patent number: 9295132Abstract: A method for manufacturing a light emitting device having a light emitting element and a resin layer containing fluorescent material particles and a filler which reflects light comprises a fluorescent material precipitation process for precipitating the fluorescent material particles in advance of the filler. A light emitting device comprises a base body; a light emitting element mounted on an upper surface of the base body via a mounting portion; and a sealing resin for sealing the light emitting element. The sealing resin comprises: a fluorescent material-containing first layer for covering the light emitting element on and above the mounting portion, a fluorescent material-containing second layer formed on an upper surface of the base body around the mounting portion, and a filler-containing layer formed on the fluorescent material-containing second layer around the mounting portion.Type: GrantFiled: February 27, 2013Date of Patent: March 22, 2016Assignee: NICHIA CORPORATIONInventors: Takashi Sato, Satoshi Shirahama
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Patent number: 9281457Abstract: Provided is a semiconductor device and a method of manufacturing the semiconductor device, in which the semiconductor device has a semiconductor element having a plurality of wires bonded to the semiconductor element with sufficient bonding reliability and has a good heat dissipation property. A semiconductor device in which a first wire is ball bonded on an electrode, and a second wire is further bonded on the ball-bonded first wire, and the first wire or an end of the second wire defines a space between itself and the ball portion of the first wire.Type: GrantFiled: June 5, 2013Date of Patent: March 8, 2016Assignee: Nichia CorporationInventor: Satoshi Shirahama
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Patent number: 9172007Abstract: A method of manufacturing a light emitting device, using a spray coating method, a fluorescent material can be easily adhered on corner portions and side surfaces of an LED chip, a lens-shaped light transmissive resin member surface, an optical lens surface, etc., and a spray coating machine used in the method. The method includes mounting an LED chip on a substrate member, applying a spray coating to a coating object including the LED chip by spraying a powder-containing solution. The applying a spray coating is performed such that a powder-containing solution is sprayed through a solution nozzle arranged above the coating object, as a spray direction of the powder-containing solution indicating a central axis, while using at least one gas nozzle arranged in a surrounding relationship to the central axis, spraying a gas toward the central axis to alter the direction of the spray made of the powder-containing solution.Type: GrantFiled: December 23, 2013Date of Patent: October 27, 2015Assignee: NICHIA CORPORATIONInventors: Takayuki Igarashi, Satoshi Shirahama
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Publication number: 20150153034Abstract: A light emitting device has a plurality of light emitting elements, a heat spreading member on which the plurality of light emitting elements are mounted, and having a bottom face, an insulating member having a recess that includes side walls and a bottom wall, a top face of the bottom wall being in contact with the bottom face of the heat spreading member, and a circuit board having a circuit that is provided on the heat spreading member and supplies power to the plurality of light emitting elements.Type: ApplicationFiled: November 18, 2014Publication date: June 4, 2015Inventors: Hiroshi MIYAIRI, Takayuki IGARASHI, Masato FUJITOMO, Satoshi SHIRAHAMA
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Publication number: 20140186980Abstract: A method of manufacturing a light emitting device, using a spray coating method, a fluorescent material can be easily adhered on corner portions and side surfaces of an LED chip, a lens-shaped light transmissive resin member surface, an optical lens surface, etc., and a spray coating machine used in the method. The method includes mounting an LED chip on a substrate member, applying a spray coating to a coating object including the LED chip by spraying a powder-containing solution. The applying a spray coating is performed such that a powder-containing solution is sprayed through a solution nozzle arranged above the coating object, as a spray direction of the powder-containing solution indicating a central axis, while using at least one gas nozzle arranged in a surrounding relationship to the central axis, spraying a gas toward the central axis to alter the direction of the spray made of the powder-containing solution.Type: ApplicationFiled: December 23, 2013Publication date: July 3, 2014Applicant: NICHIA CORPORATIONInventors: Takayuki IGARASHI, Satoshi SHIRAHAMA
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Publication number: 20130267050Abstract: Provided is a semiconductor device and a method of manufacturing the semiconductor device, in which the semiconductor device has a semiconductor element having a plurality of wires bonded to the semiconductor element with sufficient bonding reliability and has a good heat dissipation property. A semiconductor device in which a first wire is ball bonded on an electrode, and a second wire is further bonded on the ball-bonded first wire, and the first wire or an end of the second wire defines a space between itself and the ball portion of the first wire.Type: ApplicationFiled: June 5, 2013Publication date: October 10, 2013Inventor: Satoshi SHIRAHAMA
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Patent number: 8476726Abstract: Provided is a semiconductor device and a method of manufacturing the semiconductor device, in which the semiconductor device has a semiconductor element having a plurality of wires bonded to the semiconductor element with sufficient bonding reliability and has a good heat dissipation property. A semiconductor device in which a first wire is ball bonded on an electrode, and a second wire is further bonded on the ball-bonded first wire, and the first wire or an end of the second wire defines a space between itself and the ball portion of the first wire.Type: GrantFiled: April 29, 2010Date of Patent: July 2, 2013Assignee: Nichia CorporationInventor: Satoshi Shirahama
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Publication number: 20100276802Abstract: Provided is a semiconductor device and a method of manufacturing the semiconductor device, in which the semiconductor device has a semiconductor element having a plurality of wires bonded to the semiconductor element with sufficient bonding reliability and has a good heat dissipation property. A semiconductor device in which a first wire is ball bonded on an electrode, and a second wire is further bonded on the ball-bonded first wire, and the first wire or an end of the second wire defines a space between itself and the ball portion of the first wire.Type: ApplicationFiled: April 29, 2010Publication date: November 4, 2010Applicant: NICHIA CORPORATIONInventor: Satoshi SHIRAHAMA