Abstract: A semiconductor device for surface-shape recognition capable of preventing a destruction of a device due to a discharge of static electricity and an occurrence of cracks at a shape recognition surface when being pressed by an object such as a finger and improving reliability, including a plurality of sensor pad electrodes formed on a substrate and storing charges, a plurality of semiconductor elements formed at a lower portion of the sensor pad electrode and reading charges stored in the sensor pad electrodes, a first protective film formed while covering the sensor pad electrodes and clearances between the sensor pad electrodes, a groove formed in the surface of the first protective film in regions between the sensor pad electrodes, a neutralization electrode impressed with a fixed potential formed in the groove so that a height becomes substantially the same as the depth of the groove, and a second protective film formed while covering the first protective film and the neutralization electrode.

Abstract: A semiconductor device for surface-shape recognition capable of preventing a destruction of a device due to a discharge of static electricity and an occurrence of cracks at a shape recognition surface when being pressed by an object such as a finger and improving reliability, including a plurality of sensor pad electrodes formed on a substrate and storing charges, a plurality of semiconductor elements formed at a lower portion of the sensor pad electrode and reading charges stored in the sensor pad electrodes, a first protective film formed while covering the sensor pad electrodes and clearances between the sensor pad electrodes, a groove formed in the surface of the first protective film in regions between the sensor pad electrodes, a neutralization electrode impressed with a fixed potential formed in the groove so that a height becomes substantially the same as the depth of the groove, and a second protective film formed while covering the first protective film and the neutralization electrode.