Abstract: A method of producing a copper/ceramic bonded body, the copper member having a composition having a Cu purity of 99.96 mass % or more, a balance of inevitable impurities, a P content of 2 mass ppm or less, and a total content of Pb, Se and Te of 10 mass ppm or less, the method includes bonding the laminated copper member and the ceramic member by pressing and heating, wherein an average crystal grain size of the copper member before bonding is 10 ?m or more, an aspect ratio is 2 or less, and a pressing load is 0.05 MPa or more and 1.5 MPa or less, a heating temperature is 800° C. or higher and 850° C. or lower, and a holding time at the heating temperature is 10 minutes or longer and 90 minutes or shorter.

Abstract: According to one embodiment, there is provided a semiconductor manufacturing apparatus including a rotatable substrate stage, a first measuring mechanism and a second measuring mechanism. On the rotatable substrate stage, a laminated substrate used for manufacturing a semiconductor device is placed. The laminated substrate is formed by a first substrate and a second substrate to be laminated to each other. The first measuring mechanism measures an edge of the first substrate and an edge of the second substrate from a first direction. The second measuring mechanism measures the edge of the first substrate and the edge of the second substrate from a second direction. The second direction is a direction different from the first direction in an angle to a normal of the first substrate.

Abstract: A copper/ceramic bonded body of the present invention is formed by bonding a copper member, which is formed of copper or a copper alloy, and a ceramic member, in which a ratio D1/D0 is 0.60 or less, D0 being an average crystal grain size of the entire copper member, D1 being an average crystal grain size of the copper member at a position 50 ?m from a bonding surface with the ceramic member, D0 and D1 being obtained by observing a cross-section of the copper member along a laminating direction.

Abstract: A method of producing a copper/ceramic bonded body, the copper member having a composition having a Cu purity of 99.96 mass % or more, a balance of inevitable impurities, a P content of 2 mass ppm or less, and a total content of Pb, Se and Te of 10 mass ppm or less, the method includes bonding the laminated copper member and the ceramic member by pressing and heating, wherein an average crystal grain size of the copper member before bonding is 10 ?m or more, an aspect ratio is 2 or less, and a pressing load is 0.05 MPa or more and 1.5 MPa or less, a heating temperature is 800° C. or higher and 850° C. or lower, and a holding time at the heating temperature is 10 minutes or longer and 90 minutes or shorter.

Abstract: An electronic part is made from a laminated object including stacked abutting ceramic green sheets each carrying an electrically conductive paste having a contact portion in proximity to an edge of the sheet. The laminated object is fired to form a laminated body including ceramic insulator layers abutting electrically conductive internal electrode layers including contact segments in proximity to a side of the object. The body is then processed so the contact segments are exposed on the side of the object. Then an external electrode is formed on the polished body where the contact segment is exposed by using a dry process so the external electrode and the contact segment abut to establish an electric contact between the external electrode and the contact segments. The firing step causes the paste to move relative to the edges of the sheets so the contact segments are displaced relative to the edges of the sheets.

Abstract: Processing along one circular path is performed by irradiating a laser beam to a ceramic green sheet attached on an outer peripheral surface of a rotating drum, and the processing path is changed by moving at least one of the rotating drum and a beam irradiated position through a predetermined distance in the direction of drum centerline each time the processing on one circular path is completed. If the laser beam is intermittently irradiated to the ceramic green sheet, a matrix of through holes or concave portions can be easily formed in the ceramic green sheet.

Abstract: A method of manufacturing multilayer electronic parts including a processing step asnd an apparatus for manufacturing multilayer electronic parts including a processing apparatus for subjecting a green sheet to a predetermined processing by irradiating it with the laser beam. A green sheet attached to the periphery of one of two drums is subjected to the predetermined processing by irradiating it with the laser beam from a beam irradiation means while allowing the drum to rotate about a drum's centerline as an axis and travel in the direction of the drum's centerline. And while subjecting the green sheet to the processing, processed green sheets are detached from the periphery of the other drum and unprocessed green sheets are attached to it with a sheet attaching/detaching means.