Abstract: In the method for producing an optically active 2,3-bisphosphinopyrazine derivative of the present invention, an optically active 2,3-bisphosphinopyrazine derivative represented by the following formula (3) is produced by the step of: preparing solution A containing 2,3-dihalogenopyrazine represented by the following formula (1) and a carboxylic acid amide coordinating solvent, lithiating an optically active R- or S-isomer of a hydrogen-phosphine borane compound represented by the following formula (2) to give a lithiated phosphine borane compound; adding solution B containing the lithiated phosphine borane compound to the solution A to perform an aromatic nucleophilic substitution reaction; and then performing a deboranation reaction. (For symbols in the formulas, see the description.

Abstract: In the method for producing an optically active 2,3-bisphosphinopyrazine derivative of the present invention, an optically active 2,3-bisphosphinopyrazine derivative represented by the following formula (3) is produced by the step of: preparing solution A containing 2,3-dihalogenopyrazine represented by the following formula (1) and a carboxylic acid amide coordinating solvent, lithiating an optically active R- or S-isomer of a hydrogen-phosphine borane compound represented by the following formula (2) to give a lithiated phosphine borane compound; adding solution B containing the lithiated phosphine borane compound to the solution A to perform an aromatic nucleophilic substitution reaction; and then performing a deboranation reaction. (For symbols in the formulas, see the description.

Abstract: It is an object to use an additional circuit to increase speed and functioning of an existing test apparatus at a low cost. Provided is a test apparatus that is connected to a socket board corresponding to a type of device under test and tests the device under test. The test apparatus comprises a test head including therein a test module that tests the device under test; a function board that is connected to the test module in the test head via a cable and also connected to the socket board; and an additional circuit that is loaded on the function board and connected to the test module and the device under test.

Abstract: An interface member 52, being provided between a body part of a test head 5 to be used in an electronic device testing apparatus 10 and a socket board 51 having a socket 512 to be mounted with an electronic device 2 to be tested and a plurality of socket side connectors 514 electrically connected to the socket 512, for electrically connecting the body part of the test head 5 with the socket board 51: comprising IF side connectors 524 to be engaged with the socket side connectors 514, an upper frame 521 for supporting the IF side connector 524 and a frame-shaped lower frame 522 provided under the upper frame 521; wherein the upper frame 521 has a hole 521h formed thereon for allowing a plurality of IF side connectors 524 to pass through, a heat insulator 525 is provided between a plurality of IF side connectors 524 passing through the hole 521h, and inside the frame-shaped lower frame 522 is filled with a plurality of block-shaped heat insulators 526, wherein cables 524c of the IF side connectors 524 pass thro

Abstract: A test section unit 7 comprising a handle 6 which is detachable without using any tool: wherein the handle 6 comprises a base plate 61, two brackets 62 provided to both end portions of the base plate 61, a handle bar 63 bridging over between the both brackets 62, and two guide shafts and two index plungers 65 provided to the base plate 61; while a performance board 51 of a test section unit body 5 has two guide holes 53 extending in the plane direction of the performance board 51 and two plunger holes 54 extending in the thickness direction of the performance board 51 formed thereon.

Abstract: A performance board which is attached to a semiconductor test apparatus and on which devices under test are mounted is provided. The performance board includes: a substrate; sockets which are attached to the surface of the substrate and on which devices under test are mounted; and an adiathermic cover member attached to the rear surface of a region of the substrate on which the sockets are mounted.

Abstract: A performance board which is attached to a semiconductor test apparatus and on which devices under test are mounted is provided. The performance board includes: a substrate; sockets which are attached to the surface of the substrate and on which devices under test are mounted; and an adiathermic cover member attached to the rear surface of a region of the substrate on which the sockets are mounted.

Abstract: A welding torch having a flange portion to be coupled to a wrist of a robot. A shock sensor is attached to the flange portion. A nozzle is attached to the shock sensor. The welding torch includes a wire feeding pipe socket arranged at a center of the flange portion. A cooling pipe socket is arranged at a position offset from a central portion of the flange portion. A cooling hose for feeding cooling water from the flange portion to the nozzle is provided while bypassing the shock sensor.

Abstract: A welding torch and a welding robot are provided in which a conduit cable and a cooling water hose do not interfere with peripheral devices or the like. A welding torch (21) having a flange portion (22) to be coupled to a wrist (3) of a robot, a shock sensor (23) attached to the flange portion (22), and a nozzle (24) attached to the shock sensor (23), the welding torch (21) comprising: a wire feeding pipe socket (24) arranged at a center of the flange portion (22); a cooling pipe socket (26) arranged at a position offset from a central portion of the flange portion (22); and a cooling hose (27) for feeding cooling water from the flange portion (22) to the nozzle (24) while bypassing the shock sensor (23). Moreover, an industrial robot has the welding torch (21) at a hollow wrist portion (3) thereof, and a welding wire and the cooling water are fed to the welding torch (21) through the hollow wrist portion (3).

Abstract: A housing and a bottom cover are secured together and have pairs of aligned through-apertures, and probe pins are accommodated in respective pairs of through-apertures to provide an IC socket. Each probe pin comprises a tube having a stop flange formed around its outer periphery, a movable plunger accommodated in the tube such that an extension portion of the movable plunger in urged to project out of a narrowed first end portion of the tube by a first coil spring, and a fixed plunger fitted to a second end portion of the tube. Each probe pin is urged by a second coil spring such that the stop flange on the tube is urged into abutment with a shoulder portion of a through-aperture of the bottom cover, whereby a tip end of the fixed plunger is projected beyond the outer surface of the bottom cover and a tip end of the movable plunger is projected beyond the outer surface of the housing.