Patents by Inventor Satoshi Tanikawa

Satoshi Tanikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6662445
    Abstract: In this method, a ground wire 2 is overlaid on a shield wire 1 in cross. Next, overlapping portions of the shield wire 1 and the ground wire 2 are interposed between an upper resin tip 13 and a lower resin tip 14. By executing a first ultrasonic oscillation while inserting a projection 7a of an ultrasonic horn 7 into a through hole 13b of the tip 13, outside rinds 1d, 2b of the wires 1, 2 are removed in the vicinity of the overlapping portions. Next, by arranging a low-melting metal 15 and a resin piece 16 on a contact between the braided wire 1c and the core line 2a and executing a second ultrasonic oscillation, the contact can be brazed with the mutual welding of the tips 13, 14.
    Type: Grant
    Filed: January 16, 2001
    Date of Patent: December 16, 2003
    Assignee: Yazaki Corporation
    Inventors: Satoshi Tanikawa, Takashi Ishii
  • Patent number: 6327777
    Abstract: A connecting structure for covered wires is provided. At first, a shield wire 1 and a ground wire 2 are prepared. After overlaying the ground wire 2 on the shield wire 1 cross each other, respective overlapping portions of the wires 1, 2 are interposed between an upper resin tip 13 and a lower resin tip 14. Next, the upper and lower resin tips 13, 14 are oscillated with ultrasonic waves while compressing the upper and lower resin tips 13, 14 from the outside. Consequently, respective outside rinds 1d, 2b of the wires 1, 2 are molten for removal, so that a braided wire 1c comes into electrical contact with a core line 2a. The upper and lower resin tips 13, 14 have wire receiving grooves 13a, 14a formed on their butt faces. Each of the groove 13a, 14a has a semi-circular cross section of a diameter corresponding to the diameter of the shield wire 1.
    Type: Grant
    Filed: October 6, 1999
    Date of Patent: December 11, 2001
    Inventors: Tetsuro Ide, Satoshi Tanikawa
  • Patent number: 6291771
    Abstract: A connecting structure includes a shield wire 1, a ground wire 2, an upper resin tip 15, a lower resin tip 16, and a low-melting welding material 17. First, the ground wire 2 is overlaid on the shield wire 1 in cross. Next, overlapping portions of the shield wire 1 and the ground wire 2 are interposed between the resin tips 15 and 16. By oscillating the resin tips 15 and 16 with ultrasonic waves, respective outside rinds 1d, 2d of the wires 1,2 are removed in the vicinity of the overlapping portions. A braided wire 1c of the wire 1 is electrically connected with a core line 2a of the wire 2 and, simultaneously, the resin tips 15 and 16 are welded to each other to seal up the vicinity of a connecting part S1. With the ultrasonic oscillation, a low-melting materials 17 is molten to flow into the connecting part S1, so that the braided wire 1c of the wire 1 is joined to the core line 2a of the wire 2 through the molten material 17.
    Type: Grant
    Filed: March 23, 1999
    Date of Patent: September 18, 2001
    Assignee: Yazaki Corporation
    Inventors: Satoshi Tanikawa, Nobuyuki Asakura
  • Publication number: 20010001347
    Abstract: In this method, a ground wire 2 is overlaid on a shield wire 1 in cross. Next, overlapping portions of the shield wire 1 and the ground wire 2 are interposed between an upper resin tip 13 and a lower resin tip 14. By executing a first ultrasonic oscillation while inserting a projection 7a of an ultrasonic horn 7 into a through hole 13b of the tip 13, outside rinds 1d, 2b of the wires 1, 2 are removed in the vicinity of the overlapping portions. Next, by arranging a low-melting metal 15 and a resin piece 16 on a contact between the braided wire 1c and the core line 2a and executing a second ultrasonic oscillation, the contact can be brazed with the mutual welding of the tips 13, 14.
    Type: Application
    Filed: January 16, 2001
    Publication date: May 24, 2001
    Applicant: Yazaki Corp.
    Inventors: Satoshi Tanikawa, Takashi Ishii
  • Patent number: 6226865
    Abstract: In this method, a ground wire 2 is overlaid on a shield wire 1 in cross. Next, overlapping portions of the shield wire 1 and the ground wire 2 are interposed between an upper resin tip 13 and a lower resin tip 14. By executing a first ultrasonic oscillation while inserting a projection 7a of an ultrasonic horn 7 into a through hole 13b of the tip 13, outside rinds 1d, 2b of the wires 1, 2 are removed in the vicinity of the overlapping portions. Next, by arranging a low-melting metal 15 and a resin piece 16 on a contact between the braided wire 1c and the core line 2a and executing a second ultrasonic oscillation, the contact can be brazed with the mutual welding of the tips 13, 14.
    Type: Grant
    Filed: March 23, 1999
    Date of Patent: May 8, 2001
    Assignee: Yazaki Corporation
    Inventors: Satoshi Tanikawa, Takashi Ishii
  • Patent number: 6072123
    Abstract: A connecting structure for covered wires is provided. At first, a shield wire 1 and a ground wire 2 are prepared. After overlaying the ground wire 2 on the shield wire 1 cross each other, respective overlapping portions of the wires 1, 2 are interposed between an upper resin tip 13 and a lower resin tip 14. Next, the upper and lower resin tips 13, 14 are oscillated with ultrasonic waves while compressing the upper and lower resin tips 13, 14 from the outside. Consequently, respective outside rinds 1d, 2b of the wires 1, 2 are molten for removal, so that a braided wire 1c comes into electrical contact with a core line 2a. The upper and lower resin tips 13, 14 have wire receiving grooves 13a, 14a formed on their butt faces. Each of the groove 13a, 14a has a semi-circular cross section of a diameter corresponding to the diameter of the shield wire 1.
    Type: Grant
    Filed: March 2, 1999
    Date of Patent: June 6, 2000
    Assignee: Yazaki Corporation
    Inventors: Tetsuro Ide, Satoshi Tanikawa