Abstract: To provide an abrasive water jet cutting machine in which an abrasive recovery unit can be continuously used without needing maintenance, and an abrasive having a uniform grain size can be easily recovered, the machine has a catch tank for receiving a high-pressure abrasive mixture liquid jetted from a jet nozzle, and an abrasive recovery unit that recovers abrasive having a grain size in a reusable predetermined range from the abrasive mixture liquid transported from the catch tank, and transports abrasive mixture liquid including recovered abrasive into an abrasive-mixture-liquid retention tank; wherein the abrasive recovery unit has an abrasive sorting tank which flows the abrasive mixture liquid transported from the catch tank in an approximately horizontal direction, and sorts abrasive depending on grain size by using difference in sedimentation rate depending on grain size, and recovers the abrasive having the grain size in the reusable predetermined range.

Abstract: A liquid jet machining apparatus including holding means for holding a workpiece, liquid jet application means for applying a liquid jet to the workpiece held by the holding means, and catching means for catching the liquid jet which has penetrated the workpiece. The catching means includes a tank for accommodating a liquid. At the bottom of the tank, a cushioning member is replaceably disposed, and an abrasive is accumulated. The liquid jet having penetrated the workpiece acts on the liquid accommodated in the tank, and then acts on the cushioning member and the abrasive. Wave suppressing means for suppressing generation of waves due to the liquid jet acting on the liquid accommodated within the tank is disposed in an upper portion of the tank.

Abstract: A water jet processing method for cutting a workpiece having a first group composed of first plural cutting lines extending in a predetermined direction and a second group composed of second plural cutting lines formed perpendicular to the plural cutting lines of the first group along the plural cutting lines of the first group and the plural cutting lines of the second group formed on the workpiece by injecting a water jet, which comprises a first cutting step for injecting a water jet to the cutting lines of the first group continuously and a second cutting step for injecting a water jet to the cutting lines of the second group continuously while the workpiece is supported by a support member.

Abstract: A liquid jet machining apparatus comprising holding means for holding a workpiece, and liquid jet application means for applying a liquid jet to the workpiece held by the holding means. The liquid jet application means includes pipe means and nozzle means, and the nozzle means includes a nozzle pipe connected to the downstream end of the pipe means, and an orifice member connected to the downstream end of the nozzle pipe. The nozzles means is firmly fixed to a rigid support frame body. A downstream end portion of the pipe means is also firmly fixed to the rigid support frame body.

Abstract: A liquid jet machining apparatus including holding means for holding a workpiece, liquid jet application means for applying a liquid jet to the workpiece held by the holding means, and catching means for catching the liquid jet which has penetrated the workpiece. The catching means includes a tank for accommodating a liquid. At the bottom of the tank, a cushioning member is replaceably disposed, and an abrasive is accumulated. The liquid jet having penetrated the workpiece acts on the liquid accommodated in the tank, and then acts on the cushioning member and the abrasive. Wave suppressing means for suppressing generation of waves due to the liquid jet acting on the liquid accommodated within the tank is disposed in an upper portion of the tank.

Abstract: A water jet processing method for cutting a workpiece having a first group composed of first plural cutting lines extending in a predetermined direction and a second group composed of second plural cutting lines formed perpendicular to the plural cutting lines of the first group along the plural cutting lines of the first group and the plural cutting lines of the second group formed on the workpiece by injecting a water jet, which comprises a first cutting step for injecting a water jet to the cutting lines of the first group continuously and a second cutting step for injecting a water jet to the cutting lines of the second group continuously while the workpiece is supported by a support member.

Abstract: A conveying apparatus for conveying a plate-like object that is affixed to the top surface of a protective tape mounted to cover the inside opening of a support frame formed in an annular form, comprising a suction-holding member having a negative pressure chamber which is open at the bottom and an annular contact portion to be contacted to the top surface of the support frame on the under surface, the negative pressure chamber being connected to a suction-source; and a moving unit for moving the suction-holding member between a first predetermined position and a second predetermined position.

Abstract: A method of dividing a semiconductor wafer of which the surface has a plurality of chips sectioned by streets, into individual chips, characterized in that it comprises a scribing step in which division guide lines are formed by drawing scribed lines along the streets on the surface of the semiconductor wafer, a tape sticking step in which a tape is stuck onto the surface having the division guide lines formed thereon, of the semiconductor wafer, and a back surface cutting step in which cutting grooves are formed in the back surface, to which the tape is stuck, of the semiconductor wafer such that a bit of uncut portions are left along the division guide lines.

Abstract: A method of dividing a semiconductor wafer of which the surface has a plurality of chips sectioned by streets, into individual chips, characterized in that it comprises a scribing step in which division guide lines are formed by drawing scribed lines along the streets on the surface of the semiconductor wafer, a tape sticking step in which a tape is stuck onto the surface having the division guide lines formed thereon, of the semiconductor wafer, and a back surface cutting step in which cutting grooves are formed in the back surface, to which the tape is stuck, of the semiconductor wafer such that a bit of uncut portions are left along the division guide lines.