Patents by Inventor Satoshi Tawara
Satoshi Tawara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11940170Abstract: [Object] To provide a control system, a control method, and a storage medium through which a moving object can change a surrounding environment of a user depending on an emotion of the user. [Solution] Provided is a control system including: an estimation unit that estimates an emotion of a user; and a moving object controller that controls a moving object to change a surrounding environment of the user depending on the estimated emotion.Type: GrantFiled: September 11, 2020Date of Patent: March 26, 2024Assignee: SONY CORPORATIONInventors: Atsushi Shionozaki, Satoshi Ikeda, Tetsuo Tawara, Yasushi Miyajima
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Patent number: 9005390Abstract: A room temperature bonding apparatus includes angle adjustment means supporting a first sample stage holding a first substrate so as to be able to change a direction of the first sample stage; a first driving device driving the first stage in a first direction; a second driving device driving a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table supporting the second sample stage in the first direction when the second substrate and the first substrate are brought into contact. The apparatus can impose a load exceeding a withstand load of the second driving device on the first and second substrates. Further, the apparatus uses angle adjustment means to change direction of the first substrate to be parallel with the second substrate and uniformly impose the larger load on a bonding surface.Type: GrantFiled: June 22, 2012Date of Patent: April 14, 2015Assignee: Mitsubishi Heavy Industries, Ltd.Inventors: Takeshi Tsuno, Takayuki Goto, Masato Kinouchi, Satoshi Tawara, Jun Utsumi, Yoichiro Tsumura, Kensuke Ide, Takenori Suzuki
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Patent number: 8985175Abstract: A room temperature bonding machine is provided with an evacuation apparatus, a gas supply apparatus, a pressure gauge, a cleaner apparatus, a pressure controller and a pressing mechanism. The evacuation apparatus evacuates gas from the chamber. The gas supply apparatus supplies introduction gas into the chamber. The pressure gauge measures the pressure in the chamber. The cleaner apparatus cleans first and second substrates in the chamber when said pressure is at a predetermined degree of vacuum. The pressure controller controls both of the evacuation apparatus and the gas supply apparatus so that the pressure is regulated to a target pressure. The pressing mechanism presses and bonds the first and second substrates when the pressure is set to said target pressure.Type: GrantFiled: September 29, 2008Date of Patent: March 24, 2015Assignee: Mitsubishi Heavy Industries, Ltd.Inventors: Masato Kinouchi, Takayuki Goto, Satoshi Tawara, Takeshi Tsuno, Jun Utsumi, Kensuke Ide, Takenori Suzuki
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Patent number: 8906175Abstract: A room temperature bonding apparatus according to the present invention is provided with a load lock chamber having an internal space which is pressure-reduced; and a cartridge arranged in the load lock chamber. The cartridge includes an island portion formed to contact a substrate when the substrate is put on the cartridge. A flow passage is formed for the island portion to connect a space between the cartridge and the substrate to outside when the substrate is put on the cartridge. Therefore, in the room temperature bonding apparatus can prevent making the substrate is moved to the cartridge due to gas when the internal space is pressure-reduced.Type: GrantFiled: September 29, 2009Date of Patent: December 9, 2014Assignee: Mitsubishi Heavy Industries, Ltd.Inventors: Masato Kinouchi, Takayuki Goto, Satoshi Tawara, Takeshi Tsuno, Jun Utsumi, Kensuke Ide, Takenori Suzuki
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Patent number: 8857487Abstract: A room temperature bonding apparatus includes: an angle adjustment mechanism that supports a first sample stage holding a first substrate to a first stage so as to be able to change a direction of the first sample stage; a first driving device that drives the first stage in a first direction; a second driving device that drives a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table that supports the second sample stage in the first direction when the second substrate and the first substrate are brought into press contact with each other. In this case, the room temperature bonding apparatus can impose a larger load exceeding a withstand load of the second driving device on the first substrate and the second substrate.Type: GrantFiled: March 11, 2008Date of Patent: October 14, 2014Assignee: Mitsubishi Heavy Industries, Ltd.Inventors: Takeshi Tsuno, Takayuki Goto, Masato Kinouchi, Satoshi Tawara, Jun Utsumi, Yoichiro Tsumura, Kensuke Ide, Takenori Suzuki
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Patent number: 8578993Abstract: A wafer bonding apparatus of the present invention includes a first sample base configured to hold a first substrate; a second sample base configured to hold a second substrate to oppose to the first substrate; a load transferring section coupled to an outer edge portion of the first sample base and configured to support the first sample base to a first stage; and a drive unit configured to perform pressure bonding on the first substrate and the second substrate by driving the second sample base to the first stage. In the wafer bonding apparatus, it is possible to prevent that a load which is larger than a load applied on the outer edge portion of the first substrate is applied to the center of the first substrate, and to apply uniform load the first substrate and the second substrate, when pressure bonding is performed on the first substrate and the second substrate.Type: GrantFiled: November 21, 2008Date of Patent: November 12, 2013Assignee: Mitsubishi Heavy Industries, Ltd.Inventor: Satoshi Tawara
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Publication number: 20120285624Abstract: A room temperature bonding apparatus includes angle adjustment means supporting a first sample stage holding a first substrate so as to be able to change a direction of the first sample stage; a first driving device driving the first stage in a first direction; a second driving device driving a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table supporting the second sample stage in the first direction when the second substrate and the first substrate are brought into contact. The apparatus can impose a load exceeding a withstand load of the second driving device on the first and second substrates. Further, the apparatus uses angle adjustment means to change direction of the first substrate to be parallel with the second substrate and uniformly impose the larger load on a bonding surface.Type: ApplicationFiled: June 22, 2012Publication date: November 15, 2012Inventors: Takeshi TSUNO, Takayuki GOTO, Masato KINOUCHI, Satoshi TAWARA, Jun UTSUMI, Yoichiro TSUMURA, Kensuke IDE, Takenori SUZUKI
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Publication number: 20110277904Abstract: A room temperature bonding apparatus according to the present invention is provided with a load lock chamber having an internal space which is pressure-reduced; and a cartridge arranged in the load lock chamber. The cartridge includes an island portion formed to contact a substrate when the substrate is put on the cartridge. A flow passage is formed for the island portion to connect a space between the cartridge and the substrate to outside when the substrate is put on the cartridge. Therefore, in the room temperature bonding apparatus can prevent making the substrate is moved to the cartridge due to gas when the internal space is pressure-reduced.Type: ApplicationFiled: September 29, 2009Publication date: November 17, 2011Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Masato Kinouchi, Takayuki Goto, Satoshi Tawara, Takeshi Tsuno, Jun Utsumi, Kensuke Ide, Takenori Suzuki
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Publication number: 20110209832Abstract: A wafer bonding apparatus of the present invention includes a first sample base configured to hold a first substrate; a second sample base configured to hold a second substrate to oppose to the first substrate; a load transferring section coupled to an outer edge portion of the first sample base and configured to support the first sample base to a first stage; and a drive unit configured to perform pressure bonding on the first substrate and the second substrate by driving the second sample base to the first stage. In the wafer bonding apparatus, it is possible to prevent that a load which is larger than a load applied on the outer edge portion of the first substrate is applied to the center of the first substrate, and to apply uniform load the first substrate and the second substrate, when pressure bonding is performed on the first substrate and the second substrate.Type: ApplicationFiled: November 21, 2008Publication date: September 1, 2011Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventor: Satoshi Tawara
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Publication number: 20110083801Abstract: Provided is a cold jointing apparatus, which comprises a discharge device, a gas feeding device, a pressure gauge, a clarifying device, a pressure controller and a pressing mechanism. The discharge device discharges a gas from the inside of a chamber. The gas feeding device feeds an introduction gas to the inside of the chamber. The pressure gauge measures the pressure in the chamber. The clarifying device clarifies a first board and a second board in the chamber when the measured pressure is at a predetermined degree of vacuum. The pressure controller controls both the discharge device and the gas feeding device so that the measured pressure may be equal to a target pressure. The pressing mechanism presses the first board and the second board in the chamber when the measured pressure is that target pressure.Type: ApplicationFiled: September 29, 2008Publication date: April 14, 2011Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Masato Kinouchi, Takayuki Goto, Satoshi Tawara, Takeshi Tsuno, Jun Utsumi, Kensuke Ide, Takenori Suzuki
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Publication number: 20110011536Abstract: A room temperature bonding apparatus includes: an angle adjustment mechanism that supports a first sample stage holding a first substrate to a first stage so as to be able to change a direction of the first sample stage; a first driving device that drives the first stage in a first direction; a second driving device that drives a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table that supports the second sample stage in the first direction when the second substrate and the first substrate are brought into press contact with each other. In this case, the room temperature bonding apparatus can impose a larger load exceeding a withstand load of the second driving device on the first substrate and the second substrate.Type: ApplicationFiled: March 11, 2008Publication date: January 20, 2011Inventors: Takeshi Tsuno, Takayuki Goto, Masato Kinouchi, Satoshi Tawara, Jun Utsumi, Yoichiro Tsumura, Kensuke Ide, Takenori Suzuki
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Publication number: 20070256774Abstract: A method of and system for manufacturing a microstructure having high form accuracy and a manufacturing system is disclosed. On a rough motion stage having a predetermined positioning accuracy and a large stroke length, a fine motion stage having a small stroke length and a higher positioning accuracy is placed. First, the rough motion stage is moved to a desired position. By use of a mirror placed on a laser length measuring machine and the fine motion stage, the current position of a thin film member on the fine motion stage is precisely measured. This measurement value is feed-backed to a stage control device, and a difference between the current position and a target position is calculated by an error correcting unit. Thus, an error correcting instruction value is generated to move the fine motion stage to the target position. Thus, an error of the rough motion stage is corrected.Type: ApplicationFiled: July 18, 2007Publication date: November 8, 2007Inventors: Takeshi Tsuno, Takayuki Goto, Satoshi Tawara, Masato Kinouchi, Shin Asano, Osamu Hasegawa, Takayuki Yamada, Mutsuya Takahashi
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Publication number: 20050229737Abstract: A manufacturing system for a microstructure includes a rough motion stage having predetermined positioning accuracy and a large stroke length, a fine motion stage disposed on the rough motion stage and having higher positioning accuracy than the rough motion stage and a small stroke length, and the like collectively as a stage device disposed in a vacuum container, laser length measuring machines for measuring a distance to a mirror disposed on the fine motion stage, a stage control device for driving the fine motion stage by a result of measurement by the laser length measuring machines, and the like collectively as a stage control unit, and a pressing rod 44 for holding a pressure-contacting target member disposed opposite to a pressure-contacted member held by the stage device and pressure-contacting and separating the members, a pressure-contacting drive mechanism for applying a pressure-contacting force to the pressing rod 44, and the like collectively as a pressure-contacting mechanism unit.Type: ApplicationFiled: February 18, 2005Publication date: October 20, 2005Applicant: Mitsubishi Heavy Industries, Ltd.Inventors: Takeshi Tsuno, Takayuki Goto, Satoshi Tawara, Masato Kinouchi, Shin Asano, Osamu Hasegawa, Takayuki Yamada, Mutsuya Takahashi
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Publication number: 20050233064Abstract: A method of and system for manufacturing a microstructure having high form accuracy and a manufacturing system is disclosed. On a rough motion stage having a predetermined positioning accuracy and a large stroke length, a fine motion stage having a small stroke length and a higher positioning accuracy is placed. First, the rough motion stage is moved to a desired position. By use of a mirror placed on a laser length measuring machine and the fine motion stage, the current position of a thin film member on the fine motion stage is precisely measured. This measurement value is feed-backed to a stage control device, and a difference between the current position and a target position is calculated by an error correcting unit. Thus, an error correcting instruction value is generated to move the fine motion stage to the target position. Thus, an error of the rough motion stage is corrected.Type: ApplicationFiled: February 18, 2005Publication date: October 20, 2005Applicants: Mitsubishi Heavy Industries, Ltd., Fuji Xerox Co., Ltd.Inventors: Takeshi Tsuno, Takayuki Goto, Satoshi Tawara, Masato Kinouchi, Shin Asano, Osamu Hasegawa, Takayuki Yamada, Mutsuya Takahashi
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Patent number: 6783430Abstract: A grinding apparatus with a grinding wheel on the output shaft of a fluid servomotor driven by fluid from a fluid source and controlled by a servo valve. The servomotor housing is mounted on a stage moveable toward a work to press the grinding wheel against the work. The output shaft extends through a cover. A rotational speed detector includes a rotating member disposed on the output shaft inside the cover and a rotation detecting member attached to the cover facing the rotating member. Differences between the detected rotational speed of the shaft and a target rotational speed are determined by a control device, and the stage is moved in response to signals from the control device, so grinding can be adapted to various conditions.Type: GrantFiled: August 22, 2000Date of Patent: August 31, 2004Assignee: Mitsubishi Heavy Industries, Ltd.Inventor: Satoshi Tawara
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Patent number: 6267657Abstract: A grinding swarf collector is disclosed. An outer periphery and side surfaces of a grinding wheel, except a site of grinding including a grinding point, are covered with a cover. A dust collecting plate is disposed behind the grinding point in a direction of rotation of the grinding wheel. Swarf scattered rearward collides with the dust collecting plate, and is scooped up thereby toward a suction port. The suction port sucks the swarf, which is sucked into a vacuum cleaner. Swarf scattered around the grinding wheel collides with the cover, falls to an opening formed below, and is sucked through the suction port. Thus, grinding swarf is collected efficiently.Type: GrantFiled: October 25, 1999Date of Patent: July 31, 2001Assignee: Mitsubishi Heavy Industries, Ltd.Inventors: Satoshi Tawara, Hiroshi Yasukura, Yasuhiro Kanai