Patents by Inventor Satoshi Tazawa

Satoshi Tazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060181166
    Abstract: An object of the present invention is to provide an electric motor unit with a controller of a machinery and electricity integration type for eliminating variations due to mechanical factors and obtaining excellent operation reliability. A magnet member is attached to a gear on the side of a gear case, and a sensor for sensing the magnet member and detecting a rotational angle of the gear in a controller case, and a cylindrical opening concentric with the rotational center of the gear is installed on the gear case, and a cylindrical part fitting into the cylindrical opening is installed on the controller case, and the controller case is positioned and mounted on the gear case by the fitting between the cylindrical part and the cylindrical opening.
    Type: Application
    Filed: January 27, 2003
    Publication date: August 17, 2006
    Applicant: Hitachi, Ltd.,
    Inventors: Masashi Saito, Youichi Nakano, Yasuro Kameshiro, Satoshi Tazawa, Kouji Harada
  • Patent number: 5644688
    Abstract: A method for simulating changes to the topography of a workpiece, e.g. a semiconductor wafer, as it undergoes process steps. The method may be used to simulated isotropic or anisotropic deposition or etch process steps. A solids modeling system is used to define and deform material solids. Material solids represent the different materials on a workpiece. A plurality of trajectory solids are constructed to cause the deformation of the material solids. Deformation of a material solid is accomplished through the performance of boolean operations between the material solid and one or more trajectory solids. A characteristic of a trajectory solid, e.g. a radius or height, relates to the rate of etch or deposition for the particular process step. The method of construction of trajectory solids in the present invention enables simulation of spatially varying process steps, avoids the creation of invalid self-intersecting surfaces and minimizes the creation of small edges that lead to irregular surfaces.
    Type: Grant
    Filed: March 2, 1995
    Date of Patent: July 1, 1997
    Inventors: Francisco A. Leon, Satoshi Tazawa, Gregory Anderson
  • Patent number: 5586230
    Abstract: A method for deforming a solid and avoiding the creation of self-intersecting solid structures in a topography simulator. In a topography simulated based on a solids modeling system, self-intersecting structures are solids which have boundaries that intersect. Such self-intersecting structures are invalid and cannot be processed. A general method for sweeping a solid surface to create a deformed solid and avoid the creation of self-intersecting solid structures is described, which include the steps of: providing a material solid with a surface represented as one or more segments; constructing a first segment solid for a first segment; performing a boolean set operation between the solid being swept and the first segment solid creating a temporary first solid; identifying a second segment; constructing a second segment solid for the second segment; and performing the boolean set operation between said temporary first solid and said first segment solid creating said deformed first solid.
    Type: Grant
    Filed: November 5, 1993
    Date of Patent: December 17, 1996
    Assignees: Intel Corporation, Nippon Telegraph and Telephone Corporation
    Inventors: Francisco A. Leon, Satoshi Tazawa
  • Patent number: 5416729
    Abstract: A topography simulator using a "Generalized Solid Modeling (GSM) method" to simulate isotropic or anisotropic deposition and etch process steps on a workpiece. A solids modeling system that utilizes a boundary representation model for representing material object solids provides a basis for the topography simulator. A workpiece in the model is comprised of a collection of material solids. The present invention provides for accurately representing the interfaces of different material solids. The airspace above the top surface material is defined as an air solid. Boolean set operations between the various material solids and the air solid are performed to deform the wafer topography. The present invention further provides means for simulating an etch process step at the interface of materials with different etch rates.
    Type: Grant
    Filed: October 28, 1994
    Date of Patent: May 16, 1995
    Assignees: Nippon Telegraph and Telephone Corporation, Intel Corporation
    Inventors: Francisco A. Leon, Donald L. Scharfetter, Gregory Anderson, Satoshi Tazawa, Akira Yoshii
  • Patent number: 5379225
    Abstract: A method for efficient calculation of the movement of a vertex in a three-dimensional topography simulator. The method is particularly well suited for calculating vertex movement for cases in which an etch/deposition rate depends on the angle between the surface normal and the vertical direction. A workpiece is represented as a collection of material solids. Each of the material solids has a boundary model representation, which include vertices, edges and faces. The method of the present invention generally includes the steps of: identifying a first plane, a second plane and a third plane that approximate all the planes that are adjacent to a vertex point to be moved; determining a first observation vector; creating a set of advanced virtual planes; identifying a second observation vector; determining the furthest intersection point of one of the planes in the set of advanced planes and the second observation vector; and moving the vertex to the point identified in the prior step.
    Type: Grant
    Filed: June 24, 1992
    Date of Patent: January 3, 1995
    Assignees: Intel Corporation, Nippon Telegraph and Telephone Corporation
    Inventors: Satoshi Tazawa, Francisco A. Leon, Donald L. Sharfetter, Kazuyuki Saito, Akira Yoshii
  • Patent number: 5377118
    Abstract: A method for accurately calculating the movement of a vertex in a three-dimensional (3-D) topography simulator. The method is particularly suited for calculating vertex movement for cases in which etch/deposition rate depends on the angle between the surface normal and the vertical direction. A workpiece is represented as a collection of material solids. Each of the material solids has a boundary model representation. The method of the present invention is comprised primarily of the steps of: advancing edges and surface planes adjacent to the vertex, creating a set of 2-D solutions by clipping with pairs of adjacent surface planes; creating a set of combined 2-D solutions by clipping invalid sections of combined 2-D solutions; construct an arbitrary vertical plane that intersects the surface at the vertex point; constructing vertex trajectories for the vertex to be moved; and clipping constructed vertex trajectories at intersections of created surface and the constructed vertical plane.
    Type: Grant
    Filed: June 1, 1994
    Date of Patent: December 27, 1994
    Assignee: Intel Corporation
    Inventors: Francisco A. Leon, Donald L. Scharfetter, Satoshi Tazawa, Kazuyuki Saito, Akira Yoshii
  • Patent number: 5367465
    Abstract: A method for creating regular triangular grid representations of a solid surface from a representation comprised of a plurality of polygons. Such a regular grid is necessary in order to accurately deform a solid during simulation of a process step. The method of the preferred embodiment is comprised generally of the steps of: removing any holes defined by the polygon face; placing a new edge between a first and second vertex of the polygon face; discarding the new edge if the new edge lies outside the polygon face or if the new edge intersects an existing edge of the polygon face; adding the new edge to the polygon face if the new edge does not lie outside the polygon face; identifying a triangle being created by the new edge and existing edges of the polygon; forming a new polygon face from the edges creating a triangle; and repeating the above steps until all polygon faces are triangulated.
    Type: Grant
    Filed: June 24, 1992
    Date of Patent: November 22, 1994
    Assignees: Intel Corporation, Nippon Telegraph and Telephone Corporation
    Inventors: Satoshi Tazawa, Kazuyuki Saito, Francisco A. Leon
  • Patent number: 5282140
    Abstract: In a three-dimensional (3-D) topography simulator, a method for removing sources of particle flux because of neighboring topology, for a point on a workpiece undergoing a deposition or etch process step. The method is practiced in a Generalized Solids Modeling system that utilizes a boundary representation model for representing a workpiece as one or more material object solids. For any given point on the 3-D structure, the neighboring topography forms a complex shadowing mask with respect to sources of particle flux, thus making analytical determination of visible sources of incoming particle flux difficult. The method is comprised generally of the steps of: defining a numerical mesh in a space over a surface of the workpiece; specifying an intensity of incident flux for each mesh point, identifying a set of mesh points defining a visible range of mesh points with respect to a particular target point and identifying mesh points in said set of mesh points that are obscured by neighboring topology.
    Type: Grant
    Filed: June 24, 1992
    Date of Patent: January 25, 1994
    Assignee: Intel Corporation
    Inventors: Satoshi Tazawa, Tetsuya Abe, Francisco A. Leon