Patents by Inventor Satoshi Terayama

Satoshi Terayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4768635
    Abstract: A vehicular transmission having a fluid torque converter of the type in which a clutch is provided for mechanically connecting the input and output sides of a fluid torque converter above certain vehicle speeds for improved operation and economy and in which the clutch is operated within a predetermined vehicular speed range by such a relatively low engaging force as to allow slippage of said clutch for minimizing vibration. A control system causes the engaging force of the clutch to be increased more than that which is normally established below a reference value of small throttle valve opening for providing a braking effect by the engine. The control system also may provide for stopping the increase in engaging force at small throttle valve openings when the r.p.m. of the output side of the fluid torque converter falls below the r.p.m.
    Type: Grant
    Filed: November 25, 1986
    Date of Patent: September 6, 1988
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Yoshimi Sakurai, Takabumi Sakai, Keiichi Ishikawa, Noboru Sekine, Takashi Aoki, Satoshi Terayama, Tatsuyuki Ohhashi
  • Patent number: 4569326
    Abstract: A dicing apparatus for cutting a semiconductor wafer into a plurality of a microelectronic circuit dice each having bonding pads which are located adjacent a cutting path on the wafer. The apparatus comprises a diamond dicing blade which is held between a pair of flanges, fitted to a spindle rotating at very high speed, the blade cutting the wafer along the cutting path in an up-cut and down-cut mode. Cooling wafer is applied from both sides of the rotating flanges and dicing blade, from a coolant nozzle and flows against a cutting interface. Each flange has an outer side surface such that, as the flange rotates, the major quantity of the cooling water flows along the outer side surface and violently flows onto a surface of the wafer which is beyond the edge of the bonding pad, to avoid the cutting debris from being driven into the bonding pad, when the dicing blade works in the down-cut mode.
    Type: Grant
    Filed: July 9, 1984
    Date of Patent: February 11, 1986
    Assignee: Fujitsu Limited
    Inventors: Akinori Tanizaki, Noboru Ando, Satoshi Terayama, Kunimichi Nakao