Abstract: A process for producing a porous laminate having many micropores interconnected in the thickness direction, which comprises: a step in which a laminate is produced which comprises at least three layers comprising an interlayer made of a thermoplastic resin having a hard segment and a soft segment and two nonporous outer layers made of a filler-containing resin and located as outer layers respectively on both sides of the interlayer; a step in which the laminate obtained is impregnated with a supercritical or subcritical fluid and this state is relieved to vaporize the fluid and thereby make the interlayer porous; and a step in which the two nonporous outer layers located respectively on both sides are made porous by stretching.

Abstract: [Issues to be Solved] To provide Au alloy wire for ball bonding, which is superior in wire strength, and also is superior in formability of molten ball and roundness of compressed ball. Moreover it is superior at stitch bondability, and is available for high density wiring of semiconductor devices. [Solution Means] An Au alloy wire for ball bonding comprising: 15-50 wt ppm Mg, 10-30 wt ppm Ca, 5-20 wt ppm Eu, 5-20 wt ppm Y, 5-20 wt ppm La and residual Au is 99.998 wt % purity or higher, moreover, purity of more than 99.98 wt % Au. The mass of additive Ca is less than the value of total amount of additive Eu and additive La, and the mass of additive Y is less than the value of the total amount of additive Ca and additive Eu, and the mass of Mg is 20-40 wt ppm.

Abstract: There is provided a gold alloy wire for a ball bonding. The gold alloy consists of 10 to 50 ppm by mass of magnesium (Mg); 5 to 20 ppm by mass of europium (Eu); 2 to 9 ppm by mass of calcium (Ca); and a remaining portion being gold (Au) having a purity of a minimum of 99.998% by mass. In the gold alloy wire for a ball bonding, an addition amount of calcium (Ca) is a maximum of half that of europium (Eu).

Abstract: A process for producing a porous laminate having many micropores interconnected in the thickness direction, which comprises: a step in which a laminate is produced which comprises at least three layers comprising an interlayer made of a thermoplastic resin having a hard segment and a soft segment and two nonporous outer layers made of a filler-containing resin and located as outer layers respectively on both sides of the interlayer; a step in which the laminate obtained is impregnated with a supercritical or subcritical fluid and this state is relieved to vaporize the fluid and thereby make the interlayer porous; and a step in which the two nonporous outer layers located respectively on both sides are made porous by stretching.

Abstract: Provided is a thin Au alloy bonding wire having desired strength, good bondability and stability over time, and improved circularity of a squashed ball and sphericity of a melted ball. The Au alloy bonding wire contains, in an Au alloy matrix containing 0.05 to 2 mass % in total of at least one selected from Pd and Pt of high purity in Au of high purity, as trace elements, 10 to 100 ppm by mass of Mg, 5 to 100 ppm by mass of Ce, and 5 to 100 ppm by mass of each of at least one selected from Be, Y, Gd, La, Eu and Si, the total content of Be, Y, Gd, La, Eu and Si being 5 to 100 ppm by mass, or as trace elements, Mg, Be, and at least one selected from Y, La, Eu and Si, or as trace elements, 10 to 100 ppm by mass of Mg, 5 to 30 ppm by mass of Si, 5 to 30 ppm by mass of Be, and 5 to 30 ppm by mass of at least one selected from Ca, Ce and Sn.

Abstract: Issues to be Solved Au bonding wire for semiconductor device should be provided in circumstances such as reducing the diameter of bonding wire to less than 23 ?m, squashed ball with superior roundness should be formed and with strong tensile strength endurable against wire flow. Means as Solution Au bonding wire for semiconductor device, consisting of Au matrix and functional additives, containing: said Au matrix alloy including 3-15 mass ppm of Be, 3-40 mass ppm of Ca, and 3-20 mass ppm of La and roundness of squashed ball said Au alloy is 0.95-1.05.

Abstract: Properties of paraffinic or naphthenic mineral oil lubricants may be improved by admixing therewith a polyalkylene oxide compound having a C.sub.2 -C.sub.4 alkylene oxide moiety and a C.sub.6 -C.sub.40 alkylene oxide moiety.