Abstract: A virus inactivation method is provided. The method includes irradiating a solution containing an artificially expressed antibody or antibody fragment with ultraviolet rays in the presence of a radical scavenger. The irradiating only aggregates 5% or less of the antibody or antibody fragment. A wavelength of the ultraviolet rays is 200 nm or longer and 315 nm or shorter. An irradiation amount of the ultraviolet rays is 300 mJ/cm2 or more. An irradiation time of the ultraviolet rays is 3 minutes or less. A concentration of the radical scavenger in the solution is 0.03 mM or more.

Abstract: An electrophotographic photoreceptor includes a conductive substrate; an undercoat layer formed on the conductive substrate and containing a polyurethane resin, metal oxide particles, a silane coupling agent, and a compound represented by General Formula (ID); and a photosensitive layer formed on the undercoat layer (where R1 to R8 each independently represent a hydrogen atom, a nitro group, a cyano group, a halogen atom, a hydroxyl group, a saturated or unsaturated aliphatic hydrocarbon group optionally having a substituent, an aromatic hydrocarbon group optionally having a substituent, an alkoxy group optionally having a substituent, an aryloxy group optionally having a substituent, a sulfo group optionally having a substituent, an amino group, an alkylamino group optionally having a substituent, or an arylamino group optionally having a substituent).

Abstract: An information processing device includes a memory; and a processor coupled to the memory and configured to: calculate, when an assignment destination of a single task assigned to a person is changed to one of a plurality of arms of a robot in a state where tasks are assigned to the person and each arm of the robot, a working time of the person and a working time of the robot after the change of the assignment destination; compare the calculated working time of the person with the calculated working time of the robot; and generate a warning when the working time of the robot is longer than the working time of the person as a result of comparison.

Abstract: A fabrication management system includes a fabrication control apparatus and a fabrication management server. The fabrication control apparatus includes a composite fabrication unit that fabricates multiple fabricated members in a single process, and a controller that controls fabrication performed by the composite fabrication unit. The fabrication management server includes a designing section that, from fabrication information about multiple first fabricated members for which a fabrication request has been made, designs a second fabricated member that holds all the first fabricated members in a removable manner, and an instructing section that instructs fabrication to be performed in accordance with fabrication procedure information, the fabrication procedure information indicating a procedure for obtaining a finished fabricated object by assembling together the first fabricated members and the second fabricated member.

Abstract: An electrophotographic photoreceptor includes a conductive substrate; an undercoat layer formed on the conductive substrate and containing a polyurethane resin, metal oxide particles, a silane coupling agent, and a compound represented by General Formula (ID); and a photosensitive layer formed on the undercoat layer (where R1 to R8 each independently represent a hydrogen atom, a nitro group, a cyano group, a halogen atom, a hydroxyl group, a saturated or unsaturated aliphatic hydrocarbon group optionally having a substituent, an aromatic hydrocarbon group optionally having a substituent, an alkoxy group optionally having a substituent, an aryloxy group optionally having a substituent, a sulfo group optionally having a substituent, an amino group, an alkylamino group optionally having a substituent, or an arylamino group optionally having a substituent).

Abstract: An information processing device includes: a memory; and a processor coupled to the memory and configured to: assign a task to be executed to each arm of a robot system having arms; determine an execution time period for each operation included in each task assigned to the each arm based on whether the each operation is an operation in an interference region, in which the arms interfere with each other, or an operation in a non-interference region, in which the arms do not interfere with each other; and display workload charts of the arms side by side, an execution time period for each operation and a time period during which no operation is executed being arranged along a time axis in the workload chart of the each arm.

Abstract: Provided is a storage medium storing a program causing a computer to execute a process, the process including: repeating creation of a process plan and calculation of parameter values of the created process plan until calculated parameter values fall within respective first target ranges; storing the calculated parameter values; outputting the created process plan where all the calculated parameter values are within the respective first target ranges; when receiving a specification of a parameter value and a change of a target range of a specified parameter value to a second target range, determining a third target range of an unspecified parameter value based on the second target range and stored parameter values; repeating the creation and the calculation until the specified and unspecified parameter values respectively fall within the second and third target ranges; and outputting the created process plan where all the parameter values are within respective target ranges.

Abstract: A fabrication management system includes a fabrication control apparatus and a fabrication management server. The fabrication control apparatus includes a composite fabrication unit that fabricates multiple fabricated members in a single process, and a controller that controls fabrication performed by the composite fabrication unit. The fabrication management server includes a designing section that, from fabrication information about multiple first fabricated members for which a fabrication request has been made, designs a second fabricated member that holds all the first fabricated members in a removable manner, and an instructing section that instructs fabrication to be performed in accordance with fabrication procedure information, the fabrication procedure information indicating a procedure for obtaining a finished fabricated object by assembling together the first fabricated members and the second fabricated member.

Abstract: A fabrication management system includes a fabrication control apparatus and a fabrication management server. The fabrication control apparatus includes a composite fabrication unit that fabricates a fabricated component over a previously fabricated component to fabricate a finished fabricated object, and a controller that controls fabrication performed by the composite fabrication unit. The fabrication management server includes an instructing section that, by use of fabrication information about each of multiple fabricated components to be assembled into the finished fabricated object and positional information identifying a position onto which each fabricated component is assembled upon completion of the finished fabricated object, instructs fabrication to be performed by using the composite fabrication unit in accordance with fabrication procedure information used to sequentially perform fabrication in the height direction.

Abstract: An object formation image management system is provided. Image information containing a specific subject is extracted from image information in which subjects as candidates of a 3D object are. Multiple image-of-interest information which the specific subject is in and which are captured at different capturing viewpoints are extracted from the extracted image information to create design information for object formation by a 3D object formation device. The created design information is output to the 3D object formation device.

Abstract: When soldering a package having an electrode on which Ni/Au or Ag—Pd alloy is plated, to a printed circuit board having a Cu electrode or an electrode on which Cu is plated, a solid-phase diffusion layer is formed within a layered solder material for bonding different species of electrodes. The layered solder material is composed of a solder material of Sn—Ag—Cu series or Sn—Sb series and a solder material of Sn—Ag—Cu—Ni series or Sn—Pb series. The electrode on which Ni/Au or Ag—Pd alloy is plated and the Cu electrode or the electrode on which Cu is plated are soldered with the solder material of Sn—Ag—Cu series or Sn—Sb series being attached to the Cu electrode and the solder material of Sn—Ag—Cu—Ni series or Sn—Cu series being attached to the electrode on which Ni/Au or Ag—Pd alloy is plated. This restrains formation of intermetallic compounds and provides high bonding reliability.

Abstract: When soldering a package having an electrode on which Ni/Au or Ag—Pd alloy is plated, to a printed circuit board having a Cu electrode or an electrode on which Cu is plated, a solid-phase diffusion layer is formed within a layered solder material for bonding different species of electrodes. The layered solder material is composed of a solder material of Sn—Ag—Cu series or Sn—Sb series and a solder material of Sn—Ag—Cu—Ni series or Sn—Pb series. The electrode on which Ni/Au or Ag—Pd alloy is plated and the Cu electrode or the electrode on which Cu is plated are soldered with the solder material of Sn—Ag—Cu series or Sn—Sb series being attached to the Cu electrode and the solder material of Sn—Ag—Cu—Ni series or Sn—Cu series being attached to the electrode on which Ni/Au or Ag—Pd alloy is plated. This restrains formation of intermetallic compounds and provides high bonding reliability.

Abstract: A carrier tray for use with a prober is arranged to allow the prober to measure or test not only semiconductor wafers but also semiconductor packages and accurately position each of different-shaped semiconductor packages. A carrier tray includes a lowermost tray and an uppermost tray interposing therebetween an intermediate tray. The lowermost and uppermost trays and are each of a circular shape having a diameter D1. A diameter D3 of the intermediate tray is smaller than the diameter D1. The intermediate tray is centrally formed with a screw hole portion in which a locking spacer screw is screwed. A semiconductor package is to be placed in a package holding pocket. With the locking spacer screw, the intermediate is slidable in an X and Y directions, so that the X and Y coordinates of the semiconductor package are determined uniquely relative to the carrier tray.

Abstract: A carrier tray for use with a prober is arranged to allow the prober to measure or test not only semiconductor wafers but also semiconductor packages and accurately position each of different-shaped semiconductor packages. A carrier tray includes a lowermost tray and an uppermost tray interposing therebetween an intermediate tray. The lowermost and uppermost trays and are each of a circular shape having a diameter D1. A diameter D3 of the intermediate tray is smaller than the diameter D1. The intermediate tray is centrally formed with a screw hole portion in which a locking spacer screw is screwed. A semiconductor package is to be placed in a package holding pocket. With the locking spacer screw, the intermediate is slidable in an X and Y directions, so that the X and Y coordinates of the semiconductor package are determined uniquely relative to the carrier tray.

Abstract: A carrier tray for use with a prober is arranged to allow the prober to measure or test not only semiconductor wafers but also semiconductor packages and accurately position each of different-shaped semiconductor packages. A carrier tray 1 includes a lowermost tray 10 and an uppermost tray 20 interposing therebetween an intermediate tray 30. The lowermost and uppermost trays 10 and 20 are each of a circular shape having a diameter D1. A diameter D3 of the intermediate tray 30 is smaller than the diameter D1. The intermediate tray 30 is centrally formed with a screw hole portion 32 in which a locking spacer screw 22 is screwed. A semiconductor package 40 is to be placed in a package holding pocket 11. With the locking spacer screw 22, the intermediate 30 is slidable in an X and Y directions, so that the X and Y coordinates of the semiconductor package 40 are determined uniquely relative to the carrier tray 1.

Abstract: The method of manufacturing a head slider is capable of improving a floating characteristic and an electromagnetic conversion characteristic of the head slider. The method comprises the steps of: forming terminals on a leading end face of a row bar; forming a resist pattern, which corresponds to a configuration of an air bearing surface section to be formed on a facing surface of the row bar; partially thinning the facing surface of the row bar until reaching a groove surface so as to form the air bearing surface section; forming a base layer of a step section on the groove surface; forming a heater circuit, which is electrically connected to the terminals, on the base layer; and coating the base layer, on which the heater circuit has been formed, with a thermal expansion material layer so as to form the step section.

Abstract: The method of producing a head slider is capable of restraining variation of processing read-elements, forming the read-elements having a prescribed size, improving production yield and improving magnetoresistance characteristics. The method comprises the steps of: forming grooves in a wafer substrate, wherein the grooves correspond to raw bars to be cut from the wafer substrate; filling the grooves with an insulating material; forming read-elements and write-elements on the surface of the wafer substrate, whose grooves have been filled with the insulating material; and cutting the wafer substrate, on which the read-elements and the write-elements have been formed, along the grooves so as to form the raw bars, whose base members are constituted by the wafer substrate and coated with the insulating material.

Abstract: A carrier tray for use with a prober is arranged to allow the prober to measure or test not only semiconductor wafers but also semiconductor packages and accurately position each of different-shaped semiconductor packages. A carrier tray 1 includes a lowermost tray 10 and an uppermost tray 20 interposing therebetween an intermediate tray 30. The lowermost and uppermost trays 10 and 20 are each of a circular shape having a diameter D1. A diameter D3 of the intermediate tray 30 is smaller than the diameter D1. The intermediate tray 30 is centrally formed with a screw hole portion 32 in which a locking spacer screw 22 is screwed. A semiconductor package 40 is to be placed in a package holding pocket 11. With the locking spacer screw 22, the intermediate 30 is slidable in an X and Y directions, so that the X and Y coordinates of the semiconductor package 40 are determined uniquely relative to the carrier tray 1.

Abstract: The present invention provides a process for producing a metal nanoparticle composite film, which is capable of independently controlling the particle diameter and the volume filling ratio of metal nanoparticles in the metal nanoparticle composite film. The process comprises the steps of (a) treating a polyimide resin film with an alkali aqueous solution to thereby introduce a carboxyl group, (b) bringing the resin film into contact with a solution containing metal ions, to thereby dope the metal ions in the resin film, and (c) performing thermal reduction treatment in a reducing gas, thereby producing the metal nanoparticle composite film containing the metal nanoparticles dispersed in the polyimide resin film, wherein the volume filling ratio of the metal nanoparticles in the composite film is controlled by regulating the thickness of a nanoparticle dispersed layer formed in the polyimide resin film with the thermal reduction treatment in the reducing gas in the step (c).

Abstract: An injection molding machine comprises a pre-pressure addition means 2 adding a pre-pressure B acting in the opposite direction of a molding material pressure A received by a screw 1 to a detection means 3 and/or the screw 1, the detection means 3 detecting the axial pressures A and B of the screw, and a screw movement control means 4 controlling the axial pressure based on a different between the pre-pressure B and the molding material pressure A, wherein the pre-pressure addition means 2 is made non-contact with the direction means 3, a forward and backward driving motor 17 is disposed adjacent to a heating cylinder 10, and a screw connector 21 at the rear end of the screw 1 is spline-connected inside a rotating rotor of a screw rotating motor 12. According to the machine, the molding material pressure received by the screw can be accurately detected without being affected by the wear of the machine so as to properly control the axial pressure of the screw and to make the machine compact.