Patents by Inventor Satoshi Wakamatsu

Satoshi Wakamatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170057124
    Abstract: An object is to provide a method of manufacturing a transdermal absorption sheet and a transdermal absorption sheet that can suppress generation of air bubbles. In the method of manufacturing the transdermal absorption sheet that includes a drug solution filling step, a drug solution drying step, a base solution filling step, a base solution drying step, and a peeling-off step in that order, each step of at least from the drug solution filling step to the base solution drying step is performed in an environment with a temperature of 1° C. to 10° C.
    Type: Application
    Filed: November 14, 2016
    Publication date: March 2, 2017
    Applicant: FUJIFILM Corporation
    Inventors: Satoshi WAKAMATSU, Koki KABATA
  • Publication number: 20170036003
    Abstract: To provide a transdermal absorption sheet with which control of a dissolution rate and suppression of drug diffusion can be achieved, and a method of manufacturing the transdermal absorption sheet. A transdermal absorption sheet 100 is provided with a sheet portion 116, a plurality of frustum portions 114 that is disposed on the sheet portion 116, and needle portions 112 that are disposed on the frustum portions 114, each of the plurality of needle portions 112 includes a first layer 120 containing a drug and a second layer 122 not containing a drug, and at least one of the plurality of needle portions 112 contains an air bubble 124.
    Type: Application
    Filed: October 21, 2016
    Publication date: February 9, 2017
    Applicant: FUJIFILM Corporation
    Inventors: Satoshi WAKAMATSU, Koki KABATA
  • Patent number: 9505165
    Abstract: A nanoimprinting mold includes: a mold main body having a fine pattern of protrusions and recesses on a surface thereof; and a mold release layer formed on the surface of the mold main body. The mold release layer is formed within a mold release layer forming region, which is a region of the mold main body that includes a patterned region where the fine pattern of protrusions and recesses is formed and has an outer edge positioned outside the outer edge of the patterned region. An outer peripheral mold release layer has a thickness distribution in which the thickness of the outer peripheral mold release layer is locally maximal at positions outside the outer edge of the patterned region, substantially continuously along the entire periphery. Thereby, it becomes possible to restrict the region in which resist flows during nanoimprinting, without employing a mesa type substrate.
    Type: Grant
    Filed: March 28, 2014
    Date of Patent: November 29, 2016
    Assignee: FUJIFILM Corporation
    Inventors: Kazuharu Nakamura, Satoshi Wakamatsu
  • Patent number: 9201990
    Abstract: A simulation method predicts wet spreading and unions of a plurality of droplets arranged on a patterned surface defined by a fine pattern of protrusions and recesses, the patterned surface causing anisotropy to occur in the wet spreading of the droplets. The influence imparted by the pattern of protrusions and recesses that defines the patterned surface, which is the target of analysis, on the wet spreading of the droplets is treated as wetting properties of an analysis surface, and the wet spreading and unions of the plurality of droplets on the analysis surface are analyzed by gas liquid two phase flow analysis that incorporates the wetting property parameters that represents the wetting properties.
    Type: Grant
    Filed: September 26, 2013
    Date of Patent: December 1, 2015
    Assignee: FUJIFILM Corporation
    Inventors: Satoshi Wakamatsu, Takeshi Unemura, Kenichi Kodama, Takafumi Noguchi
  • Patent number: 9028022
    Abstract: According an aspect of the present invention, when causing the liquid ejection head to perform a feeding operation along a first direction, the substrate is retracted outside the projected feeding region of the liquid ejection head and the supporting member thereof prior to starting the feeding operation of the liquid ejection head, preventing dusts and other foreign matters, generated as a result of the feeding operation of the liquid ejection head and the supporting member, from being deposited on a surface of the substrate onto which the liquid is to be deposited.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: May 12, 2015
    Assignee: FUJIFILM Corporation
    Inventors: Kenichi Kodama, Satoshi Wakamatsu
  • Patent number: 9005512
    Abstract: A resist layer constituted by a resist composition (which may include unavoidable impurities) including a polymerizable compound that includes polyfunctional monomers that become polymers having three dimensional structures by cross linking when polymerized and a polymerization initiating agent which is activated by one of light and an electron beam is formed on a substrate. A surface of a mold having a predetermined pattern of protrusions and recesses is pressed against the resist layer. Light is irradiated onto the resist layer to cure the resist layer. The mold is separated from the resist layer under conditions that the temperature of the resist layer is 40° C. or greater.
    Type: Grant
    Filed: October 9, 2012
    Date of Patent: April 14, 2015
    Assignee: FUJIFILM Corporation
    Inventors: Tadashi Omatsu, Satoshi Wakamatsu
  • Publication number: 20140368568
    Abstract: According an aspect of the present invention, when causing the liquid ejection head to perform a feeding operation along a first direction, the substrate is retracted outside the projected feeding region of the liquid ejection head and the supporting member thereof prior to starting the feeding operation of the liquid ejection head, preventing dusts and other foreign matters, generated as a result of the feeding operation of the liquid ejection head and the supporting member, from being deposited on a surface of the substrate onto which the liquid is to be deposited.
    Type: Application
    Filed: August 28, 2014
    Publication date: December 18, 2014
    Inventors: Kenichi KODAMA, Satoshi WAKAMATSU
  • Patent number: 8894187
    Abstract: A liquid application device includes: a liquid discharge head having a structure in which nozzles for performing droplet ejection of a functional liquid onto a substrate are aligned in a row in a predetermined direction, and including liquid chambers connected to the nozzles respectively and piezoelectric elements which are provided correspondingly to the liquid chambers and serve to pressurize the liquid in the liquid chambers; a relative movement unit for causing relative movement between the substrate and the liquid discharge head; and a droplet ejection control unit for operating the piezoelectric elements so as to cause the liquid to land discretely on the substrate, and controlling operation of the piezoelectric elements according to each of groups formed by grouping the nozzles correspondingly to the structure of the liquid discharge head.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: November 25, 2014
    Assignee: FUJIFILM Corporation
    Inventors: Kenichi Kodama, Tadashi Omatsu, Satoshi Wakamatsu, Kunihiko Kodama
  • Patent number: 8851636
    Abstract: A liquid application device includes: a liquid discharge head having a structure in which nozzles for performing droplet ejection of a functional liquid onto a substrate are aligned in a row in a predetermined direction, and including liquid chambers connected to the nozzles respectively and piezoelectric elements which are provided correspondingly to the liquid chambers and serve to pressurize the liquid in the liquid chambers; a relative movement unit for causing relative movement between the substrate and the liquid discharge head; and a droplet ejection control unit for operating the piezoelectric elements so as to cause the liquid to land discretely on the substrate, and controlling operation of the piezoelectric elements according to each of groups formed by grouping the nozzles correspondingly to the structure of the liquid discharge head.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: October 7, 2014
    Assignee: FUJIFILM Corporation
    Inventors: Kenichi Kodama, Tadashi Omatsu, Satoshi Wakamatsu, Kunihiko Kodama
  • Publication number: 20140209565
    Abstract: A nanoimprinting mold includes: a mold main body having a fine pattern of protrusions and recesses on a surface thereof; and a mold release layer formed on the surface of the mold main body. The mold release layer is formed within a mold release layer forming region, which is a region of the mold main body that includes a patterned region where the fine pattern of protrusions and recesses is formed and has an outer edge positioned outside the outer edge of the patterned region. An outer peripheral mold release layer has a thickness distribution in which the thickness of the outer peripheral mold release layer is locally maximal at positions outside the outer edge of the patterned region, substantially continuously along the entire periphery. Thereby, it becomes possible to restrict the region in which resist flows during nanoimprinting, without employing a mesa type substrate.
    Type: Application
    Filed: March 28, 2014
    Publication date: July 31, 2014
    Applicant: FUJIFILM Corporation
    Inventors: Kazuharu NAKAMURA, Satoshi WAKAMATSU
  • Publication number: 20140210140
    Abstract: A nanoimprinting method employs a resist composition including polymerizable compounds and a polymerization initiating agent, each having absorption spectrum properties with absorption regions within a range from 250 nm to 500 nm. The polymerization initiating agent has an absorption region with a longer wavelength end wavelength longer than the longer wavelength end wavelength of the absorption region of the polymerizable compounds. Further, exposure of the resist composition is executed by light having spectral intensity properties that satisfy a predetermined relational formula. The present invention enables contamination of molds by adhered matter to be suppressed, and enables formation of resist patterns having sufficient etching resistance by nanoimprinting.
    Type: Application
    Filed: March 28, 2014
    Publication date: July 31, 2014
    Applicant: FUJIFILM CORPORATION
    Inventors: Tadashi OMATSU, Kazuharu Nakamura, Satoshi Wakamatsu
  • Publication number: 20140210134
    Abstract: A nanoimprinting apparatus is equipped with: a distortion imparting device that applies external force onto an imprinting member, which is one of a mold and a substrate, to maintain the imprinting member in a predetermined flexed state, thereby imparting permanent distortion to the imprinting member; and an imprinting unit that utilizes the imprinting member having the permanent distortion imparted thereto by the distortion imparting device to execute imprinting. A pattern of protrusions and recesses of the mold can be caused to contact resist from the central portion thereof utilizing any imprinting member, regardless of the rigidity of the imprinting member.
    Type: Application
    Filed: March 27, 2014
    Publication date: July 31, 2014
    Applicant: FUJIFILM Corporation
    Inventors: Satoshi WAKAMATSU, Akiko HATTORI
  • Patent number: 8789666
    Abstract: A friction couple including a frictionally rubbing member that contains at least one of a binder and a filler, in which the binder and the filler have a modulus of elasticity of 1 GPa or higher and 15 GPa or lower, no softening point or no glass transition point in the range of ?50° C. or higher and 200° C. or lower, and a compressive strength of 50 MPa or higher at 25° C. and 25 MPa or higher at 200° C.; and a frictionally rubbed member. The ratio of the maximum value tan ?(Max) to the minimum value tan ?(Min) of the loss tangent tan ? of the frictionally rubbing member obtained through a dynamic viscoelastic measurement performed at a frequency of 0.1 Hz or higher and 20 Hz or lower and in the range of ?50° C. or higher and 250° C. or lower after thermoforming is 5 or less.
    Type: Grant
    Filed: October 9, 2009
    Date of Patent: July 29, 2014
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Kenji Abe, Masaaki Nishiwaki, Hiroshi Isono, Yukihiro Shiomi, Hiroyuki Fujikawa, Satoshi Wakamatsu
  • Publication number: 20140131313
    Abstract: A simulation method predicts wet spreading and unions of a plurality of droplets arranged on a patterned surface defined by a fine pattern of protrusions and recesses, the patterned surface causing anisotropy to occur in the wet spreading of the droplets. The influence imparted by the pattern of protrusions and recesses that defines the patterned surface, which is the target of analysis, on the wet spreading of the droplets is treated as wetting properties of an analysis surface, and the wet spreading and unions of the plurality of droplets on the analysis surface are analyzed by gas liquid two phase flow analysis that incorporates the wetting property parameters that represents the wetting properties.
    Type: Application
    Filed: September 26, 2013
    Publication date: May 15, 2014
    Applicant: FUJIFILM CORPORATION
    Inventors: Satoshi WAKAMATSU, Takeshi UNEMURA, Kenichi KODAMA, Takafumi NOGUCHI
  • Publication number: 20140083454
    Abstract: Positions on a mold at which foreign matter is present are detected, and adhered position information related to the positions is obtained. Corresponding position information related to positions on a substrate, which are positions that correspond to the positions of the foreign matter when a pattern of protrusions and recesses and a surface of the substrate on which a curable composition is coated face each other and undergo a predetermined positioning operation, is generated based on the adhered position information. At least one droplet of the curable composition is arranged at the positions of the substrate. The pattern of protrusions and recesses is pressed against the surface of the substrate on which the composition is coated while administering the predetermined positioning operation. The curable composition is cured, and the mold is separated from the cured composition. Thereby, foreign matter adhered to molds can be removed efficiently and at low cost.
    Type: Application
    Filed: September 24, 2013
    Publication date: March 27, 2014
    Applicant: FUJIFILM Corporation
    Inventors: Satoshi WAKAMATSU, Tadashi OMATSU
  • Patent number: 8679357
    Abstract: Droplets of resist material are coated using the ink jet method under conditions that: the viscosity of the resist material is within a range from 8 cP to 20 cP, the surface energy of the resist material is within a range from 25 mN/m to 35 mN/m, the amount of resist material in each of the droplets is within a range from 1 pl to 10 pl, and the placement intervals among the droplets are within a range from 10 ?m to 1000 ?m. A mold is pressed against the surface of the substrate in a He and/or a depressurized atmosphere such that: an intersection angle formed between a main scanning direction of the ink jet method and the direction of the lines of the linear pattern of protrusions and recesses, which is an intersection angle when pressing the mold against the surface of the substrate, is within a range from 30° to 90°.
    Type: Grant
    Filed: March 21, 2013
    Date of Patent: March 25, 2014
    Assignee: Fujifilm Corporation
    Inventors: Satoshi Wakamatsu, Tadashi Omatsu
  • Publication number: 20140004221
    Abstract: A nanoimprinting mold has a fine pattern of protrusions and recesses constituted by a plurality of linear protrusions and a plurality of recesses on the surface thereof. The pattern of protrusions and recesses includes at least one recess having an end portion of a predetermined shape. The predetermined shape is that which has a cross section with a smaller aspect ratio than an aspect ratio of a cross section of a connecting portion, which is a portion of the recess having the end portion other than the end portion and continuous therewith. Thereby, the collapse of the end portions of protrusions of a pattern on curable resin when a mold is pressed against the curable resin on a substrate then separated therefrom can be suppressed, in nanoimprinting that employs a mold having a predetermined fine pattern of protrusions and recesses on the surface thereof.
    Type: Application
    Filed: September 6, 2013
    Publication date: January 2, 2014
    Applicant: FUJIFILM Corporation
    Inventors: Naotoshi SATO, Tadashi OMATSU, Satoshi WAKAMATSU
  • Publication number: 20140001675
    Abstract: In a nanoimprinting method, an assembly, of which the entire surface is directly exposable to the environment, is supported by a pressure vessel by a support member such that fluid pressure from the environment operates on the entire surface of the assembly. Gas is introduced into the pressure vessel, and fluid pressure exerted by the gas presses a mold and a substrate against each other. Thereby, pressing with uniform pressure onto a curable resin coated surface can be realized in nanoimprinting that employs a mesa type mold and/or a mesa type substrate to be processed, and the occurrence of residual film fluctuations can be suppressed.
    Type: Application
    Filed: September 6, 2013
    Publication date: January 2, 2014
    Applicant: FUJIFILM Corporation
    Inventors: Kazuharu NAKAMURA, Satoshi WAKAMATSU
  • Patent number: 8492466
    Abstract: A friction material including: an amorphous resin that has a chain-like polymer structure; and other components that constitute the friction material and that are components other than the amorphous resin, wherein dispersion treatment is preliminarily carried out in which the amorphous resin is dispersed in at least one of the other components, and a manufacturing method of the friction material.
    Type: Grant
    Filed: October 8, 2009
    Date of Patent: July 23, 2013
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Kenji Abe, Masaaki Nishiwaki, Hiroshi Isono, Hiroyuki Fujikawa, Satoshi Wakamatsu, Yoshio Shimura, Yuji Nagasawa
  • Patent number: 8469161
    Abstract: A friction couple including: a first friction member that contains a metallic material and includes a first friction surface; and a second friction member that includes a second friction surface that contacts the first friction surface and that contains an oxidation film developer that accelerates formation of an oxidation film on at least one of the first friction surface and the second friction surface by oxidizing the metallic material when the first friction surface and the second friction surface contact each other.
    Type: Grant
    Filed: October 9, 2009
    Date of Patent: June 25, 2013
    Assignees: Toyota Jidosha Kabushiki Kaisha, Advics Co., Ltd.
    Inventors: Kenji Abe, Masaaki Nishiwaki, Hiroshi Isono, Hiroyuki Fujikawa, Satoshi Wakamatsu, Yoshio Shimura, Yuji Nagasawa