Abstract: An organic insulator is produced by cured resin product containing a cyclic olefin copolymer as a main component and has a cumulative luminescence amount measured by chemiluminescence measurement method of 3.7×105 cpm or less. The glass transition temperature of the cured product is from 134° C. to 140° C. The cumulative luminescence amount is from 2.8×105 cpm to 3.2×105 cpm. A wiring board includes an insulation layer and an electrical conductor layer disposed on a surface of the insulation layer, and the insulation layer is the organic insulator described above.

Abstract: A laminated uncured sheet of the present disclosure has a structure in which resin sheet layers and resin layers are alternately laminated and a through hole penetrating in the laminating direction is formed, wherein the resin sheet layers are formed with a thermosetting resin composition containing a thermosetting resin as a main component, the resin layers are formed with a thermoplastic resin composition containing a thermoplastic resin, and the thermoplastic resin composition is adhered to the inner wall surface of the resin sheet layer part in the through hole.

Abstract: A wiring board includes an insulating layer comprising organic resin with inorganic particles, a first metal layer on a first surface, and a second metal layer disposed on a second surface. The insulating layer has a thickness of 75-1000 ?m and a storage modulus of 4 GPa-7 GPa. The first metal layer has a thickness of 1.5-10 ?m and a coverage of 5%-25%. The second metal layer has a thickness of 3-10 ?m or 25-100 ?m and a coverage of 85% or more. A surface part of the insulating layer on the first metal layer side has a higher ratio of organic resin than a surface part of the insulating layer on the second metal layer side.

Abstract: A laminated uncured sheet of the present disclosure has a structure in which resin sheet layers and resin layers are alternately laminated and a through hole penetrating in the laminating direction is formed, wherein the resin sheet layers are formed with a thermosetting resin composition containing a thermosetting resin as a main component, the resin layers are formed with a thermoplastic resin composition containing a thermoplastic resin, and the thermoplastic resin composition is adhered to the inner wall surface of the resin sheet layer part in the through hole.

Abstract: An organic insulator is composed an organic resin phase as a main component. The organic resin phase includes a weather-resistant stabilizer. The organic resin phase includes an inner region and a surface region formed in at least one surface of the inner region. The surface region has a higher content ratio of the weather-resistance stabilizer than the inner region. A metal-clad laminate includes the organic insulator and a metallic foil laminated on at least one surface of the organic insulator. A wiring board includes a plurality of insulating layers composed of the organic insulator, and a metallic foil disposed between the insulating layers.

Abstract: An organic insulator is composed an organic resin phase as a main component. The organic resin phase includes a weather-resistant stabilizer. The organic resin phase includes an inner region and a surface region formed in at least one surface of the inner region. The surface region has a higher content ratio of the weather-resistance stabilizer than the inner region. A metal-clad laminate includes the organic insulator and a metallic foil laminated on at least one surface of the organic insulator. A wiring board includes a plurality of insulating layers composed of the organic insulator, and a metallic foil disposed between the insulating layers.