Abstract: A method and system for utilizing an interlocking dissimilar metal component in the formation of a hard disk drive is disclosed. The method provides a hard disk drive component having at least one interlocking dissimilar metal component, the at least one interlocking dissimilar metal component having at least two dissimilar metals on a single side. The interlocking dissimilar metal component is utilized to provide a similar materials weld location for coupling two dissimilar metals to a single side surface of the at least one interlocking dissimilar metal hard disk drive component.

Abstract: A method and system for utilizing flexible members to reduce an operational disturbance between a slider and a flexure nose portion of a head gimbal assembly is disclosed. The method provides a slider coupled with a gimbal structure of the head gimbal assembly, the slider having a read/write head element with lead terminals thereon. The method further provides a flexure nose portion coupled with the gimbal structure. A gimbal window is provided in a stainless steel layer, the gimbal window located between the slider and the flexure nose portion on the gimbal structure. A flexible member is utilized at the gimbal window for coupling the slider and the gimbal structure, the flexible member for reducing an operational disturbance passed from the slider to the flexure nose portion of the gimbal structure.

Abstract: A stainless steel framework for changing the resonance frequency range of a flexure nose portion of a head gimbal assembly is disclosed. A slider is coupled with the head gimbal assembly, the slider having a read/write head element thereon. In addition, a flexure nose portion is coupled with the head gimbal assembly. Furthermore, a stainless steel framework between the flexure nose portion and the head gimbal assembly for changing the resonance vibration frequency of the flexure nose portion.

Abstract: A method for utilizing a stainless steel framework for changing the resonance frequency range of a flexure nose portion of a head gimbal assembly is disclosed. The method provides a slider coupled with the head gimbal assembly, the slider having a read/write head element thereon. In addition, a flexure nose portion is coupled with the head gimbal assembly. A stainless steel framework is provided between the flexure nose portion and the head gimbal assembly for changing the resonance vibration frequency of the flexure nose portion.

Abstract: A suspension flexure polyimide material web for damping a flexure nose portion of a head gimbal assembly is disclosed. A slider is coupled with the head gimbal assembly, the slider having a read/write head element thereon. In addition, a flexure nose portion is coupled with the head gimbal assembly. Furthermore, a suspension flexure polyimide material web is provided between the flexure nose portion and the head gimbal assembly for damping said flexure nose portion.

Abstract: A method for extending and utilizing a web made out of existing flexure base material polyimide to dampen a flexure nose portion of a head gimbal assembly is disclosed. The method provides a slider coupled with the head gimbal assembly, the slider having a read/write head element thereon. In addition, a flexure nose portion is coupled with the head gimbal assembly. A suspension flexure polyimide material web is provided between the flexure nose portion and the head gimbal assembly for damping said flexure nose portion.

Abstract: An apparatus and method for extending a cover layer formation with respect to a solder pad portion on an electrical lead suspension (ELS). The method provides a base-metal layer for the ELS. A dielectric layer is also provided above the base-metal layer, the dielectric layer covering a portion of the base-metal layer. A signal conductive layer is provided above dielectric layer. The signal conductive layer carries at least one solder pad portion. A cover layer is also provided over the portions of the dielectric layer not having a solder pad portion thereon, the cover layer reducing the possibility of forming an unwanted electric bridge and reducing damage to the dielectric layer during a solder reflow process.

Abstract: An electrical lead suspension (ELS) having partitioned air slots. The ELS includes a laminate. A first plurality of signal traces and a second plurality of traces are in a first formed layer of the laminate. The second plurality of traces may be signal traces or power traces. The laminate has a dielectric layer between the first formed layer and a second formed layer. A plurality of partitioned air slots is in the second formed layer of the laminate. The portion of the ELS having a plurality of partitioned air slots supporting the at least the first plurality of signal traces and the portion of the ELS having a second plurality of partitioned air slots or patterns supporting the second plurality of traces. The supporting of the first plurality of signal traces separate from the second plurality of traces reduces write-to-read cross talk and signal loss.

Abstract: An apparatus and method for reducing heat absorption around solder pads on an electrical lead suspension (ELS). The method provides a base-metal layer having at least one opening. A dielectric layer is also provided above the base-metal layer, the dielectric layer covering a portion of the base-metal layer and at least one of the openings in the base-metal layer. A signal conductive layer is provided above dielectric layer. The signal conductive layer carries at least one solder pad portion, wherein the solder pad portion is placed above the portion of the dielectric layer such that the solder pad portion does not align with the at least one opening in the base-metal layer. In so doing, the heat absorption with respect to the base-metal layer is reduced.

Abstract: An apparatus and method for reducing solder pad size and forming an opening in a base-metal layer of an electrical lead suspension. The method provides a base-metal layer having at least one opening. A dielectric layer is provided above the base-metal layer the dielectric layer covering a portion of the base-metal layer and at least one of the openings in the base-metal layer. A signal conductive layer is provided above dielectric layer. The signal conductive layer carries at least one solder pad portion, wherein the size of the solder pad portion and an amount of solder applied to the solder pad portion are reduced, the solder pad portion aligned above the dielectric layer covering at least one of the openings in the base-metal layer such that the solder pad to a ground capacitance is reduced thereby providing low signal reflection losses and a decrease in cross-talk.

Abstract: An apparatus and method for forming an opening in a base-metal layer of an electrical lead suspension (ELS) to increase the impedance. The method provides a base-metal layer having at least one opening. A dielectric layer above the base-metal layer is also provided, the dielectric layer covering a portion of the base-metal layer and at least one of the openings in the base-metal layer. A signal conductive layer is provided above dielectric layer. The signal conductive layer carries at least one solder pad portion, wherein the solder pad portion is aligned above the portion of the dielectric layer covering at least one of the openings in the base-metal layer. By aligning the at least one solder pad portion over the opening of the base-metal layer the solder pad to base-metal layer the impedance between the at least one solder pad portion and the base-metal layer is increased.

Abstract: A method and apparatus for reducing crosstalk and signal loss in an electrical interconnect is disclosed. The electrical interconnect includes a laminate. A plurality of signal traces and a subsequent plurality of traces are in a first formed layer of the laminate. The subsequent plurality of traces may be signal traces or power traces. The laminate has a dielectric layer between the first formed layer and a second formed layer. A plurality of serpentine patterns are in the second formed layer of the laminate. The plurality of serpentine patterns is separated from subsequent patterns. The plurality of serpentine patterns supports the plurality of signal traces and the subsequent plurality of patterns supports the subsequent plurality of traces. The supporting of the plurality of signal traces separate from the subsequent plurality of traces reduces write-to-read crosstalk and signal loss.

Abstract: An apparatus and method for reducing solder pad size in an electrical lead suspension (ELS) to decrease signal path capacitive discontinuities. The method provides a base-metal layer for the ELS. A dielectric layer above the base-metal layer is also provided. A signal conductive layer is provided above dielectric layer. The signal conductive layer carries at least one solder pad portion, wherein both a size of the solder pad portion and an amount of solder applied to the solder pad portion are reduced such that the solder pad to a ground, and solder on the solder pad to adjacent solder on adjacent pads, capacitance are reduced providing low signal reflection losses and a decrease in cross-talk.

Abstract: A microactuator device for effecting fine positioning of a transducing head with respect to a selected track on a disk having: an S-shaped piezoelectric element with three or more legs having opposite ends, wherein either; one end of the piezoelectric element is affixed or connected to one end of the slider, and the other end is affixed or connected to the flexure member, or both ends of the element affixed to corresponding ends of the slider and the center is affixed to the flexure, for obtaining movement of the head transducer to enable fast and accurate tracking of read/write tracks on a high track density disk. Attachment of the one leg of piezoelectric element to the flexure produces translation movement of the slider and head transducer while attachment of the center leg of the element to the flexure and the two ends legs to the slider produces a rotary movement of the head transducer.