Patents by Inventor Satya Kurada
Satya Kurada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10620134Abstract: Methods and systems for creating a sample of defects for a specimen are provided. One method includes detecting defects on a specimen based on output generated by a detector of an output acquisition subsystem. For the defects detected in an array region on the specimen, where the array region includes multiple array cell types, the method includes stacking information for the defects based on the multiple array cell types. The stacking includes overlaying design information for only a first of the multiple array cell types with the information for only the defects detected in the first of the multiple array cell types. In addition, the method includes selecting a portion of the detected defects based on results of the stacking thereby creating a sample of the detected defects.Type: GrantFiled: July 26, 2018Date of Patent: April 14, 2020Assignee: KLA-Tencor Corp.Inventors: Vidyasagar Anantha, Manikandan Mariyappan, Raghav Babulnath, Gangadharan Sivaraman, Satya Kurada, Thirupurasundari Jayaraman, Prasanti Uppaluri, Srikanth Kandukuri
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Publication number: 20190346375Abstract: Methods and systems for creating a sample of defects for a specimen are provided. One method includes detecting defects on a specimen based on output generated by a detector of an output acquisition subsystem. For the defects detected in an array region on the specimen, where the array region includes multiple array cell types, the method includes stacking information for the defects based on the multiple array cell types. The stacking includes overlaying design information for only a first of the multiple array cell types with the information for only the defects detected in the first of the multiple array cell types. In addition, the method includes selecting a portion of the detected defects based on results of the stacking thereby creating a sample of the detected defects.Type: ApplicationFiled: July 26, 2018Publication date: November 14, 2019Inventors: Vidyasagar Anantha, Manikandan Mariyappan, Raghav Babulnath, Gangadharan Sivaraman, Satya Kurada, Thirupurasundari Jayaraman, Prasanti Uppaluri, Srikanth Kandukuri
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Patent number: 9766187Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system. The method also includes generating a reference image for cell(s) in the array region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s).Type: GrantFiled: August 27, 2015Date of Patent: September 19, 2017Assignee: KLA-Tencor Corp.Inventors: Hong Chen, Kenong Wu, Eugene Shifrin, Masatoshi Yamaoka, Gangadharan Sivaraman, Raghav Babulnath, Satya Kurada, Shuo Sun
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Publication number: 20170103517Abstract: Methods and systems for design based sampling and binning for yield critical defects are provided. One method includes aligning each image patch in each inspection image frame generated for a wafer by an optical subsystem of an inspection system to design information for the wafer. The method also includes deriving multiple layer design attributes at locations of defects detected in the image patches. In addition, the method includes building a decision tree with the multiple layer design attributes. The decision tree is used to separate the defects into bins with different yield impacts on a device being formed on the wafer. The method also includes binning the defects with the decision tree.Type: ApplicationFiled: December 22, 2016Publication date: April 13, 2017Inventors: Satya Kurada, Raghav Babulnath, Kwok Ng, Lisheng Gao
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Patent number: 9563943Abstract: Methods and systems for design based sampling and binning for yield critical defects are provided. One method includes aligning each image patch in each inspection image frame generated for a wafer by an optical subsystem of an inspection system to design information for the wafer. The method also includes deriving multiple layer design attributes at locations of defects detected in the image patches. In addition, the method includes building a decision tree with the multiple layer design attributes. The decision tree is used to separate the defects into bins with different yield impacts on a device being formed on the wafer. The method also includes binning the defects with the decision tree.Type: GrantFiled: April 6, 2016Date of Patent: February 7, 2017Assignee: KLA-Tencor Corp.Inventors: Satya Kurada, Raghav Babulnath, Kwok Ng, Lisheng Gao
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Publication number: 20160225138Abstract: Methods and systems for design based sampling and binning for yield critical defects are provided. One method includes aligning each image patch in each inspection image frame generated for a wafer by an optical subsystem of an inspection system to design information for the wafer. The method also includes deriving multiple layer design attributes at locations of defects detected in the image patches. In addition, the method includes building a decision tree with the multiple layer design attributes. The decision tree is used to separate the defects into bins with different yield impacts on a device being formed on the wafer. The method also includes binning the defects with the decision tree.Type: ApplicationFiled: April 6, 2016Publication date: August 4, 2016Inventors: Satya Kurada, Raghav Babulnath, Kwok Ng, Lisheng Gao
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Patent number: 9310320Abstract: Methods and systems for design based sampling and binning for yield critical defects are provided. One method includes aligning each image patch in each inspection image frame generated for a wafer by an optical subsystem of an inspection system to design information for the wafer. The method also includes deriving multiple layer design attributes at locations of defects detected in the image patches. In addition, the method includes building a decision tree with the multiple layer design attributes. The decision tree is used to separate the defects into bins with different yield impacts on a device being formed on the wafer. The method also includes binning the defects with the decision tree.Type: GrantFiled: April 11, 2014Date of Patent: April 12, 2016Assignee: KLA-Tencor Corp.Inventors: Satya Kurada, Raghav Babulnath, Kwok Ng, Lisheng Gao
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Publication number: 20160061745Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system. The method also includes generating a reference image for cell(s) in the array region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s).Type: ApplicationFiled: August 27, 2015Publication date: March 3, 2016Inventors: Hong Chen, Kenong Wu, Eugene Shifrin, Masatoshi Yamaoka, Gangadharan Sivaraman, Raghav Babulnath, Satya Kurada, Shuo Sun
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Publication number: 20150120220Abstract: Methods and systems for detecting reliability defects on a wafer are provided. One method includes acquiring output for a wafer generated by an inspection system. The method also includes determining one or more geometric characteristics of one or more patterned features formed on the wafer based on the output. In addition, the method includes identifying which of the one or more patterned features will cause one or more reliability defects in a device being formed on the wafer based on the determined one or more characteristics.Type: ApplicationFiled: October 12, 2014Publication date: April 30, 2015Inventors: Joanne Wu, Ellis Chang, Lisheng Gao, Satya Kurada, Allen Park, Raghav Babulnath
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Publication number: 20140307947Abstract: Methods and systems for design based sampling and binning for yield critical defects are provided. One method includes aligning each image patch in each inspection image frame generated for a wafer by an optical subsystem of an inspection system to design information for the wafer. The method also includes deriving multiple layer design attributes at locations of defects detected in the image patches. In addition, the method includes building a decision tree with the multiple layer design attributes. The decision tree is used to separate the defects into bins with different yield impacts on a device being formed on the wafer. The method also includes binning the defects with the decision tree.Type: ApplicationFiled: April 11, 2014Publication date: October 16, 2014Applicant: KLA-Tencor CorporationInventors: Satya Kurada, Raghav Babulnath, Kwok Ng, Lisheng Gao