Abstract: A component management server computer (“server”) and processing methods are disclosed. In some embodiments, the server is programmed to continuously receive input data regarding what is happening in the physical room from one or more input devices. The server is programmed to then detect an utterance of a spoken word from the input data and generate one or more sound metrics based on the input data. Based on the sound metrics as applied to certain criteria, the server is programmed to activate a component, such as an input device, variable, software system, or output device, and cause one or more output devices to execute an action that alerts a user of the activated component. The server can also be programmed to turn on, off, up, or down any of the components based on the activated component.

Abstract: A device management server computer (“server”) and processing methods are disclosed. In some embodiments, the server is programmed to manage a plurality of input devices and output devices in a physical room. The server is programmed to analyze media data capturing actions performed by a user in real time as a participant in the physical room, determine how the user would like to connect at least one of the input devices and one of the output devices from the analysis, and enable the connection. The sever is programmed to interpret the actions and derive commands for connecting two or more devices based on predetermined data regarding the input devices and output devices and rules for referring to and connecting these devices.

Abstract: A device management server computer (“server”) and processing methods are disclosed. In some embodiments, the server is programmed to manage a plurality of input devices and output devices in a physical room. The server is programmed to analyze media data capturing actions performed by a user in real time as a participant in the physical room, determine how the user would like to connect at least one of the input devices and one of the output devices from the analysis, and enable the connection. The sever is programmed to interpret the actions and derive commands for connecting two or more devices based on predetermined data regarding the input devices and output devices and rules for referring to and connecting these devices.

Abstract: A device management server computer (“server”) is programmed to manage a plurality of input devices and output devices in a physical room. The server is programmed to analyze media data capturing actions performed by a user in real time as a participant in the physical room, determine how the user would like to connect at least one of the input devices and one of the output devices from the analysis, and enable the connection. The sever is programmed to interpret the actions and derive commands for connecting two or more devices based on predetermined data regarding the input devices and output devices and rules for referring to and connecting these devices.

Abstract: A device management server computer (“server”) is programmed to manage a plurality of input devices and output devices in a physical room. The server is programmed to analyze media data capturing actions performed by a user in real time as a participant in the physical room, determine how the user would like to connect at least one of the input devices and one of the output devices from the analysis, and enable the connection. The sever is programmed to interpret the actions and derive commands for connecting two or more devices based on predetermined data regarding the input devices and output devices and rules for referring to and connecting these devices.

Abstract: A method for predicting and quantifying risk in information technology (IT) service contracts includes comparing features of a new IT service contract with similar features from one or more previous IT service contracts selected from a plurality of previous IT service contracts to calculate a similarity value between each pair of the new IT service contract and one of the one or more previous IT service contracts, aggregating the similarity values, and using the aggregated similarity values with a prediction model to predict risk factors affecting the new IT service contract and to quantify an impact of each predicted risk factor on an expected gross profit margin.

Abstract: A method for predicting and quantifying risk in information technology (IT) service contracts includes comparing features of a new IT service contract with similar features from one or more previous IT service contracts selected from a plurality of previous IT service contracts to calculate a similarity value between each pair of the new IT service contract and one of the one or more previous IT service contracts, aggregating the similarity values, and using the aggregated similarity values with a prediction model to predict risk factors affecting the new IT service contract and to quantify an impact of each predicted risk factor on an expected gross profit margin.

Abstract: A method to form a closed air gap interconnect structure is described. A starting structure made of regions of a permanent support dielectric under the interconnect lines and surrounding interconnect vias with one or more sacrificial dielectrics present in the remaining portions of the interconnect structure, is capped with a dielectric barrier which is perforated using a stencil with a regular array of holes. The sacrificial dielectrics are then extracted through the holes in the dielectric barrier layer such that the interconnect lines are substantially surrounded by air except for the regions of the support dielectric under the lines. The holes in the cap layer are closed off by depositing a second barrier dielectric so that a closed air gap is formed. Several embodiments of this method and the resulting structures are described.

Abstract: A method to form a closed air gap interconnect structure is described. A starting structure made of regions of a permanent support dielectric under the interconnect lines and surrounding interconnect vias with one or more sacrificial dielectrics present in the remaining portions of the interconnect structure, is capped with a dielectric barrier which is perforated using a stencil with a regular array of holes. The sacrificial dielectrics are then extracted through the holes in the dielectric barrier layer such that the interconnect lines are substantially surrounded by air except for the regions of the support dielectric under the lines. The holes in the cap layer are closed off by depositing a second barrier dielectric so that a closed air gap is formed. Several embodiments of this method and the resulting structures are described.

Abstract: A structure incorporates very low dielectric constant (k) insulators with copper wiring to achieve high performance interconnects. The wiring is supported by a relatively durable low k dielectric such as SiLk or SiO2 and a very low k and less-robust gap fill dielectric is disposed in the remainder of the structure, so that the structure combines a durable layer for strength with a very low k dielectric for interconnect electrical performance.

Abstract: A method for forming an interconnect structure with nanocolumnar intermetal dielectric is described involving the construction of an interconnect structure using a solid dielectric, and introducing a regular array of vertically aligned nanoscale pores through stencil formation and etching to form a hole array and subsequently pinching off the tops of the hole array with a cap dielectric. Variations of the method and means to construct a multilevel nanocolumnar interconnect structure are also described.

Abstract: A method to form a closed air gap interconnect structure is described. A starting structure made of regions of a permanent support dielectric under the interconnect lines and surrounding interconnect vias with one or more sacrificial dielectrics present in the remaining portions of the interconnect structure, is capped with a dielectric barrier which is perforated using a stencil with a regular array of holes. The sacrificial dielectrics are then extracted through the holes in the dielectric barrier layer such that the interconnect lines are substantially surrounded by air except for the regions of the support dielectric under the lines. The holes in the cap layer are closed off by depositing a second barrier dielectric so that a closed air gap is formed. Several embodiments of this method and the resulting structures are described.