Abstract: A data management server computer (“server”) is disclosed. The server receives action data associated with one or more users identifying a plurality of actions performed through one or more computer devices in a multi-modal networked environment, identifies useful sequences of actions as compound actions, and generates deep links representing the compound actions as UI elements which when invoked cause execution of the represented compound actions.

Abstract: A data management server computer (“server”) is disclosed. The server receives action data associated with one or more users identifying a plurality of actions performed through one or more computer devices in a multi-modal networked environment, identifies useful sequences of actions as compound actions, and generates deep links representing the compound actions as UI elements which when invoked cause execution of the represented compound actions.

Abstract: A meeting summarization method, system, and computer program product, include capturing notes of a user including a time stamp from the user associated with a meeting, synchronizing an agenda of the meeting and the notes of the user based on a correlation between a time stamp of a topic on the agenda and a time stamp of the notes of the user, and analyzing the synchronized topic and the notes to determine highlights of the meeting based on a co-occurrence of the time stamp of the notes of the user and the time stamp of the topic on the agenda.

Abstract: A meeting summarization method, system, and computer program product, include compiling notes from a meeting between a plurality of users and providing a single document that summarizes the meeting based on the compiled notes.

Abstract: A room and activity management server computer (“server”) and processing methods are disclosed. In some embodiments, the server is programmed to manage multi-role activities collaboratively performed by multiple participants in a physical room with multiple media communications. For each activity, the server is configured to assign roles to participants and enforce rules that govern how the participants in given roles interact with one another or engage with the room at given times. In enforcing the rules, the server is programmed to improve such interaction and engagement through multimedia communications.

Abstract: A meeting summarization method, system, and computer program product, include capturing notes of a user including a time stamp from the user associated with a meeting, synchronizing an agenda of the meeting and the notes of the user based on a correlation between a time stamp of a topic on the agenda and a time stamp of the notes of the user, and analyzing the synchronized topic and the notes to determine highlights of the meeting based on a co-occurrence of the time stamp of the notes of the user and the time stamp of the topic on the agenda.

Abstract: A meeting summarization method, system, and computer program product, include capturing notes of a user including a time stamp from the user associated with a meeting, synchronizing an agenda of the meeting and the notes of the user based on a correlation between a time stamp of a topic on the agenda and a time stamp of the notes of the user, and analyzing the synchronized topic and the notes to determine highlights of the meeting based on a co-occurrence of the time stamp of the notes of the user and the time stamp of the topic on the agenda.

Abstract: A dual damascene article of manufacture comprises a trench containing a conductive metal column where the trench and the conductive metal column extend down into and are contiguous with a via. The trench and the conductive metal column and the via have a common axis. These articles comprise interconnect structures incorporating air-gap spacers containing metal/insulator structures for Very Large Scale Integrated (VLSI) and Ultra Large Scale Integrated (ULSI) devices and packaging. The trench in this regard comprises a sidewall air-gap immediately adjacent the side walls of the trench and the conductive metal column, the sidewall air-gap extending down to the via to a depth below a line fixed by the bottom of the trench, and continues downward in the via for a distance of from about 1 Angstrom below the line to the full depth of the via. In another aspect, the article of manufacture comprises a capped dual damascene structure.

Abstract: A meeting summarization method, system, and computer program product, include recording meeting audio of a meeting, capturing notes including a time stamp from each of a plurality of users associated with the meeting, synchronizing the recorded meeting audio of the meeting and each of the notes of each of the plurality of users based on a correlation between the time stamp, and analyzing the synchronized meeting audio and notes to determine highlights of the meeting based on a co-occurrence of notes between the plurality of users.

Abstract: A meeting summarization method, system, and computer program product, include capturing notes of a user including a time stamp from the user associated with a meeting, synchronizing an agenda of the meeting and the notes of the user based on a correlation between a time stamp of a topic on the agenda and a time stamp of the notes of the user, and analyzing the synchronized topic and the notes to determine highlights of the meeting based on a co-occurrence of the time stamp of the notes of the user and the time stamp of the topic on the agenda.

Abstract: A meeting summarization method, system, and computer program product, include recording meeting audio of a meeting, capturing notes including a time stamp from each of a plurality of users associated with the meeting, synchronizing the recorded meeting audio of the meeting and each of the notes of each of the plurality of users based on a correlation between the time stamp, and analyzing the synchronized meeting audio and notes to determine highlights of the meeting based on a co-occurrence of notes between the plurality of users.

Abstract: A meeting summarization method, system, and computer program product, include recording meeting audio of a meeting, capturing notes including a time stamp from each of a plurality of users associated with the meeting, synchronizing the recorded meeting audio of the meeting and each of the notes of each of the plurality of users based on a correlation between the time stamp, and analyzing the synchronized meeting audio and notes to determine highlights of the meeting based on a co-occurrence of notes between the plurality of users.

Abstract: A dual damascene article of manufacture comprises a trench containing a conductive metal column where the trench and the conductive metal column extend down into and are contiguous with a via. The trench and the conductive metal column and the via have a common axis. These articles comprise interconnect structures incorporating air-gap spacers containing metal/insulator structures for Very Large Scale Integrated (VLSI) and Ultra Large Scale Integrated (ULSI) devices and packaging. The trench in this regard comprises a sidewall air-gap immediately adjacent the side walls of the trench and the conductive metal column, the sidewall air-gap extending down to the via to a depth below a line fixed by the bottom of the trench, and continues downward in the via for a distance of from about 1 Angstrom below the line to the full depth of the via. In another aspect, the article of manufacture comprises a capped dual damascene structure.

Abstract: A method, system and computer program product are disclosed for performing a virtual experiment using one or more mobile communications devices. In the virtual experiment, one or more users tangibly manipulate one or more mobile devices to simulate an experiment. Each of the mobile devices includes sensors, and these sensors sense a set of parameters of the mobile devices and generate parameter signals. In an embodiment, the method includes processing the parameter signals according to a set of rules to generate processed signals; and using the processed signals to generate a display on one or more of the mobile devices to show features of the simulated experiment. In embodiments of the invention, the method further comprises authoring content for the experiment including declaratively creating the content for the experiment and an associated effect of the content on the experiment to create an experiment manifest.

Abstract: A dual damascene article of manufacture comprises a trench containing a conductive metal column where the trench and the conductive metal column extend down into and are contiguous with a via. The trench and the conductive metal column and the via have a common axis. These articles comprise interconnect structures incorporating air-gap spacers containing metal/insulator structures for Very Large Scale Integrated (VLSI) and Ultra Large Scale Integrated (ULSI) devices and packaging. The trench in this regard comprises a sidewall air-gap immediately adjacent the side walls of the trench and the conductive metal column, the sidewall air-gap extending down to the via to a depth below a line fixed by the bottom of the trench, and continues downward in the via for a distance of from about 1 Angstrom below the line to the full depth of the via. In another aspect, the article of manufacture comprises a capped dual damascene structure.

Abstract: A dual damascene article of manufacture comprises a trench containing a conductive metal column where the trench and the conductive metal column extend down into and are contiguous with a via. The trench and the conductive metal column and the via have a common axis. These articles comprise interconnect structures incorporating air-gap spacers containing metal/insulator structures for Very Large Scale Integrated (VLSI) and Ultra Large Scale Integrated (ULSI) devices and packaging. The trench in this regard comprises a sidewall air-gap immediately adjacent the side walls of the trench and the conductive metal column, the sidewall air-gap extending down to the via to a depth below a line fixed by the bottom of the trench, and continues downward in the via for a distance of from about 1 Angstrom below the line to the full depth of the via. In another aspect, the article of manufacture comprises a capped dual damascene structure.

Abstract: A dual damascene article of manufacture comprises a trench containing a conductive metal column where the trench and the conductive metal column extend down into and are contiguous with a via. The trench and the conductive metal column and the via have a common axis. These articles comprise interconnect structures incorporating air-gap spacers containing metal/insulator structures for Very Large Scale Integrated (VLSI) and Ultra Large Scale Integrated (ULSI) devices and packaging. The trench in this regard comprises a sidewall air-gap immediately adjacent the side walls of the trench and the conductive metal column, the sidewall air-gap extending down to the via to a depth below a line fixed by the bottom of the trench, and continues downward in the via for a distance of from about 1 Angstrom below the line to the full depth of the via. In another aspect, the article of manufacture comprises a capped dual damascene structure.

Abstract: A dual damascene article of manufacture comprises a trench containing a conductive metal column where the trench and the conductive metal column extend down into and are contiguous with a via. The trench and the conductive metal column and the via have a common axis. These articles comprise interconnect structures incorporating air-gap spacers containing metal/insulator structures for Very Large Scale Integrated (VLSI) and Ultra Large Scale Integrated (ULSI) devices and packaging. The trench in this regard comprises a sidewall air-gap immediately adjacent the side walls of the trench and the conductive metal column, the sidewall air-gap extending down to the via to a depth below a line fixed by the bottom of the trench, and continues downward in the via for a distance of from about 1 Angstrom below the line to the full depth of the via. In another aspect, the article of manufacture comprises a capped dual damascene structure.

Abstract: A dual damascene article of manufacture comprises a trench containing a conductive metal column where the trench and the conductive metal column extend down into and are contiguous with a via. The trench and the conductive metal column and the via have a common axis. These articles comprise interconnect structures incorporating air-gap spacers containing metal/insulator structures for Very Large Scale Integrated (VLSI) and Ultra Large Scale Integrated (ULSI) devices and packaging. The trench in this regard comprises a sidewall air-gap immediately adjacent the side walls of the trench and the conductive metal column, the sidewall air-gap extending down to the via to a depth below a line fixed by the bottom of the trench, and continues downward in the via for a distance of from about 1 Angstrom below the line to the full depth of the via. In another aspect, the article of manufacture comprises a capped dual damascene structure.

Abstract: A dual damascene article of manufacture comprises a trench containing a conductive metal column where the trench and the conductive metal column extend down into and are contiguous with a via. The trench and the conductive metal column and the via have a common axis. These articles comprise interconnect structures incorporating air-gap spacers containing metal/insulator structures for Very Large Scale Integrated (VLSI) and Ultra Large Scale Integrated (ULSI) devices and packaging. The trench in this regard comprises a sidewall air-gap immediately adjacent the side walls of the trench and the conductive metal column, the sidewall air-gap extending down to the via to a depth below a line fixed by the bottom of the trench, and continues downward in the via for a distance of from about 1 Angstrom below the line to the full depth of the via. In another aspect, the article of manufacture comprises a capped dual damascene structure.