Abstract: A new heat sink apparatus and method that simplify the assembly of the heat sink and thermal stud. The new heat sink assembly uses a spring retainer that, in most cases, can use existing socket mounting screws. A spring clip (202) presses a thermal stud (204) against the back of an electrical device package (206). The present invention is especially useful for attaching a spatial light modulator to a printed circuit board (106) since it provides a simple, reliable heat sink without blocking the light path to and from the device. The preceding abstract is submitted with the understanding that it only will be used to assist in determining, from a cursory inspection, the nature and gist of the technical disclosure as described in 37 C.F.R. § 1.72(b). In no case should this abstract be used for interpreting the scope of any patent claims.

Abstract: A new heat sink apparatus and method that simplify the assembly of the heat sink and thermal stud. The new heat sink assembly uses a spring retainer that, in most cases, can use existing socket mounting screws. A spring clip (202) presses a thermal stud (204) against the back of an electrical device package (206). The present invention is especially useful for attaching a spatial light modulator to a printed circuit board (106) since it provides a simple, reliable heat sink without blocking the light path to and from the device. The preceding abstract is submitted with the understanding that it only will be used to assist in determining, from a cursory inspection, the nature and gist of the technical disclosure as described in 37 C.F.R. § 1.72(b). In no case should this abstract be used for interpreting the scope of any patent claims.

Abstract: A new heat sink apparatus and method that simplify the assembly of the heat sink and thermal stud. The new heat sink assembly uses a spring retainer that, in most cases, can use existing socket mounting screws. A spring clip presses a thermal stud against the back of an electrical device package. The present invention is especially useful for attaching a spatial light modulator to a printed circuit board since it provides a simple, reliable heat sink without blocking the light path to and from the device.

Abstract: A method for removing heat from a spatial light modulator device in a digital projection display by encapsulating the device package in a thermal conductive socket attached to a printed wiring board. The socket wraps around the device package to remove both optically generated heat from the front of the device and electrically generated heat within the device. In higher brightness projector applications, fins are added to the socket to increase the mass and surface area of the socket, thereby improving the heat dissipation properties of the system. The heat sink socket attaches to the printed wiring board using a screw attachment means, which also assures electrical connectivity to the spatial light modulator through a interposer element between the device and spatial light modulator. This approach completely eliminates conventional heat sinks, mounting studs, and fasteners, which have been failure mechanisms in these type displays.

Abstract: A new heat sink apparatus and method that simplify the assembly of the heat sink and thermal stud. The new heat sink assembly uses a spring retainer that, in most cases, can use existing socket mounting screws. A spring clip (202) presses a thermal stud (204) against the back of an electrical device package (206). The present invention is especially useful for attaching a spatial light modulator to a printed circuit board (106) since it provides a simple, reliable heat sink without blocking the light path to and from the device. The preceding abstract is submitted with the understanding that it only will be used to assist in determining, from a cursory inspection, the nature and gist of the technical disclosure as described in 37 C.F.R. §1.72(b). In no case should this abstract be used for interpreting the scope of any patent claims.

Abstract: A method for removing heat from a spatial light modulator device in a digital projection display by encapsulating the device package in a thermal conductive socket attached to a printed wiring board. The socket wraps around the device package to remove both optically generated heat from the front of the device and electrically generated heat within the device. In higher brightness projector applications, fins are added to the socket to increase the mass and surface area of the socket, thereby improving the heat dissipation properties of the system. The heat sink socket attaches to the printed wiring board using a screw attachment means, which also assures electrical connectivity to the spatial light modulator through a interposer element between the device and spatial light modulator. This approach completely eliminates conventional heat sinks, mounting studs, and fasteners, which have been failure mechanisms in these type displays.