Patents by Inventor SAUL LEE

SAUL LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10558117
    Abstract: According to a first aspect of the present invention, an imprint apparatus for contacting a mold with a resin applied to a substrate to perform patterning on the substrate is provided that comprises a dispenser configured to apply the resin to the substrate; and a resin supply unit configured to supply the resin to the dispenser, wherein the resin supply unit comprises a resin storage tank configured to store the resin; a pump configured to continuously circulate the resin between the resin storage tank and the dispenser, and a filter arranged at a flow path of circulated resin, configured to remove a foreign matter or a metal ion.
    Type: Grant
    Filed: May 20, 2015
    Date of Patent: February 11, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Van Nguyen Truskett, Matthew S. Shafran, Saul Lee, Yoshikazu Miyajima
  • Patent number: 9827707
    Abstract: A process, for joining workpieces using hybrid mechanical connector-resistance welding. The process in some embodiments includes introducing a conductive fluid to an interface between the workpieces. The process also includes inserting at least one mechanical conductive connector into at least one of the workpieces so that the connector reaches the interface having the conductive fluid therein. The process in some embodiments includes further applying energy for welding to the at least one mechanical conductive connector so that the energy passes, through the connector, to the conductive fluid and heat is generated in the workpieces at the interface, thereby melting the workpieces and forming a weld joint connecting the workpieces.
    Type: Grant
    Filed: August 7, 2014
    Date of Patent: November 28, 2017
    Assignee: GM Global Technology Operations LLC
    Inventors: Pei-Chung Wang, Chen-Shih Wang, Yongqiang Li, Saul Lee, Hamid Kia
  • Publication number: 20160339626
    Abstract: According to a first aspect of the present invention, an imprint apparatus for contacting a mold with a resin applied to a substrate to perform patterning on the substrate is provided that comprises a dispenser configured to apply the resin to the substrate; and a resin supply unit configured to supply the resin to the dispenser, wherein the resin supply unit comprises a resin storage tank configured to store the resin; a pump configured to continuously circulate the resin between the resin storage tank and the dispenser, and a filter arranged at a flow path of circulated resin, configured to remove a foreign matter or a metal ion.
    Type: Application
    Filed: May 20, 2015
    Publication date: November 24, 2016
    Inventors: Van Nguyen Truskett, Matthew S. Shafran, Saul Lee, Yoshikazu Miyajima
  • Publication number: 20150053328
    Abstract: A process, for joining workpieces using hybrid mechanical connector-resistance welding. The process in some embodiments includes introducing a conductive fluid to an interface between the workpieces. The process also includes inserting at least one mechanical conductive connector into at least one of the workpieces so that the connector reaches the interface having the conductive fluid therein. The process in some embodiments includes further applying energy for welding to the at least one mechanical conductive connector so that the energy passes, through the connector, to the conductive fluid and heat is generated in the workpieces at the interface, thereby melting the workpieces and forming a weld joint connecting the workpieces.
    Type: Application
    Filed: August 7, 2014
    Publication date: February 26, 2015
    Inventors: PEI-CHUNG WANG, CHEN-SHIH WANG, YONGQIANG LI, SAUL LEE, HAMID KIA
  • Patent number: 4094568
    Abstract: Two types of connectors including a crossover connector and a test connector for a receptacle attached to two back-to-back planar circuitboards.The receptacle includes a plurality of apertures containing metallic leads which are attached to terminals on both printed circuitboards.One face of the crossover connector has a plurality of pins which are to be received into the apertures of the receptacle in order to connect any desired combination of terminals on the two printed circuitboards while simultaneously isolating the other terminals. The opposite face of the connector contains a plurality of apertures so that an electrical probe can have easy access to its interconnecting and isolating pins.The test connector includes two subassemblies, the first of which is comprised of an insulated body containing pin structures similar to the isolating pin structure of the crossover connector except that it contains pins which extend from both faces of its body.
    Type: Grant
    Filed: September 26, 1977
    Date of Patent: June 13, 1978
    Assignee: General Electric Company
    Inventors: Laurence Saul Lee, Joseph Philip Roback