Patents by Inventor Saurabh Lohokare

Saurabh Lohokare has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Antimonide-based optical devices
    Patent number: 7170096
    Abstract: An optical device includes an antimonide-containing substrate, and an antimonide-containing n-doped layer provided on the substrate. The optical device further includes an antimonide-containing i-doped layer provided on the n-doped layer, an antimonide-containing p-doped layer provided on the i-doped layer, and an antimonide-containing p+-doped layer provided on the p-doped layer.
    Type: Grant
    Filed: January 21, 2005
    Date of Patent: January 30, 2007
    Assignee: The University of Delaware
    Inventors: Saurabh Lohokare, Dennis W. Prather
  • Method for creating flip-chip conductive-polymer bumps using photolithography and polishing
    Patent number: 7109107
    Abstract: A method for fabricating a flip-chip semiconductor device having plural conductive polymer bumps includes forming plural molds on a substrate using a photolithographic technique; filling the molds by applying and spinning a layer of conductive polymer material onto the substrate; polishing the conductive polymer material layer to remove excess conductive material from a surface of the substrate; and stripping the plural molds from the substrate to reveal the plural bumps. In various aspects of disclosure, either positive resist or negative resist may be used. The electrical contact resistance compares favorably with squeegee-based bumps; there is an improvement in the contact resistance of the bumps patterned using polishing techniques in comparison to that of squeegee-based conductive polymer bumps.
    Type: Grant
    Filed: August 9, 2004
    Date of Patent: September 19, 2006
    Assignee: University of Delaware
    Inventors: Dennis W. Prather, Saurabh Lohokare
  • Antimonide-based optical devices
    Publication number: 20060054918
    Abstract: An optical device includes an antimonide-containing substrate, and an antimonide-containing n-doped layer provided on the substrate. The optical device further includes an antimonide-containing i-doped layer provided on the n-doped layer, an antimonide-containing p-doped layer provided on the i-doped layer, and an antimonide-containing p+-doped layer provided on the p-doped layer.
    Type: Application
    Filed: January 21, 2005
    Publication date: March 16, 2006
    Applicant: The University of Delaware
    Inventors: Saurabh Lohokare, Dennis Prather
  • METHOD FOR CREATING FLIP-CHIP CONDUCTIVE-POLYMER BUMPS USING PHOTOLITHOGRAPHY AND POLISHING
    Publication number: 20050032272
    Abstract: A method for fabricating a flip-chip semiconductor device having plural conductive polymer bumps includes forming plural molds on a substrate using a photolithographic technique; filling the molds by applying and spinning a layer of conductive polymer material onto the substrate; polishing the conductive polymer material layer to remove excess conductive material from a surface of the substrate; and stripping the plural molds from the substrate to reveal the plural bumps. In various aspects of disclosure, either positive resist or negative resist may be used. The electrical contact resistance compares favorably with squeegee-based bumps; there is an improvement in the contact resistance of the bumps patterned using polishing techniques in comparison to that of squeegee-based conductive polymer bumps.
    Type: Application
    Filed: August 9, 2004
    Publication date: February 10, 2005
    Applicant: UNIVERSITY OF DELAWARE
    Inventors: Dennis Prather, Saurabh Lohokare