Abstract: Various structures that implement topside metal routing and backside metal routing in combination with vertical transistors are disclosed. The various structures include cells that form inverter devices, NAND devices, and MUX (multiplexer) devices. The disclosed cells include two or four vertical transistors with various connections made to the transistors that include either connected gate logic for inverter and NAND devices or disconnected gate logic for MUX devices.

Abstract: A SRAM cell layout that implements stacked transistors is disclosed. The cell layout utilizes both topside metal routing and backside metal routing along with stacked transistors to provide multiple transistors for implementation of inverters and pass gates in a memory cell. Various connection routes between components of the transistors (e.g., gates, sources, and drains) are made to allow cross-coupling between inverters in the memory cell.

Abstract: A cell layout that implements stacked transistors is disclosed. The cell layout utilizes both topside metal routing and backside metal routing. Various connection routes between components of the transistors (e.g., gates, sources, and drains) and either the topside metal routing or the backside metal routing can be made. The specific connection routes can be determined based on a desired device construction. Thus, the cell layout disclosed enables various devices to be constructed based on a basic cell structure.

Abstract: A memory device layout that implements SRAM cells with stacked transistors is disclosed. The memory utilizes both topside metal routing and backside metal routing for routing of bitlines between bit cells with stacked transistors and logic cells coupled to the bit cells.

Abstract: Microelectronic modules are described. In an embodiment, a microelectronic module includes a module substrate, a chip mounted onto the module substrate, and a semiconductor-based integrated passive device between the chip and the module substrate. The semiconductor-based integrated passive device may include an upper RDL stack-up with thicker wiring layers than a lower BEOL stack-up. The semiconductor-based integrated passive device may be further solder bonded or hybrid bonded with the chip.