Abstract: Provided is a room temperature moisture-curable silicone gel composition containing: (A) diorganopolysiloxane, both terminals of which are blocked by silanol groups; (B) hydrolysable organosilicon compound represented by Formula (2) and/or a partial hydrolysate thereof (where R2 is a monovalent hydrocarbon group, R3 is an alkyl group or a cycloalkyl group, and a is 2 or 3.); (C) a curing catalyst; and (D) a heat-resistant aid containing a homogeneous mixture of (D-a), (D-b), and (D-c) (where (D-a) is organopolysiloxane having a viscosity of 10-10,000 mPa·s at 25° C., (D-b) is carboxylate of cerium, and (D-c) is a titanium compound and/or a partial hydrolytic condensate thereof). This room temperature moisture-curable silicone gel composition can be a silicone gel cured product which has a small variation rate of low-stress properties evaluated by the index such as penetration even under heat-resistant conditions exceeding 230° C. and which has excellent heat-resistance.

Abstract: The present invention is a curable silicone resin composition, the composition containing a linear organopolysiloxane, where the linear organopolysiloxane consists solely of a linear organopolysiloxane that has a less than 70% change rate of a contact angle of the linear organopolysiloxane to an Au substrate, the change rate being shown by the following expression (I): [{(contact angle of the linear organopolysiloxane to the Au substrate 2 seconds after dropping the linear organopolysiloxane)?(contact angle of the linear organopolysiloxane to the Au substrate 60 seconds after dropping the linear organopolysiloxane)}/(contact angle of the linear organopolysiloxane to the Au substrate 2 seconds after dropping the linear organopolysiloxane)]*100(%) (I). This provides a curable silicone resin composition that causes little contamination of surrounding members, and in which bleed-out hardly occurs.

Abstract: Provided is a room temperature moisture-curable silicone gel composition containing: (A) diorganopolysiloxane, both terminals of which are blocked by silanol groups; (B) hydrolysable organosilicon compound represented by Formula (2) and/or a partial hydrolysate thereof (where R2 is a monovalent hydrocarbon group, R3 is an alkyl group or a cycloalkyl group, and a is 2 or 3.); (C) a curing catalyst; and (D) a heat-resistant aid containing a homogeneous mixture of (D-a), (D-b), and (D-c) (where (D-a) is organopolysiloxane having a viscosity of 10-10,000 mPa·s at 25° C., (D-b) is carboxylate of cerium, and (D-c) is a titanium compound and/or a partial hydrolytic condensate thereof). This room temperature moisture-curable silicone gel composition can be a silicone gel cured product which has a small variation rate of low-stress properties evaluated by the index such as penetration even under heat-resistant conditions exceeding 230° C. and which has excellent heat-resistance.