Abstract: A thermocoupled lift system for semiconductor etch chambers. The system comprises multiple thermocoupled lift pins which are vertically extendible from a heater block inside a semiconductor etch chamber and are capable of lowering a semiconductor wafer onto the heater block before the etching process and lifting the wafer from the heater block after the etching process. In the event that the temperature of the wafer exceeds a predetermined value after the etching process, the lift pins trigger release of a cooling purge gas such as nitrogen into the etching chamber to partially cool the wafer prior to transfer of the wafer to a cool down chamber for further cooling. The initial gas-induced cooling of the wafer prevents thermal stressing thereof upon transfer of the wafer to the cool down chamber.