Abstract: A semiconductor device and associated methods are disclosed. In one example, a processor die is coupled to a first side of a package substrate, and a memory die coupled to a second side of the package substrate. A system accelerator die is further coupled to the package substrate. In selected examples, the system accelerator die provides performance improvements, such as higher cached memory speed and/or higher memory bandwidth.

Abstract: A semiconductor device and associated methods are disclosed. In one example, a processor die is coupled to a first side of a package substrate, and a memory die coupled to a second side of the package substrate. A system accelerator die is further coupled to the package substrate. In selected examples, the system accelerator die provides performance improvements, such as higher cached memory speed and/or higher memory bandwidth.

Abstract: Microelectronic devices having a multiple-component substrate assembly. A primary supports one or more integrated circuits, and an auxiliary substrate is coupled to, and makes electrical connections with, the primary substrate. The primary substrate will define a pinout for some or all contacts of the integrated circuit, and the auxiliary substrate will provide an additional pinout option. Different configurations of a single primary substrate may be adapted to different applications through use of different configurations of auxiliary substrates.

Abstract: Microelectronic devices having a multiple-component substrate assembly. A primary supports one or more integrated circuits, and an auxiliary substrate is coupled to, and makes electrical connections with, the primary substrate. The primary substrate will define a pinout for some or all contacts of the integrated circuit, and the auxiliary substrate will provide an additional pinout option. Different configurations of a single primary substrate may be adapted to different applications through use of different configurations of auxiliary substrates.