Patents by Inventor Sayaka Doi

Sayaka Doi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210206004
    Abstract: An end effector includes a palm and a plurality of fingers capable of moving in a direction intersecting an extending direction of each of fingers as well as approaching each other and grasping and object being grasped. At least one of the plurality of fingers includes a proximity sensor unit provided at a tip portion in the extending direction, the proximity sensor unit being placed capable of detecting approach and separation of the proximity sensor unit with respect to an object in the extending direction and capable of detecting approach and separation of the object with respect to the proximity sensor unit in the extending direction. The proximity sensor unit includes a frame shaped detection region that covers an edge of the tip portion when viewed from the extending direction.
    Type: Application
    Filed: March 12, 2019
    Publication date: July 8, 2021
    Inventors: Sayaka DOI, Hiroki KOGA, Misato NABETO
  • Publication number: 20110221056
    Abstract: An electrode structure has a Cu electrode that provided in a surface of a substrate, a diffusion preventing film that is made of a material in which a diffusion coefficient of Sn is equal to or lower than 3×10?23 cm2/sec, the whole Cu electrode being covered with the diffusion preventing film, and a solder layer that is provided above the diffusion preventing film, the solder layer being made of Au—Sn solder.
    Type: Application
    Filed: December 22, 2010
    Publication date: September 15, 2011
    Applicant: OMRON CORPORATION
    Inventors: Takaaki Miyaji, Akihiko Sano, Tadashi Inoue, Toshiaki Okuno, Yoshiki Hada, Sayaka Doi, Yoshiki Ashihara
  • Publication number: 20110220406
    Abstract: In an electrode portion structure in which an electrode is formed in an end portion of a through-wiring, disconnection is prevented in an electrode portion. A through-hole that vertically pierces a substrate is made in the substrate, and a through-electrode is provided in the through-hole. The through-electrode is projected in s curved-surface manner from an upper surface of the substrate. The upper surface of the substrate 12 is coated with an insulating film, and a contact hole is made in the insulating film while aligned with the through-electrode. An opening diameter of the contact hole is lower than a sectional diameter of the through-electrode, and surroundings of an upper surface of the through-electrode are coated with the contact hole. A thickness Ddiel of the insulating film is equal to or lower than a projection length Dp of the through-electrode from the upper surface of the substrate at an opening edge of the contact hole.
    Type: Application
    Filed: December 23, 2010
    Publication date: September 15, 2011
    Applicant: OMRON CORPORATION
    Inventors: Sayaka Doi, Toshiaki Okuno, Akihiko Sano, Takaaki Miyaji, Yoshiki Hada