Patents by Inventor Sayaka ENOKI

Sayaka ENOKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive sheet for wafer protection
    Patent number: 10253222
    Abstract: There is provided a pressure sensitive adhesive sheet for wafer protection (1a) comprising a base material (11), an intermediate layer (12), and a pressure sensitive adhesive layer (13) in this order, wherein the intermediate layer is a layer formed from an intermediate layer-forming composition containing 100 parts by mass of a non-energy ray-curable acrylic polymer (A) and 25 parts by mass or more of an energy ray-curable acrylic polymer (B) having a mass average molecular weight of 50,000 to 250,000; and the pressure sensitive adhesive layer is a layer formed from a pressure sensitive adhesive composition containing an energy ray-curable acrylic polymer (C). The inventive pressure sensitive adhesive sheet for wafer protection is excellent in interfacial adhesion between an intermediate layer and a pressure sensitive adhesive layer after energy ray irradiation.
    Type: Grant
    Filed: December 3, 2014
    Date of Patent: April 9, 2019
    Assignee: LINTEC CORPORATION
    Inventors: Sayaka Enoki, Yuki Morita
  • ADHESIVE SHEET FOR WAFER PROTECTION
    Publication number: 20160333225
    Abstract: There is provided a pressure sensitive adhesive sheet for wafer protection (1a) comprising a base material (11), an intermediate layer (12), and a pressure sensitive adhesive layer (13) in this order, wherein the intermediate layer is a layer formed from an intermediate layer-forming composition containing 100 parts by mass of a non-energy ray-curable acrylic polymer (A) and 25 parts by mass or more of an energy ray-curable acrylic polymer (B) having a mass average molecular weight of 50,000 to 250,000; and the pressure sensitive adhesive layer is a layer formed from a pressure sensitive adhesive composition containing an energy ray-curable acrylic polymer (C). The inventive pressure sensitive adhesive sheet for wafer protection is excellent in interfacial adhesion between an intermediate layer and a pressure sensitive adhesive layer after energy ray irradiation.
    Type: Application
    Filed: December 3, 2014
    Publication date: November 17, 2016
    Applicant: LINTEC CORPORATION
    Inventors: Sayaka ENOKI, Yuki MORITA