Patents by Inventor Sayaka MAKISE

Sayaka MAKISE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of evaluating silicon layer and a method of manufacturing silicon epitaxial wafer
    Patent number: 11183433
    Abstract: Provided is a method of evaluating a silicon layer, including forming an oxide film on a surface of a silicon layer, performing a charging treatment of charging a surface of the formed oxide film to a negative charge, and measuring a resistivity of the silicon layer that has been subjected to the charging treatment by a van der Pauw method.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: November 23, 2021
    Assignee: SUMCO CORPORATION
    Inventors: Sayaka Makise, Shuichi Samata, Noritomo Mitsugi, Sumio Miyazaki
  • METHOD OF EVALUATING SILICON LAYER AND A METHOD OF MANUFACTURING SILICON EPITAXIAL WAFER
    Publication number: 20200343149
    Abstract: Provided is a method of evaluating a silicon layer, including forming an oxide film on a surface of a silicon layer, performing a charging treatment of charging a surface of the formed oxide film to a negative charge, and measuring a resistivity of the silicon layer that has been subjected to the charging treatment by a van der Pauw method.
    Type: Application
    Filed: January 18, 2019
    Publication date: October 29, 2020
    Applicant: SUMCO CORPORATION
    Inventors: Sayaka MAKISE, Shuichi SAMATA, Noritomo MITSUGI, Sumio MIYAZAKI