Patents by Inventor Sayaka Ooike

Sayaka Ooike has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8829142
    Abstract: The present curable composition comprises an organosilicon compound produced by hydrolysis copolycondensation of (A) a silicon compound R0Si(R1)nX13-n [wherein R0 represents a (meth)acryloyl group; and X1 represents a hydrolyzable group] and (B) a silicon compound SiY14 [wherein Y1 represents a siloxane-bond forming group] under an alkaline condition at a ratio of compound (A) to compound (B) of 1:(0.3 to 1.8) by mol. The present process for producing an organosilicon compound comprises a reaction process of conducting alcohol exchange reaction of a silicon compound. SiY24 [wherein Y2 represents a siloxane-bond forming group] in 1-propanol to produce a composition; and a condensation process of adding a silicon compound R0Si(R1)nX23-n [wherein R0 represents a (meth)acryloyl group; and X2 represents a hydrolyzable group] to the composition to perform the hydrolysis copolycondensation of the silicon compounds under alkaline conditions.
    Type: Grant
    Filed: April 14, 2009
    Date of Patent: September 9, 2014
    Assignee: Toagosei Co., Ltd.
    Inventors: Sayaka Ooike, Akinori Kitamura, Hiroshi Suzuki
  • Patent number: 8329774
    Abstract: The object of the present invention is to provide an organosilicon compound having an oxetanyl group, which has a high proportion of an inorganic part in the structure, which, after production thereof, is stable with no gelling, and which has excellent storage stability when it is formed into a composition, and a production method thereof and a curable composition. The organosilicon compound is a compound having an oxetanyl group obtained by a method including a process in which a silicon compound A represented by the formula (1) and a silicon compound B having four siloxane bond-forming groups are subjected to hydrolysis and condensation at a ratio of 0.3 to 2.8 mol of silicon compound B based on 1 mol of silicon compound A.
    Type: Grant
    Filed: January 9, 2009
    Date of Patent: December 11, 2012
    Assignee: Toagosei Co., Ltd.
    Inventors: Sayaka Ooike, Hiroshi Suzuki, Akinori Kitamura
  • Publication number: 20110071255
    Abstract: The present curable composition comprises an organosilicon compound produced by hydrolysis copolycondensation of (A) a silicon compound R0Si(R1)nX13-n [wherein R0 represents a (meth)acryloyl group; and X1 represents a hydrolyzable group] and (B) a silicon compound SiY14 [wherein Y1 represents a siloxane-bond forming group] under an alkaline condition at a ratio of compound (A) to compound (B) of 1:(0.3 to 1.8) by mol. The present process for producing an organosilicon compound comprises a reaction process of conducting alcohol exchange reaction of a silicon compound. SiY24 [wherein Y2 represents a siloxane-bond forming group] in 1-propanol to produce a composition; and a condensation process of adding a silicon compound R0Si(R1)nX23-n [wherein R0 represents a (meth)acryloyl group; and X2 represents a hydrolyzable group] to the composition to perform the hydrolysis copolycondensation of the silicon compounds under alkaline conditions.
    Type: Application
    Filed: April 14, 2009
    Publication date: March 24, 2011
    Applicant: TOAGOSEI CO., LTD.
    Inventors: Sayaka Ooike, Akinori Kitamura, Hiroshi Suzuki
  • Publication number: 20110054063
    Abstract: The object of the present invention is to provide an organosilicon compound having an oxetanyl group, which has a high proportion of an inorganic part in the structure, which, after production thereof, is stable with no gelling, and which has excellent storage stability when it is formed into a composition, and a production method thereof and a curable composition. The organosilicon compound is a compound having an oxetanyl group obtained by a method including a process in which a silicon compound A represented by the formula (1) and a silicon compound B having four siloxane bond-forming groups are subjected to hydrolysis and condensation at a ratio of 0.3 to 2.8 mol of silicon compound B based on 1 mol of silicon compound A.
    Type: Application
    Filed: January 9, 2009
    Publication date: March 3, 2011
    Applicant: Toagosei Co., LTD.
    Inventors: Sayaka Ooike, Hiroshi Suzuki, Akinori Kitamura