Patents by Inventor Sayangdev Naha

Sayangdev Naha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THERMAL ISOLATION MATERIAL AND METHODS OF MAKING AND USING THE SAME
    Publication number: 20170301968
    Abstract: The patent application relates generally to a thermal isolation material, more particularly to a thermal isolation material having at least an intumescent layer and a refractory layer. The intumescent and refractory layers are generally stacked on top of one other. The patent application also generally relates to a method of making the thermal isolation material that includes the steps of providing a substrate having opposing first and second sides, applying an intumescent material to the substrate and applying a refractory material to the substrate to form a thermal isolation material, where the one following can be true: (i) the intumescent material is applied on the first side and wherein the refractory material is applied on the second side; (ii) the intumescent material is positioned between the substrate and the refractory material and (ii) the refractory material is positioned between the substrate and the intumescent material.
    Type: Application
    Filed: March 29, 2017
    Publication date: October 19, 2017
    Applicant: ADA TECHNOLOGIES, INC.
    Inventors: Daniel Cooney, Stephen Cordova, Sayangdev Naha
  • Thermal interface materials and systems and devices containing the same
    Patent number: 9346991
    Abstract: This disclosure relates generally to thermally conductive polymer composites and particularly to thermal interface materials.
    Type: Grant
    Filed: April 16, 2012
    Date of Patent: May 24, 2016
    Assignee: ADA Technologies, Inc.
    Inventors: Steven C. Arzberger, Sayangdev Naha, Douglas Campbell
  • THERMAL INTERFACE MATERIALS AND SYSTEMS AND DEVICES CONTAINING THE SAME
    Publication number: 20120263940
    Abstract: This disclosure relates generally to thermally conductive polymer composites and particularly to thermal interface materials.
    Type: Application
    Filed: April 16, 2012
    Publication date: October 18, 2012
    Applicant: ADA TECHNOLOGIES, INC.
    Inventors: Steven C. Arzberger, Sayangdev Naha, Douglas Campbell