Abstract: A wireless server-to-server datacenter network architecture uses wireless links to eliminate the need for power-hungry switching fabric of traditional fat-tree based datacenter networks. The server-to-server wireless datacenter network (S2S-WiDCN) requires Line-of-Sight (LoS) between servers to establish direct communication links. Utilizing this LoS links, a horizontal-first routing algorithm is developed which, will establish fast communication links between any pair of communicating servers in the data center. The wireless links can be realized in millimeter-wave (such as 30, 60, 120 GHz) or THz (such as 300 GHz) frequency bands. The use of antenna-arrays to create beam-steering towards communicating servers is necessary to establish the direct server-to-server links. In the presence of an obstruction such as an IT technician, the LoS between communicating servers may be blocked. To address this issue, an obstruction-aware adaptive routing algorithm for the S2S-WiDCN is proposed.

Abstract: An apparatus includes an integrated circuit package and a heatsink. The integrated circuit package includes a substrate, an integrated circuit, a first plurality of signal conductors, and a second plurality of signal conductors. The substrate includes a first surface and a second surface opposite the first surface. The integrated circuit is coupled to the first surface of the substrate. The first plurality of signal conductors are arranged along a periphery of the first surface of the substrate. The second plurality of signal conductors are arranged along a periphery of the second surface of the substrate. The heatsink includes a first portion positioned along the first surface of the substrate and a second portion positioned along the second surface of the substrate.

Abstract: The techniques described herein relate to an apparatus including: a support structure of an integrated circuit device; and an elongated cavity formed in the support structure of the integrated circuit device, wherein an interior of the elongated cavity is plated with a conductive material separated into a first power connection portion and a first ground connection portion.

Abstract: A communication interconnect system is described. The system may include a co-packaged cables (CPC) tile with a slot formed from a first surface to slot surface at a first depth in the CPC tile and a plurality of channels formed between the slot surface and a second surface opposite the first surface. The system may also include a twinaxial cable with a pair of conductors positioned in the slot such that the pair of conductors are inserted in a pair of channels of the plurality of channels to establish an electrical connection between the twinaxial cable and the pair of channels. The system also includes a plurality of elastomer pins positioned in the plurality of channels adjacent to the second surface.

Abstract: Certain aspects of the present disclosure provide techniques for pinless interconnect for twinaxial cables to an IC. This includes a socket coupled to an integrated circuit (IC), a port structure coupled to the socket, and a ground connector inserted into the port structure. It further includes a twinaxial cable including a pair of conductors inserted through the ground connector to establish an electrical connection between the twinaxial cable and the IC.

Abstract: An apparatus includes a printed circuit board (PCB), and an integrated circuit (IC) package connected with the PCB. The IC package includes a package substrate, a die secured to the package substrate and including an integrated circuit, and a stiffener ring secured to the package substrate and surrounding so as to define a perimeter around the die. The stiffener ring increases a rigidity of the package substrate and delivers electrical power to the integrated circuit, where the stiffener ring includes a first conductive layer forming a power (PWR) plane for the integrated circuit, a second conductive layer forming a ground (GND) plane for the integrated circuit, and an insulating layer disposed between the first conductive layer and the second conductive layer.

Abstract: An apparatus includes an integrated circuit package and a heatsink. The integrated circuit package includes a substrate, an integrated circuit, a first plurality of signal conductors, and a second plurality of signal conductors. The substrate includes a first surface and a second surface opposite the first surface. The integrated circuit is coupled to the first surface of the substrate. The first plurality of signal conductors are arranged along a periphery of the first surface of the substrate. The second plurality of signal conductors are arranged along a periphery of the second surface of the substrate. The heatsink includes a first portion positioned along the first surface of the substrate and a second portion positioned along the second surface of the substrate.

Abstract: Certain aspects of the present disclosure provide techniques for pinless interconnect for twinaxial cables to an IC. This includes a socket coupled to an integrated circuit (IC), a port structure coupled to the socket, and a ground connector inserted into the port structure. It further includes a twinaxial cable including a pair of conductors inserted through the ground connector to establish an electrical connection between the twinaxial cable and the IC.

Abstract: A wireless server-to-server datacenter network architecture uses wireless links to eliminate the need for power-hungry switching fabric of traditional fat-tree based datacenter networks. The server-to-server wireless datacenter network (S2S-WiDCN) requires Line-of-Sight (LoS) between servers to establish direct communication links. Utilizing this LoS links, a horizontal-first routing algorithm is developed which, will establish fast communication links between any pair of communicating servers in the data center. The wireless links can be realized in millimeter-wave (such as 30, 60, 120 GHz) or THz (such as 300 GHz) frequency bands. The use of antenna-arrays to create beam-steering towards communicating servers is necessary to establish the direct server-to-server links. In the presence of an obstruction such as an IT technician, the LoS between communicating servers may be blocked. To address this issue, an obstruction-aware adaptive routing algorithm for the S2S-WiDCN is proposed.