Patents by Inventor Sayed Kaysarbin Rahim

Sayed Kaysarbin Rahim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10636768
    Abstract: Various embodiments of an integrated circuit module and a method of forming such module are disclosed. The module includes a first die having an active substrate, an integrated circuit disposed on a first major surface of the active substrate, and a cavity disposed in a second major surface of the active substrate. The module also includes a second die having a first major surface, a second major surface, and a conductive pad disposed on the second major surface. The second die is disposed at least partially within the cavity of the first die such that the first major surface of the second die faces the cavity of the first die.
    Type: Grant
    Filed: November 1, 2016
    Date of Patent: April 28, 2020
    Assignee: Starkey Laboratories, Inc.
    Inventors: Sayed Kaysarbin Rahim, Douglas F. Link, Susan Marie Johansson
  • Publication number: 20180122778
    Abstract: Various embodiments of an integrated circuit module and a method of forming such module are disclosed. The module includes a first die having an active substrate, an integrated circuit disposed on a first major surface of the active substrate, and a cavity disposed in a second major surface of the active substrate. The module also includes a second die having a first major surface, a second major surface, and a conductive pad disposed on the second major surface. The second die is disposed at least partially within the cavity of the first die such that the first major surface of the second die faces the cavity of the first die.
    Type: Application
    Filed: November 1, 2016
    Publication date: May 3, 2018
    Inventors: Sayed Kaysarbin Rahim, Douglas F. Link, Susan Marie Johansson