Abstract: By bonding a conductive first matching layer 14 to the acoustic radiation surface side, which is the bottom side, of a belt-shape piezoelectric element on both faces with electrodes provided, and using a dicing machine to form divided grooves 16, an array of piezoelectric elements 6, 6, . . . , 6 is formed in the element array direction. By deepening the divided grooves 16, generation of cross talk can be prevented, and by filling the portions of the divided grooves 16 not in contact with the piezoelectric elements 6 with a conductive adhesive 17, a reduction in strength due to formation of the divided grooves 16 can be prevented, and a common connection between the ground electrode 13b on the bottom surface of each piezoelectric element 6 and the conductive first matching layer 14 can be reliably secured.

Abstract: By bonding a conductive first matching layer 14 to the acoustic radiation surface side, which is the bottom side, of a belt-shape piezoelectric element on both faces with electrodes provided, and using a dicing machine to form divided grooves 16, an array of piezoelectric elements 6, 6, . . . , 6 is formed in the element array direction. By deepening the divided grooves 16, generation of cross talk can be prevented, and by filling the portions of the divided grooves 16 not in contact with the piezoelectric elements 6 with a conductive adhesive 17, a reduction in strength due to formation of the divided grooves 16 can be prevented, and a common connection between the ground electrode 13b on the bottom surface of each piezoelectric element 6 and the conductive first matching layer 14 can be reliably secured.

Abstract: By bonding a conductive first matching layer 14 to the acoustic radiation surface side, which is the bottom side, of a belt-shape piezoelectric element on both faces with electrodes provided, and using a dicing machine to form divided grooves 16, an array of piezoelectric elements 6, 6, . . . , 6 is formed in the element array direction. By deepening the divided grooves 16, generation of cross talk can be prevented, and by filling the portions of the divided grooves 16 not in contact with the piezoelectric elements 6 with a conductive adhesive 17, a reduction in strength due to formation of the divided grooves 16 can be prevented, and a common connection between the ground electrode 13b on the bottom surface of each piezoelectric element 6 and the conductive first matching layer 14 can be reliably secured.

Abstract: By bonding a conductive first matching layer 14 to the acoustic radiation surface side, which is the bottom side, of a belt-shape piezoelectric element on both faces with electrodes provided, and using a dicing machine to form divided grooves 16, an array of piezoelectric elements 6, 6, . . . , 6 is formed in the element array direction. By deepening the divided grooves 16, generation of cross talk can be prevented, and by filling the portions of the divided grooves 16 not in contact with the piezoelectric elements 6 with a conductive adhesive 17, a reduction in strength due to formation of the divided grooves 16 can be prevented, and a common connection between the ground electrode 13b on the bottom surface of each piezoelectric element 6 and the conductive first matching layer 14 can be reliably secured.