Patents by Inventor Sayuri Shimizu

Sayuri Shimizu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10400347
    Abstract: To provide a conductive member capable of suppressing an increase in contact resistance, and a production method therefor. To solve the problem by providing a conductive member having a Ni plating layer 3 on the surface of contact parts 2 provided on a substrate 1, an arithmetic average roughness Sa of the surface of the Ni plating layer 3 being 20 nm or more. In the Ni plating layer 3, the full width half maximum of a peak at the position of a Ni (200) plane in an x-ray diffraction diagram is preferably 0.6 or less, and an indentation hardness HIT of the Ni plating layer 3 is preferably 5000 n/mm2 or less.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: September 3, 2019
    Assignee: NIPPON LIGHT METAL COMPANY, LTD.
    Inventors: Yosuke Nishikawa, Sayuri Shimizu, Shinichiro Sumi
  • Publication number: 20180298510
    Abstract: [Problem] To provide a conductive member capable of suppressing an increase in contact resistance, and a production method therefor. [Solution] To solve the problem by providing a conductive member having a Ni plating layer 3 on the surface of contact parts 2 provided on a substrate 1, an arithmetic average roughness Sa of the surface of the Ni plating layer 3 being 20 nm or more. In the Ni plating layer 3, the full width half maximum of a peak at the position of a Ni (200) plane in an x-ray diffraction diagram is preferably 0.6 or less, and an indentation hardness HIT of the Ni plating layer 3 is preferably 5000 n/mm2 or less.
    Type: Application
    Filed: August 5, 2016
    Publication date: October 18, 2018
    Inventors: Yosuke NISHIKAWA, Sayuri SHIMIZU, Shinichiro SUMI
  • Publication number: 20150044493
    Abstract: Provided are: a method of anchoring Sn powder that allows a Sn coating layer exhibiting excellent adhesion property and excellent heat cycle property to be adhered to and deposited on a surface of an aluminum substrate by means of a cold spray process, which is low in device cost and is high in productivity; and an electrically-conductive aluminum member produced by the method. The method of anchoring Sn powder onto an aluminum substrate is a method of anchoring Sn powder onto a surface of an aluminum substrate including depositing and anchoring Sn powder to form a Sn coating layer on the surface of the aluminum substrate by means of a cold spray process, the method including spraying the Sn powder onto the aluminum substrate under spray conditions of an operating gas temperature of 60° C. or less, an operating gas pressure of 0.30 MPa or more, and a spray distance between a spray gun nozzle and the aluminum substrate of from 5 to 30 mm.
    Type: Application
    Filed: March 19, 2013
    Publication date: February 12, 2015
    Applicant: NIPPON LIGHT METAL COMPANY, LTD
    Inventors: Ryo Yoshida, Hisashi Hori, Yosuke Nishikawa, Sayuri Shimizu