Patents by Inventor Scot Conrady

Scot Conrady has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for high deposition rate solder electroplating on a microelectronic workpiece
    Patent number: 6669834
    Abstract: The present invention is directed to an improved electroplating method, chemistry, and apparatus for selectively depositing tin/lead solder bumps and other structures at a high deposition rate pursuant to manufacturing a microelectronic device from a workpiece, such as a semiconductor wafer. An apparatus for plating solder on a microelectronic workpiece in accordance with one aspect of the present invention comprises a reactor chamber containing an electroplating solution having free ions of tin and lead for plating onto the workpiece. A chemical delivery system is used to deliver the electroplating solution to the reactor chamber at a high flow rate. A workpiece support is used that includes a contact assembly for providing electroplating power to a surface at a side of the workpiece that is to be plated. The contact contacts the workpiece at a large plurality of discrete contact points that isolated from exposure to the electroplating solution.
    Type: Grant
    Filed: June 18, 2001
    Date of Patent: December 30, 2003
    Assignee: Semitool, Inc.
    Inventors: Robert W. Batz, Jr., Scot Conrady, Thomas L. Ritzdorf
  • Method, chemistry, and apparatus for high deposition rate solder electroplating on a microelectronic workpiece
    Publication number: 20020000378
    Abstract: The present invention is directed to an improved electroplating method, chemistry, and apparatus for selectively depositing tin/lead solder bumps and other structures at a high deposition rate pursuant to manufacturing a microelectronic device from a workpiece, such as a semiconductor wafer. An apparatus for plating solder on a microelectronic workpiece in accordance with one aspect of the present invention comprises a reactor chamber containing an electroplating solution having free ions of tin and lead for plating onto the workpiece. A chemical delivery system is used to deliver the electroplating solution to the reactor chamber at a high flow rate. A workpiece support is used that includes a contact assembly for providing electroplating power to a surface at a side of the workpiece that is to be plated. The contact contacts the workpiece at a large plurality of discrete contact points that isolated from exposure to the electroplating solution.
    Type: Application
    Filed: June 18, 2001
    Publication date: January 3, 2002
    Applicant: Semitool, Inc.
    Inventors: Robert W. Batz,, Scot Conrady, Thomas L. Ritzdorf
  • Apparatus for high deposition rate solder electroplating on a microelectronic workpiece
    Patent number: 6334937
    Abstract: The present invention is directed to an improved electroplating method, chemistry, and apparatus for selectively depositing tin/lead solder bumps and other structures at a high deposition rate pursuant to manufacturing a microelectronic device from a workpiece, such as a semiconductor wafer. An apparatus for plating solder on a microelectronic workpiece in accordance with one aspect of the present invention comprises a reactor chamber containing an electroplating solution having free ions of tin and lead for plating onto the workpiece. A chemical delivery system is used to deliver the electroplating solution to the reactor chamber at a high flow rate. A workpiece support is used that includes a contact assembly for providing electroplating power to a surface at a side of the workpiece that is to be plated. The contact contacts the workpiece at a large plurality of discrete contact points that isolated from exposure to the electroplating solution.
    Type: Grant
    Filed: August 31, 1999
    Date of Patent: January 1, 2002
    Assignee: Semitool, Inc.
    Inventors: Robert W. Batz, Jr., Scot Conrady, Thomas L. Ritzdorf