Abstract: Examples are disclosed that relate to computing systems having a common conductive pathway. One example provides a computing system comprising a power supply configured to output electrical power for delivery to one or more power nodes, and one or more power monitors configured to identify a power overload condition based on the power output by the power supply. The computing system further comprises a parent controller configured to, based at least on receiving an indication of the power overload condition, transmit an instruction to one or more child controllers that causes each child controller to effect a change in an operational state of a corresponding power node. The computing system also comprises a conductive pathway along which electrical power output from the power supply is transmitted for delivery to the one or more power nodes, and along which the instruction is transmitted to the one or more child controllers.

Abstract: Examples are disclosed that relate to computing systems having a common conductive pathway. One example provides a computing system comprising a power supply configured to output electrical power for delivery to one or more power nodes, and one or more power monitors configured to identify a power overload condition based on the power output by the power supply. The computing system further comprises a parent controller configured to, based at least on receiving an indication of the power overload condition, transmit an instruction to one or more child controllers that causes each child controller to effect a change in an operational state of a corresponding power node. The computing system also comprises a conductive pathway along which electrical power output from the power supply is transmitted for delivery to the one or more power nodes, and along which the instruction is transmitted to the one or more child controllers.

Abstract: Air quality inside a computing device is monitored utilizing an air quality monitor that can be sized to simulate a server computing device and can have multiple sensing equipment mounted inside, including equipment to detect corrosive aspects in the air and condensation sensing equipment to detect instances in which condensation can form on computing device hardware. Corrosion sensing can include metallic members that can be electrically coupled to voltage that can induce a current within the metallic members, thereby more accurately simulating the corrosion of operating PCBs. Condensation sensing can include condensation hosting members that can have a thermal mass that is approximately equal to the thermal mass of PCBs and can include heating elements by which the condensation hosting members can more accurately simulate the thermal effects and aspects of operating PCBs, and also moisture detectors, including electrical and optical moisture detectors. Additionally, an off-gassing chamber can be included.

Abstract: A rack acclimating device can accelerate the acclimation of an already assembled rack of computing equipment to an environment. A rack acclimating device can comprise one or more heating elements and an air moving device that can be oriented to move air across the heating elements and then through the rack of computing equipment. Additionally, the rack acclimating device can comprise a controller or other like computing device that can receive environmental sensor data and, based upon the received environmental sensor data, can control the heating elements and air moving device. Environmental sensor data can be received from environmental sensors, such as temperature and/or humidity sensors, which can be positioned to sense various environmental aspects. A rack acclimating device can also comprise a hood or other like structure to confine and direct the heated air from the heating elements and/or air moving device to the computer equipment rack.

Abstract: Air quality inside a computing device is monitored utilizing an air quality monitor that can be sized to simulate a server computing device and can have multiple sensing equipment mounted inside, including equipment to detect corrosive aspects in the air and condensation sensing equipment to detect instances in which condensation can form on computing device hardware. Corrosion sensing can include metallic members that can be electrically coupled to voltage that can induce a current within the metallic members, thereby more accurately simulating the corrosion of operating PCBs. Condensation sensing can include condensation hosting members that can have a thermal mass that is approximately equal to the thermal mass of PCBs and can include heating elements by which the condensation hosting members can more accurately simulate the thermal effects and aspects of operating PCBs, and also moisture detectors, including electrical and optical moisture detectors. Additionally, an off-gassing chamber can be included.