Patents by Inventor Scot Rose

Scot Rose has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ROOM TEMPERATURE METAL DIRECT BONDING
    Publication number: 20190115247
    Abstract: A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed.
    Type: Application
    Filed: November 21, 2018
    Publication date: April 18, 2019
    Inventors: Qin-Yi Tong, Paul M. Enquist, Anthony Scot Rose
  • Room temperature metal direct bonding
    Patent number: 10141218
    Abstract: A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed.
    Type: Grant
    Filed: December 4, 2015
    Date of Patent: November 27, 2018
    Assignee: INVENSAS BONDING TECHNOLOGIES, INC.
    Inventors: Qin-Yi Tong, Paul M. Enquist, Anthony Scot Rose
  • Room temperature metal direct bonding
    Patent number: 9385024
    Abstract: A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed.
    Type: Grant
    Filed: September 2, 2014
    Date of Patent: July 5, 2016
    Assignee: ZIPTRONIX, INC.
    Inventors: Qin-Yi Tong, Paul M. Enquist, Anthony Scot Rose
  • ROOM TEMPERATURE METAL DIRECT BONDING
    Publication number: 20140370658
    Abstract: A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed.
    Type: Application
    Filed: September 2, 2014
    Publication date: December 18, 2014
    Applicant: Ziptronix, Inc.
    Inventors: Qin-Yi TONG, Paul M. ENQUIST, Anthony Scot ROSE
  • ROOM TEMPERATURE METAL DIRECT BONDING
    Publication number: 20130233473
    Abstract: A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed.
    Type: Application
    Filed: April 22, 2013
    Publication date: September 12, 2013
    Applicant: Ziptronix, Inc.
    Inventors: Qin-yi Tong, Paul M. Enquist, Anthony Scot Rose
  • Room temperature metal direct bonding
    Patent number: 8524533
    Abstract: A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed.
    Type: Grant
    Filed: October 27, 2010
    Date of Patent: September 3, 2013
    Assignee: Ziptronix, Inc.
    Inventors: Qin-Yi Tong, Paul M. Enquist, Anthony Scot Rose
  • Room temperature metal direct bonding
    Patent number: 8426248
    Abstract: A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed.
    Type: Grant
    Filed: October 27, 2010
    Date of Patent: April 23, 2013
    Assignee: Ziptronix, Inc.
    Inventors: Qin-Yi Tong, Paul M. Enquist, Anthony Scot Rose
  • ROOM TEMPERATURE METAL DIRECT BONDING
    Publication number: 20110041329
    Abstract: A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed.
    Type: Application
    Filed: October 27, 2010
    Publication date: February 24, 2011
    Applicant: Ziptronix, Inc.
    Inventors: Qin-Yi Tong, Paul M. Enquist, Anthony Scot Rose
  • Room temperature metal direct bonding
    Patent number: 7842540
    Abstract: A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed.
    Type: Grant
    Filed: June 5, 2007
    Date of Patent: November 30, 2010
    Assignee: Ziptronix, Inc.
    Inventors: Qin-Yi Tong, Paul M. Enquist, Anthony Scot Rose
  • Method for opening a jammed or stuck door of a vehicle
    Patent number: 7640781
    Abstract: A rescue device and a method of using same, for opening a jammed or stuck door of a vehicle, including a door having battle latches.
    Type: Grant
    Filed: February 16, 2007
    Date of Patent: January 5, 2010
    Assignee: Ibis Tek, LLC
    Inventor: Scot Rose
  • Room temperature metal direct bonding
    Patent number: 7602070
    Abstract: A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed.
    Type: Grant
    Filed: March 22, 2005
    Date of Patent: October 13, 2009
    Assignee: Ziptronix, Inc.
    Inventors: Qin-Yi Tong, Paul M. Enquist, Anthony Scot Rose
  • Device and method for opening a jammed or stuck door of a vehicle
    Publication number: 20070220945
    Abstract: A rescue device and a method of using same, for opening a jammed or stuck door of a vehicle, including a door having battle latches.
    Type: Application
    Filed: February 16, 2007
    Publication date: September 27, 2007
    Inventor: Scot Rose
  • Method for room temperature metal direct bonding
    Patent number: 6962835
    Abstract: A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed.
    Type: Grant
    Filed: February 7, 2003
    Date of Patent: November 8, 2005
    Assignee: Ziptronix, Inc.
    Inventors: Qin-Yi Tong, Paul M. Enquist, Anthony Scot Rose
  • Room temperature metal direct bonding
    Publication number: 20040157407
    Abstract: A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed.
    Type: Application
    Filed: February 7, 2003
    Publication date: August 12, 2004
    Applicant: Ziptronix
    Inventors: Qin-Yi Tong, Paul M. Enquist, Anthony Scot Rose